|
|
 |
Amphenol Communications Solutions |
Part No. |
54242-111202300LF
|
Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 20 Positions
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54121-112021300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54121-407031300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54121-808121300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54242-107321300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 32 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54122-119341300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
|
Part No. |
AM80A-024L-065F27 AM80A-300L-280F09 AM80A-320L-280F09 AM80A-150L-065F33 AM80A-300L-150F16 AM80A-048L-033F50 AM80A-048L-012F60 AM80A-300L-240F10 AM80A-300L-065F33 AM80A-300L-050F40 AM80A-300L-033F50 AM80A-048L-050F40 AM80A-048L-240F10 AM80A-048L-022F60 AM80A-048L-150F16
|
Description |
10NS, SOIC, COM TEMP(EPLD) 20NS, TSSOP, IND TEMP(EPLD) 12NS, PLCC, COM TEMP(EPLD) Analog IC 20NS, SOIC, COM TEMP(EPLD) 10NS, SOIC, IND TEMP(EPLD) 20NS, TSSOP, COM TEMP(EPLD) 20NS, PLCC, IND TEMP(EPLD) 15NS, TSSOP, IND TEMP(EPLD) 15NS, PDIP, IND TEMP(EPLD) 7NS, PLCC, IND TEMP(EPLD) 10NS, TSSOP, IND TEMP, GREEN(EPLD) 5NS, PLCC, COM TEMP(EPLD)
|
File Size |
1,132.88K /
2 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54122-408081300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54122-807281300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 28 position, 2.54mm (0.100in) pitch
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54112-109041300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54112-111102300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|

Bom2Buy.com

Price and Availability
|