|
|
 |

Harwin PLC
|
Part No. |
D2864-01 D2808-21 D2824-21 D2922-01 D2808-01 D2818-01 D2820-01 D2832-21
|
Description |
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 64-way DIP24, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 8-way DIP48, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 24-way DIP24, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 22-way DIP22, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 8-way DIP48, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 18-way DIP18, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 20-way DIP40, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 32-way DIP32, IC SOCKET
|
File Size |
204.26K /
1 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Molex, Inc.
|
Part No. |
08-50-0113
|
Description |
Crimp Socket Contact; Wire Size (AWG):30-22; Contact Plating:Tin; Series:2759; Lead Pitch:2.54mm; Reel Quantity:10000; Voltage Rating:250V BRASS, TIN OVER NICKEL FINISH, WIRE TERMINAL
|
File Size |
144.65K /
2 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
87914-2216 0879142216
|
Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
87914-3616 0879143616
|
Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet
|
|

Price and Availability
|