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  LDM-0808-001W-X3 Datasheet PDF File

For LDM-0808-001W-X3 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Roithner LaserTechnik G...
Part No. LDM-0808-001W-X3 LDM-0808-002W-X3 LDM-0808-003W-X3 LDM-0808-500M-X2
Description High Power Infrared Laser Diode
File Size 666.62K  /  4 Page

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Amphenol Communications Solutions
Part No. 54601-906001WPLF
Description Modular Jack, Input Output Connectors, Cat 3 Single Modular Jack, Horizontal, Board Through Mount, 6P2C, 1 Port
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    LDM-0808-500M-X2 LDM-0808-300M-X1 LDM-0808-CMOUNT-TO3 LDM-0808-001W-X3 LDM-0808-002W-X5 LDM-0808-002W-X3 LDM-0808-003W-X

Roithner LaserTechnik GmbH
Part No. LDM-0808-500M-X2 LDM-0808-300M-X1 LDM-0808-CMOUNT-TO3 LDM-0808-001W-X3 LDM-0808-002W-X5 LDM-0808-002W-X3 LDM-0808-003W-X3 LDM-0808-005W-X5
Description Solid-state Laser Pumping Medical Usage Target Designator Free-space Communication Infrared Light Sources
File Size 484.81K  /  4 Page

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Amphenol Communications Solutions
Part No. 54601-806001WPLF
Description RJ45 Modular Jack Connector, Input Output Connectors, CAT 3, Low Profile, 6P2C, Right Angle, Through Hole, without Shield, 1 Port.
Tech specs 　 　

Official Product Page

    LDM-0808-500M-92

Roithner LaserTechnik GmbH
Part No. LDM-0808-500M-92
Description Solid-state Laser Pumping Medical Usage Target Designator Free-space Optical Communication
File Size 176.12K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-108081650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    LDM-0808-1000-93

Roithner LaserTechnik GmbH
Part No. LDM-0808-1000-93
Description CW Output Power: 1 W Typical 808 nm Emission Wavelength High-efficiency Quantum Well Structure TO5 Package
File Size 176.09K  /  3 Page

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Amphenol Communications Solutions
Part No. 54202-G0808LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    LDM-0808-300M-91

Roithner LaserTechnik GmbH
Part No. LDM-0808-300M-91
Description CW Output Power: 300mW Typical 808 nm Emission Wavelength High-deeiciency Quantum Well Structure TO5 Package
File Size 177.45K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-408081800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    LDM-0980-300M-X2 LDM-0980-500M-X2 LDM-0980-CMOUNT-TO3 LDM-0980-001W-X3 LDM-0980-002W-X5

Roithner LaserTechnik GmbH
Roithner LaserTechnik G...
Part No. LDM-0980-300M-X2 LDM-0980-500M-X2 LDM-0980-CMOUNT-TO3 LDM-0980-001W-X3 LDM-0980-002W-X5
Description Pumping Medical Usage Infrared Sources for Night Viewing Information Recognition
File Size 175.40K  /  3 Page

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Amphenol Communications Solutions
Part No. 54102-T08-08
Description 54102-T08-08-BERG 0.100
Tech specs 　 　

Official Product Page

    NXP Semiconductors N.V.
Part No. SL1ICS3001W/N4D
Description I-CODE1 Label IC SPECIALTY CONSUMER CIRCUIT, UUC
File Size 343.06K  /  24 Page

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Amphenol Communications Solutions
Part No. 54242-808080950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Roithner LaserTechnik G...
Part No. LDM-1
Description LASERDIODENMODULE TYPE
File Size 23.37K  /  1 Page

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Amphenol Communications Solutions
Part No. 94908-088LF
Description Modular Jack, Input Output Connectors, Cat 3 Single, Horizontal, Board Through Mount, Unshielded, 8 Positions, 1 Port
Tech specs 　 　

Official Product Page

    Roithner LaserTechnik G...
Part No. LDM-375-10-TEC-M
Description ttl or analog modulation
File Size 133.87K  /  1 Page

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Amphenol Communications Solutions
Part No. 54112-408081150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    TE Connectivity Ltd
Part No. LDM-1000
Description LVDT/RVDT Signal Conditioning Module
File Size 133.36K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-108081200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For LDM-0808-001W-X3 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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