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  LDM-0808-003W-X3 Datasheet PDF File

For LDM-0808-003W-X3 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Roithner LaserTechnik G...
Part No. LDM-0808-001W-X3 LDM-0808-002W-X3 LDM-0808-003W-X3 LDM-0808-500M-X2
Description High Power Infrared Laser Diode
File Size 666.62K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-108081650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    LDM-0808-500M-X2 LDM-0808-300M-X1 LDM-0808-CMOUNT-TO3 LDM-0808-001W-X3 LDM-0808-002W-X5 LDM-0808-002W-X3 LDM-0808-003W-X

Roithner LaserTechnik GmbH
Part No. LDM-0808-500M-X2 LDM-0808-300M-X1 LDM-0808-CMOUNT-TO3 LDM-0808-001W-X3 LDM-0808-002W-X5 LDM-0808-002W-X3 LDM-0808-003W-X3 LDM-0808-005W-X5
Description Solid-state Laser Pumping Medical Usage Target Designator Free-space Communication Infrared Light Sources
File Size 484.81K  /  4 Page

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Amphenol Communications Solutions
Part No. 54202-G0808LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    LDM-0808-500M-92

Roithner LaserTechnik GmbH
Part No. LDM-0808-500M-92
Description Solid-state Laser Pumping Medical Usage Target Designator Free-space Optical Communication
File Size 176.12K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-408081800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    LDM-0808-1000-93

Roithner LaserTechnik GmbH
Part No. LDM-0808-1000-93
Description CW Output Power: 1 W Typical 808 nm Emission Wavelength High-efficiency Quantum Well Structure TO5 Package
File Size 176.09K  /  3 Page

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Amphenol Communications Solutions
Part No. 54102-T08-08
Description 54102-T08-08-BERG 0.100
Tech specs 　 　

Official Product Page

    LDM-0808-300M-91

Roithner LaserTechnik GmbH
Part No. LDM-0808-300M-91
Description CW Output Power: 300mW Typical 808 nm Emission Wavelength High-deeiciency Quantum Well Structure TO5 Package
File Size 177.45K  /  3 Page

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Amphenol Communications Solutions
Part No. 54242-808080950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    V2003W

Assmann Electronics Inc.
Part No. V2003W
Description ASS 0850 HS
File Size 71.33K  /  1 Page

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Amphenol Communications Solutions
Part No. 94908-088LF
Description Modular Jack, Input Output Connectors, Cat 3 Single, Horizontal, Board Through Mount, Unshielded, 8 Positions, 1 Port
Tech specs 　 　

Official Product Page

    SR5003W-06 SR5003W-10 SR5003W-16

MicroPower Direct, LLC
Part No. SR5003W-06 SR5003W-10 SR5003W-16
Description Ultra-Miniature, SIP 50W, Wide Input Range POL Switching Regulator
File Size 231.05K  /  2 Page

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Amphenol Communications Solutions
Part No. 54112-408081150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Roithner LaserTechnik G...
Part No. LDM-1
Description LASERDIODENMODULE TYPE
File Size 23.37K  /  1 Page

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Amphenol Communications Solutions
Part No. 54112-108081200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Roithner LaserTechnik G...
Part No. LDM-375-10-TEC-M
Description ttl or analog modulation
File Size 133.87K  /  1 Page

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Amphenol Communications Solutions
Part No. 54122-108081300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    TE Connectivity Ltd
Part No. LDM-1000
Description LVDT/RVDT Signal Conditioning Module
File Size 133.36K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-806080800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For LDM-0808-003W-X3 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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