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Hynix Semiconductor, Inc.
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| Part No. |
HY27UG088G5M HY27UG088GDM HY27UG088GDM-UPEB HY27UG088G5M-TEB HY27UG088G5M-TPMB HY27UG088GDM-UPMB HY27UG088G5M-TPIB HY27UG088G5M-TPCB HY27UG088GDM-UPCB HY27UG088G5M-TCB HY27UG088G5M-TPEB HY27UG088G5M-TIP HY27UG088G5M-TIB HY27UG088G5M-TIS HY27UG088GDM-UPIB
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| Description |
8Gbit (1Gx8bit) NAND Flash
1G X 8 FLASH 3.3V PROM, 25 ns, PBGA52 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, ULGA-52
1G X 8 FLASH 3.3V PROM, 25 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, PLASTIC, TSOP1-48
1G X 8 FLASH 3.3V PROM, 25 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48
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| File Size |
349.43K /
50 Page |
 View
it Online |
Download Datasheet
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SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
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| Part No. |
K9F3208W0A-TCB0 K9F3208W0A-TIB0
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| Description |
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; Number of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; No. of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight 4米8位NAND闪存
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| File Size |
561.61K /
27 Page |
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it Online |
Download Datasheet |
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SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
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| Part No. |
K9F4008W0A-TCB0 K9F4008W0A-TIB0
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| Description |
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; No. of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight 12k × 8位NAND快闪记忆
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| File Size |
321.40K /
24 Page |
View
it Online |
Download Datasheet |
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