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  LA2-020-10000 Datasheet PDF File

For LA2-020-10000 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Rosenberger Hochfrequen...
Part No. LA2-020-10000 LA2-020-3000
Description    Cable assembly

File Size 150.34K  /  2 Page

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Amphenol Communications Solutions

Part No. 20021121-00008C8LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 8Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H510438D-UC/LA2 K4H510438D-UC/LB0
Description 512Mb D-die DDR SDRAM Specification

File Size 366.40K  /  24 Page

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Amphenol Communications Solutions

Part No. 20021121-00006C4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 6Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    VECTRON INTERNATIONAL
Part No. QF140.0-10000/06
Description 1 FUNCTIONS, 140 MHz, 50 kHz BW(delta f), CRYSTAL FILTER

File Size 40.23K  /  2 Page

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Amphenol Communications Solutions

Part No. 20021611-00006T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 6 contacts
Tech specs    

Official Product Page

    K4H2G0638A-UC/LA2 K4H2G0638A-UC/LB0 K4H2G0638A-UC/LB3 K4H2G0638A-UC/LCC

SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H2G0638A-UC/LA2 K4H2G0638A-UC/LB0 K4H2G0638A-UC/LB3 K4H2G0638A-UC/LCC
Description Stacked 2Gb A-die SDRAM Specification

File Size 346.63K  /  23 Page

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Amphenol Communications Solutions

Part No. 20021311-00008T4LF
Description 1.27mm (0.05in.) pitch, Receptacle Top entry, 8 contacts
Tech specs    

Official Product Page

    Vectron
Part No. QF10.7-10000/04
Description Monolithic Crystal Filter, Selected customer types

File Size 53.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 10060018-10000TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    K4H1G0638C-UC/LA2 K4H1G0738C-UC/LA2 K4H1G0738C-UC/LB0 K4H1G0638C-UC/LB0

SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H1G0638C-UC/LA2 K4H1G0738C-UC/LA2 K4H1G0738C-UC/LB0 K4H1G0638C-UC/LB0
Description Stacked 1Gb C-die DDR SDRAM Specification

File Size 341.52K  /  23 Page

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Amphenol Communications Solutions

Part No. 20021121-00004T4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 4Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H1G0738C-UC_LB0 K4H1G0638C K4H1G0638C-UC_LA2 K4H1G0638C-UC_LB0 K4H1G0738C-UC_LA2 K4H1G0638C-UC/LA2 K4H1G0638C-UC/LB0 K4H1G0738C-UC/LA2 K4H1G0738C-UC/LB0
Description Stacked 1Gb C-die DDR SDRAM Specification

File Size 336.97K  /  23 Page

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Amphenol Communications Solutions

Part No. 10018783-10000MLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    K4H510738E-TC/LAA K4H510738E-TC/LB0 K4H510738E-TC/LA2 K4H510638E-TC/LB0 K4H510638E-TC/LA2 K4H510638E-TC/LAA

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H510738E-TC/LAA K4H510738E-TC/LB0 K4H510738E-TC/LA2 K4H510638E-TC/LB0 K4H510638E-TC/LA2 K4H510638E-TC/LAA
Description Dual Wide Bandwidth High Output Drive Single Supply Op Amp 8-MSOP-PowerPAD -40 to 125 堆叠12Mb电子芯片DDR SDRAM内存规格(x4/x8
Dual Wide Bandwidth High Output Drive Single Supply Op Amp 8-SOIC -40 to 125
Stacked 512Mb E-die DDR SDRAM Specification (x4/x8)

File Size 192.75K  /  22 Page

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Amphenol Communications Solutions

Part No. 20021321-00008C1LF
Description Minitek127®, Board to Board connectors, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 8 Positions, 1.27mm (0.05inch) pitch
Tech specs    

Official Product Page

    K4H1G0838M-TC/LB0 K4H1G0838M-TC/LA2 K4H1G0838M-TC/LB3 K4H1G0438M-TC/LA2 K4H1G0438M-TC/LB0 K4H1G0438M-TC/LB3

SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H1G0838M-TC/LB0 K4H1G0838M-TC/LA2 K4H1G0838M-TC/LB3 K4H1G0438M-TC/LA2 K4H1G0438M-TC/LB0 K4H1G0438M-TC/LB3
Description DIODE ZENER DUAL COMMON-CATHODE 300mW 43Vz 5mA-Izt 0.0698 0.1uA-Ir 32 SOT-23 3K/REEL
1Gb M-die DDR SDRAM Specification

File Size 208.27K  /  23 Page

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Amphenol Communications Solutions

Part No. 51968-10000800AALF
Description PwrBlade®, Power Connectors, 8S Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H1G0838M-TC_LB3 K4H1G0438M K4H1G0438M-TC_LA2 K4H1G0438M-TC_LB0 K4H1G0438M-TC_LB3 K4H1G0838M-TC_LA2 K4H1G0838M-TC_LB0 K4H1G0438M-TC/LB0 K4H1G0838M-TC/LB0 K4H1G0438M-TC/LA2 K4H1G0438M-TC/LB3 K4H1G0838M-TC/LA2 K4H1G0838M-TC/LB3
Description 1Gb M-die DDR SDRAM Specification

File Size 203.73K  /  23 Page

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Amphenol Communications Solutions

Part No. 20021321-00008T1LF
Description Minitek127®, Board to Board connectors, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 8 Positions, 1.27mm (0.05inch) pitch
Tech specs    

Official Product Page

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