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  A-70567-0150 Datasheet PDF File

For A-70567-0150 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    A-70567-0363 15-80-1501 0015801501

Molex Electronics Ltd.
Part No. A-70567-0363 15-80-1501 0015801501
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Rochester Electronics LLC

Part No. AM27C010-150DI
Description AM27C010 - CMOS EPROM 1 Megabit (128K x 8)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    15-80-0325 A-70567-0150 0015800325

Molex Electronics Ltd.
Part No. 15-80-0325 A-70567-0150 0015800325
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Amphenol Cables on Demand

Part No. CO-058BNCX200-150
Description Amphenol CO-058BNCX200-150 BNC Male to BNC Male (RG58) 50 Ohm Coaxial Cable Assembly 150ft
Tech specs    

Official Product Page

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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Amphenol Communications Solutions

Part No. 10078995-G01-50ULF
Description Minitek®, Wire to Board Connectors, Shrouded Header with STD Eject Latch - Surface Mount - Double row - 50 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 98401-801-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions

Part No. 77313-801-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 50 Positions
Tech specs    

Official Product Page

    A-70567-0021

Molex Electronics Ltd.
Part No. A-70567-0021
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 61083-201509LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    A-70567-0022

Molex Electronics Ltd.
Part No. A-70567-0022
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 61082-101500LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 100 Positions.
Tech specs    

Official Product Page

    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 61082-101502LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 100 Positions.
Tech specs    

Official Product Page

    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,211.71K  /  7 Page

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Amphenol Communications Solutions

Part No. 98401-101-50
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

File Size 1,211.75K  /  7 Page

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Amphenol Communications Solutions

Part No. 10150865-101LF
Description AirMAX VSe®, Backplane Connectors, 3-Pair, 6 Column, 54-Position, 2.0mm, , Right Angle Header, Press-Fit
Tech specs    

Official Product Page

For A-70567-0150 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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