A-70567-0265 pdf Datasheet P1 Part Num --- IC-ON-LINE

Amphenol Communications Solutions

Part No.

54122-416102650LF

Description

BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch

Tech specs

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A-70567-0265 Datasheet PDF File

For A-70567-0265 Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Analog Devices, Inc.
Part No.	AD10265AZ AD10265/PCB
Description	Dual Channel, 12-Bit, 65 MSPS A/D Converter with Analog Input Signal Conditioning Circular Connector; No. of Contacts:10; Series:LJTPQ00R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:13; Circular Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle Dual Channel/ 12-Bit/ 65 MSPS A/D Converter with Analog Input Signal Conditioning
File Size	271.59K / 18 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	70567-0018
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
File Size	1,218.45K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0019
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating
File Size	1,218.42K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0020
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating
File Size	1,218.41K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0021
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating
File Size	1,218.42K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0022
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating
File Size	1,218.42K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	70567-0125
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
File Size	1,211.75K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	70567-0120
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
File Size	1,211.71K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0279
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
File Size	1,218.38K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	70567-0013 A-70567-0013 15-80-0301
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
File Size	1,218.41K / 7 Page	View it Online	Download Datasheet

For A-70567-0265 Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |