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  die-80 Datasheet PDF File

For die-80 Found Datasheets File :: 26259    Search Time::1.36ms    
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    MAAPGM0030-DIE

Tyco Electronics
Part No. MAAPGM0030-DIE
OCR Text DIE MAAPGM0030-DIE Features 1 Watt Saturated Output Power Level Variable Drain Voltage (4-10V) Operation GaAs MSAG(R) Process Pro...80/20) 1-2 mil. preform solder. Limit time @ 300 C to less than 5 minutes. Wirebonding: Bond @ 160 C...
Description 5.0-9.0 GHz 1W Power Amplifier

File Size 265.69K  /  6 Page

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    HMC-ALH50810

Hittite Microwave Corporation
Part No. HMC-ALH50810
OCR Text ...o hm m atched i nput/ o utput die s ize: 3.2 x 1.6 x 0.1 mm electrical specifcations [1] , t a = +25 c vdd1=vdd2 = 2.1v, vdd3=2.4v, idd...80 82 84 86 88 90 return loss (db) frequency (ghz) -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 70 72 74 76...
Description GaAs HEMT LOW NOISE AMPLIFIER, 71 - 86 GHz

File Size 267.17K  /  6 Page

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    CREE
Part No. CPMF-1200-S080B
OCR Text die features ? industry leading r ds(on) ? high speed switching ? low capacitances ? easy to parallel ? simple to drive benefts ? high...80 m ? q g = 90.8 nc maximum ratings symbol parameter value unit test conditions note i d ...
Description Silicon Carbide MOSFET

File Size 803.48K  /  10 Page

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    霍尼韦尔
Part No. OD-148-C
OCR Text ...ader using silver epoxy as the die attach material. all sales are final after 60 days from the shipment date. opto diode must be notified ...80 1.55 30 17 0.5 0.5 1.9 mw nm nm volts volts pf m sec m sec electro-optical characteristics at...
Description 0.3556 mm, 1 ELEMENT, INFRARED LED, 880 nm TO-46

File Size 26.02K  /  3 Page

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    ULC0402FC36C ULC0402FC05C ULC0402FC12C ULC0402FC15C ULC0402FC24C ULC0402FC3.3C ULC0402FC33C ULC0402FC08C

PROTEC[Protek Devices]
Part No. ULC0402FC36C ULC0402FC05C ULC0402FC12C ULC0402FC15C ULC0402FC24C ULC0402FC3.3C ULC0402FC33C ULC0402FC08C
OCR Text ....001 0.016 NOM E F Metalized Die Contacts D END I NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Maximum chip size: 1.02 (0.040") by 0.51(0.020"). ...
Description UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

File Size 96.36K  /  5 Page

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    PROTEC[Protek Devices]
Part No. ULC0404FC36C ULC0404FC05C ULC0404FC08C ULC0404FC12C ULC0404FC15C ULC0404FC24C ULC0404FC3.3C ULC0404FC33C
OCR Text ...0.05mm ( 0.002"). E F Metalized Die Contacts END I MOUNTING PAD LA YOUT - Option 1 D PAD DIMENSIONS DIM A C D E F G H I NOTE: C A MILLIMETERS 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.012 0.018 0.0...
Description UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

File Size 109.29K  /  6 Page

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    FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. RMWT11001
OCR Text ...thstanding 325C for 15 minutes. Die attachment should utilize Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF ground. These ...
Description 11/33 GHz Tripler
11-33 GHz Tripler MMIC

File Size 118.89K  /  7 Page

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    International Light Technologies, Inc.
Part No. OS-LM10A-W1
OCR Text ...nische gr??en beziehen sich auf die einzel-led und stammen aus dem led-datenblatt. wellenl?ngen bzw. farbkoor- dinaten werden mit einer stromeinpr?gedauer von 25 ms und einer genauigkeit von +/- 1 nm bzw. +/-0.01 ermittelt. light measuremen...
Description SINGLE COLOR DISPLAY CLUSTER, WHITE

File Size 56.88K  /  8 Page

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    PROTEC[Protek Devices]
Part No. ULC0406FC36C ULC0406FC05C ULC0406FC08C ULC0406FC12C ULC0406FC15C ULC0406FC24C ULC0406FC3.3C ULC0406FC33C
OCR Text ...0.05mm ( 0.002"). E F Metalized Die Contacts END I MOUNTING PAD LA YOUT - Option 1 DIM C A D A C D E F G H I NOTE: PAD DIMENSIONS MILLIMETERS 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.012 0.018 0.008 0.006 SQ ...
Description UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

File Size 113.01K  /  6 Page

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    PROTEC[Protek Devices]
Part No. ULC0408FC36C ULC0408FC05C ULC0408FC08C ULC0408FC12C ULC0408FC15C ULC0408FC24C ULC0408FC3.3C ULC0408FC33C
OCR Text ...0.05mm ( 0.002"). E F Metalized Die Contact END I MOUNTING PAD LA YOUT - Option 1 DIM D C A DIE SOLDER CONTACT PAD DIMENSIONS MILLIMETERS 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.012 0.018 0.008 0.006 SQ 0.02...
Description UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

File Size 116.10K  /  6 Page

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For die-80 Found Datasheets File :: 26259    Search Time::1.36ms    
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