| PART |
Description |
Maker |
| TB20.0 TA10.0 TG-226 TA1.0 TA15.0 TA2.0 TA5.0 TA7. |
; Features:Dual-Insulated with Polyurethane and Nylon Overcoating; Solderable RoHS Compliant: Yes
HIGH-ENERGY TRIGGERED SPARK GAPS
|
http://
Clare Inc
CLARE[Clare, Inc.]
Clare Inc
|
| CBC-EVAL-09 |
EnerChip Energy Processor for Energy Harvesting Applications
|
Cymbet Corporation
|
| 2N6324 2N6322 |
30 AMP NPN HIGH VOLTAGE / HIGH ENERGY 200 VOLTS
|
SSDI[Solid States Devices, Inc]
|
| ET250 ET70 ET150 |
Metal Composite Tubular type Non-Inductive Resistors for Ultra High Voltage, High Energy
|
Willow Technologies Limited
|
| ET150 |
Metal Composite Tubular type Non-Inductive Resistors for Ultra High Voltage, High Energy
|
Willow Technologies Ltd
|
| 2N6322 2N6324 |
200 V, 30 A NPN high voltage/high energy
|
Solid State Devices Inc
|
| PF102V500AF2B PF601V500AJ2B PF801V500AD2B PF901V50 |
55 垄陋C Photoflash, High-Energy, Long Life, 500 V, Aluminum
55 ?C Photoflash, High-Energy, Long Life, 500 V, Aluminum
|
Cornell Dubilier Electronics
|
| MCC3334 |
HIGH ENERGY IGNITION CIRCUIT
|
Motorola, Inc
|
| MCCF3334 |
HIGH ENERGY IGNITION CIRCUIT
|
Motorola
|
| MMFT2N25E |
High Energy Power FET
|
ON Semiconductor
|
| 93334G-S08-R 93334-15 |
HIGH ENERGY IGNITION CIRCUIT
|
Unisonic Technologies
|
| MCC3334 |
HIGH ENERGY IGNITION CIRCUIT
|
IXYS Corporation
|
