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  bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 147    Search Time::6.047ms    
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    SiGe Semiconductor, Inc...
SIGE[SiGe Semiconductor, Inc.]
SiGe Semiconductor Inc.
Part No. SE1000W
OCR Text ...ansimpedance Amplifier Final bondpad Diagram VCC2 1 10 VCC1 VCC1 2 Top View 9 TZ_IN 3 8 OUTN OUTP 4 VEE2 5 ACGND 6 VEE1 7 VEE1 bondpad Description Pad No. 1 2 3 4 5 6 7 8 9 10 Name VCC2 VCC1 TZ_IN VE...
Description LightChargerTM155 Mb/s Transimpedance Amplifier Final

File Size 114.19K  /  9 Page

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    SE1031W SE103

SIGE[SiGe Semiconductor Inc.]
SIGE[SiGe Semiconductor, Inc.]
Part No. SE1031W SE103
OCR Text ...impedance Amplifier LP Final bondpad Diagram VCC 1 10 VCC Top View 9 TZ_IN 2 8 OUTN OUTP 3 4 5 6 7 VEE2 VEE1 VEE1 VEE1 VCC bondpad Description Pad No. 1 2 3 4 5 6 7 8 9 10 Name VCC TZ_IN ...
Description LightCharger?/a> 2.5 Gb/s Transimpedance Amplifier LP Final
LightCharger 2.5 Gb/s Transimpedance Amplifier LP Final
LightCharger⑩ 2.5 Gb/s Transimpedance Amplifier LP Final

File Size 79.89K  /  7 Page

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    SE1050W

SIGE[SiGe Semiconductor, Inc.]
SIGE[SiGe Semiconductor Inc.]
Part No. SE1050W
OCR Text ...ansimpedance Amplifier Final bondpad Diagram GND 2 TZ_IN 3 GND 1 ACGND 13 12 OUTP 1 11 OUTN Top View 4 GND 5 GND 6 GND 7 VCC1 8 VCC1 9 VCC2 10 VCC2 bondpad Description Pad No. 1 2 3 4 5 6 7 8...
Description LightCharger⑩ 10 Gb/s Transimpedance Amplifier Final
LightCharger 10 Gb/s Transimpedance Amplifier Final

File Size 132.54K  /  11 Page

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    SE1000W

SiGe Semiconductor, Inc.
Part No. SE1000W
OCR Text ... Transimpedance Amplifier Final bondpad Diagram VCC2 VCC1 1 2 10 VCC1 Top View 9 TZ_IN 3 8 OUTN OUTP 4 VEE2 5 ACGND 6 VEE1 7 VEE1 bondpad Description Pad No. 1 2 3 4 5 6 7 8 9 10 Name VCC2 VCC1 TZ_IN VEE2 ACG...
Description Amplifier, Light Charger 155 Mb/s Transimpedance Amplifier

File Size 224.51K  /  9 Page

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    SiGe Semiconductor Inc.
SIGE[SiGe Semiconductor, Inc.]
Part No. SE1030W SE103
OCR Text ...ansimpedance Amplifier Final bondpad Diagram VCC 1 11 VCC DNC 2 Top View 10 TZ_IN 3 9 OUTN OUTP 4 5 6 7 8 VEE2 VEE1 VEE1 VEE1 VCC bondpad Description Pad No. 1 2 3 4 5 6 7 8 9 10 11...
Description LightCharger?/a> 2.5 Gb/s Transimpedance Amplifier Final
LightCharger2.5 Gb/s Transimpedance Amplifier Final
LightCharger 2.5 Gb/s Transimpedance Amplifier LP Final
LightCharger 2.5 Gb/s Transimpedance Amplifier Final
LightCharger⑩ 2.5 Gb/s Transimpedance Amplifier Final

File Size 101.35K  /  9 Page

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    SiGe Semiconductor, Inc...
SiGe Semiconductor Inc.
SIGE[SiGe Semiconductor, Inc.]
Part No. SE1020W SE1020
OCR Text ...ce Amplifier Product Preview bondpad Diagram VCC 1 10 VCC Top View 9 TZ_IN 2 8 OUTN OUTP 3 VEE2 4 VEE1 5 VEE1 6 VEE1 7 VCC bondpad Description Pad No. 1 2 3 4 5 6 7 8 9 10 Name VCC TZ_IN VEE2 VEE1 VEE1 ...
Description 1.25 Gb/s Transimpedance Amplifier Product Preview
Amplifier, 1.25Gb/s Transimpedance Amplifier

File Size 141.78K  /  7 Page

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    SiGe Semiconductor Inc.
SIGE[SiGe Semiconductor, Inc.]
Part No. SE1010W
OCR Text ...ansimpedance Amplifier Final bondpad Diagram VCC2 1 10 VCC1 VCC1 2 Top View 9 TZ_IN 3 8 OUTN OUTP 4 VEE2 5 ACGND 6 VEE1 7 VEE1 bondpad Description Pad No. 1 2 3 4 5 6 7 8 9 10 Name VCC2 VCC1 TZ_IN VE...
Description LightChargerTM 622 Mb/s Transimpedance Amplifier Final

File Size 114.08K  /  9 Page

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    MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D

Philips Semiconductors
Part No. MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D
OCR Text ......... 3 5 chip orientation and bondpad locations ................................ ........................... 4 6 electrical specifications ................................ ................................ ....................... 5 6.1 abs...
Description Standard Card IC Specification B>bumped sawn wafer on UV-tape

File Size 33.19K  /  7 Page

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For bondpad Found Datasheets File :: 147    Search Time::6.047ms    
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