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For pads Found Datasheets File :: 14902 Search Time::3.188ms
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				MIMIX[Mimix Broadband]
Part No.	XB1009-BD-000V XB1009-BD-EV1 XB1009-BD
OCR Text	...Metallization: Gold All DC Bond pads (except Vd3) are 0.100 x 0.100 (0.004 x 0.004). All RF Bond pads (and Vd3) are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: ...
Description	14.0-30.0 GHz GaAs MMIC Buffer Amplifier
File Size	269.39K / 7 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	STA2058EX STA2058
OCR Text	...o symbol V18 (2) V33 (7) Power pads VSS (10) AVSS AVDD V18BKP GPSCLK Clock & Reset CK CKOUT RSTINn A[23:0] D[15:0] WEn.[1:0] CSn.[3:0] RDn P0.[15:0] EMI Interface LFBGA144 ONLY STA2058 TESEO P1.[15:0] P2.[15:0] (LFBGA144 Only) nSTDBY...
Description	Teseo GPS Platform high-sensitivity baseband
File Size	242.52K / 20 Page	View it Online	Download Datasheet

				OSRAM GmbH
Part No.	SPLAH903
OCR Text	... 11 13 15 17 19 21 23 Solder pads 22 20 18 16 14 12 10 8 6 4 2 10 x 1.5 (0.059) 7.5 (0.295) o1.73 (0.068) 4.1 (0.161) Top view Bottom view 19.06 (0.750) 1.5 (0.059) 0.33 (0.013) 11 Solder pads 22 20 18 16 14 12 10 8 6...
Description	Nanostack Pulsed Laser Diode Array 75 W Peak Power
File Size	128.46K / 8 Page	View it Online	Download Datasheet

				Filtronic Compound Semicond... Filtronic Compound Semiconductors
Part No.	FMA3058-000-WP FMA3058
OCR Text	... Note: TAMBIENT = +25C, Z0 = 50 pads B and C open circuit DIFFERENT BIAS CONFIGURATIONS: The device has a default current, set by an on chip resistor. pads B and C can be bonded to ground to increase the device current by reducing the d...
Description	2-20 GHZ BROADBAND MMIC AMPLIFIER
File Size	163.00K / 6 Page	View it Online	Download Datasheet

				Hexawave, Inc
Part No.	HWC34NC HWC34NC-V1-15
OCR Text	...ckness: 100 5 Chip size 50 Bond pads 1-4 (Gate): 100 x 100 Bond pads 5-8 (Drain): 100 x 100 Bond pads 9-13(Source): 100 x 100 Electrical Specifications (TA=25C) f = 4 GHz for all RF Tests Symbol IDSS Parameters & Conditions Saturated Cu...
Description	C-Band Power Non-Via Hole Chip C-Band Power FET Non-Via Hole Chip
File Size	73.76K / 2 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	PB-CMM1100-BD-0000 CMM1100-BD0704 CMM1100-BD-000V
OCR Text	...Metallization: Gold All DC Bond pads are 0.080 x 0.080 (0.003 x 0.003). All RF Bond pads are 0.180 x 0.080 (0.007 x 0.003). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002)...
Description	2.0-18.0 GHz GaAs MMIC Low Noise Amplifier
File Size	208.41K / 5 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XA1000-BD-EV1 XA1000-BD-000V XA1000-BD
OCR Text	...de Metallization: Gold All Bond pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.28 mg. Bond Pad #1 (RF In) B...
Description	DC-18.0 GHz GaAs MMIC 5-Bit Digital Attenuator
File Size	360.20K / 6 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1005-BD-EV1 XP1005-BD-000V XP1005-BD
OCR Text	...Metallization: Gold All DC Bond pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002)....
Description	35.0-43.0 GHz GaAs MMIC Power Amplifier
File Size	278.07K / 7 Page	View it Online	Download Datasheet

				MIMIX BROADBAND INC
Part No.	XP1013-BD-EV1 XP1013-BD-000V XP1013-BD
OCR Text	...Metallization: Gold All DC Bond pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002)....
Description	17000 MHz - 26000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER 17.0-26.0 GHz GaAs MMIC Power Amplifier
File Size	462.45K / 7 Page	View it Online	Download Datasheet

For pads Found Datasheets File :: 14902 Search Time::3.188ms
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