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DALLAS[Dallas Semiconductor]
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| Part No. |
DS21FT40 21FT40
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| OCR Text |
MULTI-CHIP MODULE FEATURES
* * * * * Twelve (12) completely independent E1 Framers in one small 27 mm x 27 mm Package Each Multi-Chip Module (MCM) Contains Three DS21Q44 Quad E1 Framer Die Each Quad Framer can be concatenated into a Single... |
| Description |
From old datasheet system
Four x Three 12 Channel E1 Framer
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| File Size |
382.90K /
87 Page |
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SAMSUNG[Samsung semiconductor]
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| Part No. |
K5L5628JTM-DH18 K5L5628JBM K5L5628JBM-DH18 K5L5628JTM
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| OCR Text |
Multi-Chip Package MEMORY
Preliminary Preliminary MCP MEMORY
256M Bit (16M x16) Synchronous Burst , Multi Bank NOR Flash / 128M Bit(8M...die_rev0.3) (128M UtRAM M-die_rev0.1) Finalize <UtRAM> ....... rev 1.0 - Deleted Synchronous Burst R... |
| Description |
256M Bit (16M x16) Synchronous Burst , Multi Bank NOR Flash / 128M Bit(8M x16) Synchronous Burst UtRAM
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| File Size |
1,565.84K /
98 Page |
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it Online |
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SAMSUNG[Samsung semiconductor]
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| Part No. |
KBE00F005A-D411 KBE00F005A
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| OCR Text |
...Document Title
MCP MEMORY
Multi-Chip Package MEMORY 512M Bit(64Mx8) Nand Flash*2 / 256M Bit (2Mx32x4Banks) Mobile SDRAM*2
Revision ...Die _ Ver 0.1 - 512Mb Mobile SDRAM DDP F-Die _ Ver 1.0 <Common> - Changed operating temperature : pa... |
| Description |
512Mb NAND*2 256Mb Mobile SDRAM*2
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| File Size |
1,346.36K /
87 Page |
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it Online |
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SAMSUNG[Samsung semiconductor]
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| Part No. |
KBE00G003M-D411 KBE00G003M
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| OCR Text |
...BE00G003M-D411
Document Title
Multi-Chip Package MEMORY
MCP MEMORY
512M Bit(64Mx8) Nand Flash*2 / 256M Bit(8Mx8x4Banks) Mobile SDRAM...Die _ Ver 0.1 - 512Mb Mobile SDRAM DDP F-Die _ Ver 1.0 <Mobile SDRAM> .... Ver 1.1 - Corrected Errat... |
| Description |
NAND 512Mb*2 Mobile SDRAM 256Mb*2
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| File Size |
1,236.80K /
89 Page |
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SAMSUNG[Samsung semiconductor]
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| Part No. |
KBE00S009M-D411 KBE00S009M
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| OCR Text |
...Document Title
MCP MEMORY
Multi-Chip Package MEMORY 1G Bit (128Mx8) Nand Flash*2 / 256M Bit (4Mx16x4Banks) Mobile SDRAM*2
Revision No. History
0.0 Initial issue. - 2Gb NAND DDP M-Die_ Ver 0.0 - 512Mb M-SDR DDP F-Die_Ver 1.0 <Common>... |
| Description |
From old datasheet system
1Gb NAND x 2 256Mb Mobile SDRAM x 2
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| File Size |
1,891.88K /
86 Page |
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INFINEON[Infineon Technologies AG]
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| Part No. |
SLE66C321PEM5 SLE66C321PE SLE66C321PEC
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| OCR Text |
...ion from XRAM possible Enhanced multi-application support by 16 descriptors for system / application mode
Anti Snooping
* * * * * * * ...die size, orientation,...) Module specification package, etc. containing description of
Memory Se... |
| Description |
Security & Chip Card ICs
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| File Size |
57.47K /
8 Page |
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it Online |
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INFINEON[Infineon Technologies AG]
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| Part No. |
SLE66C681PEM5 SLE66C681PE SLE66C681PEC
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| OCR Text |
...ion from XRAM possible Enhanced multi-application support by 16 descriptors for system / application mode.
* * * * *
Automatic randomi...die size, orientation,...) Module specification package, etc. containing description of
Memory Se... |
| Description |
Security & Chip Card ICs
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| File Size |
58.06K /
8 Page |
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it Online |
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Price and Availability
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