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2N5466 18124 G24064 M5321 EVM6435 EPR1051G CMDZ8 2SB1502S
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    LPC47M14O-NC LPC47M14H-NC LPC47M14J-NC LPC47M14K-NC LPC47M14Q-NC LPC47M14V-NC LPC47M14B-NC LPC47M148-NC LPC47M14A-NC LPC

SMSC Corporation
SMSC, Corp.
Part No. LPC47M14O-NC LPC47M14H-NC LPC47M14J-NC LPC47M14K-NC LPC47M14Q-NC LPC47M14V-NC LPC47M14B-NC LPC47M148-NC LPC47M14A-NC LPC47M14P-NC LPC47M14R-NC LPC47M14T-NC LPC47M14Z-NC LPC47M141-NC LPC47M143-NC LPC47M149-NC
Description    128 PIN enganced SUPER I/O CONTROLLER WITH AN LPC INTERFACE AND USB HUB
FIBER-SAFE KIT SCA-FS9500
4 PR 568B RJ45 STR UTP CASHD-ST54PVU-568B-BG-015
RESTR 1.50K 1 TOL 1/8W MF
HD VIEW RECEIVER 2 PORT DAISYCHAINABLE
AT PRINTER SERIAL CBL DB9 FEMALE - DB25 MALE
CAT5 AUDIO/VIDEO SPLITTER 128引脚enganced超级I / O与LPC接口和USB集线器控制器
128 PIN enganced SUPER I/O CONTROLLER WITH AN LPC INTERFACE AND USB HUB 128引脚enganced超级I / OLPC接口和USB集线器控制器
128 PIN enganced SUPER I/O CONTROLLER WITH AN LPC INTERFACE AND USB HUB 128引脚enganced超级I / O与LPC接口和USB集线器控制器

File Size 1,267.65K  /  205 Page

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    LPC47M13X

SMSC Corporation
Part No. LPC47M13X
Description 128 PIN enganced SUPER I/O CONTROLLER

File Size 909.76K  /  236 Page

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    SOT545-3

Philips Semiconductors
Part No. SOT545-3
Description plastic thermal enganced thin quad flat package

File Size 70.09K  /  1 Page

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    LPC47M141-NC LPC47M142-NC LPC47M145-NC LPC47M146-NC LPC47M147-NC LPC47M14A-NC LPC47M14D-NC LPC47M14G-NC LPC47M14H-NC LPC

SMSC[SMSC Corporation]
Part No. LPC47M141-NC LPC47M142-NC LPC47M145-NC LPC47M146-NC LPC47M147-NC LPC47M14A-NC LPC47M14D-NC LPC47M14G-NC LPC47M14H-NC LPC47M14J-NC LPC47M140-NC LPC47M144-NC LPC47M149-NC LPC47M14F-NC LPC47M14K-NC LPC47M14B-NC LPC47M143-NC LPC47M148-NC LPC47M14C-NC LPC47M14E-NC LPC47M14I-NC LPC47M14Z-NC LPC47M14M-NC LPC47M14N-NC LPC47M14O-NC LPC47M14P-NC LPC47M14Q-NC LPC47M14R-NC LPC47M14S-NC LPC47M14T-NC LPC47M14U-NC LPC47M14V-NC LPC47M14W-NC LPC47M14X LPC47M14X-NC LPC47M14Y-NC
Description 128 PIN enganced SUPER I/O CONTROLLER WITH AN LPC INTERFACE AND USB HUB

File Size 1,207.89K  /  205 Page

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    SOT545-3

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. SOT545-3
Description plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad

File Size 15.82K  /  1 Page

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    BCM1101

Electronic Theatre Controls, Inc.
ETC
Broadcom Corporation.
Part No. BCM1101
Description THE MOST HIGHLY INTEGRATED SILICON SOLUTION FOR FEATURE enganced VOICE OVER IP ENTERPRISE PHONES
Enterprise IP Phone Chip

File Size 108.56K  /  2 Page

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