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				Mitsubishi Electric, Corp. MITSUBISHI[Mitsubishi Electric Semiconductor] Mitsubishi Electric Corporation
Part No.	RA45H4047M RA45H4047M-01 RA45H4047M-E01
OCR Text	... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description	MITSUBISHI RF MOSFET MODULE 400-470MHz 45W 12.5V MOBILE RADIO 三菱射频MOSFET模块400 - 470MHz512.5V移动通信
File Size	91.54K / 9 Page	View it Online	Download Datasheet

				HITACHI[Hitachi Semiconductor]
Part No.	PF0030 PF0032
OCR Text	... possible. The module should be screwed up before lead soldering. It should not be given mechanical and thermal stress to lead and flange of the module. When the external parts (Isolator, Duplexer, etc.) of the module are changed, the elect...
Description	MOS FET Power Amplifier
File Size	59.96K / 19 Page	View it Online	Download Datasheet

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