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  A-70475-1124 Datasheet PDF File

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    14-44-2505 A-70475-1124

Molex Electronics Ltd.
Part No. 14-44-2505 A-70475-1124
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.76μm (30μ) Gold (Au), 5 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.76μm (30μ) Gold (Au), 5 Circuits
Molex Electronics Ltd.

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Rochester Electronics LLC

Part No. 54ACT11245JT/B
Description 54ACT11245 - Bus Transceiver
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70475-1144

Molex Electronics Ltd.
Part No. A-70475-1144
Description Molex Electronics Ltd.

File Size 139.29K  /  2 Page

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Rochester Electronics LLC

Part No. 54ACT11240JT/B
Description 54ACT11240 - Octal Buffers/Drivers
Tech specs    

Official Product Page

    70475-0259 A-70475-0259

Molex Electronics Ltd.
Part No. 70475-0259 A-70475-0259
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 15 Circuits

File Size 152.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-415161000LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 16 Positions
Tech specs    

Official Product Page

    A-70475-0260

Molex Electronics Ltd.
Part No. A-70475-0260
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 16 Circuits

File Size 152.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-415281000LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 28 Positions
Tech specs    

Official Product Page

    A-70475-0263

Molex Electronics Ltd.
Part No. A-70475-0263
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 19 Circuits

File Size 152.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-406261000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70475-0253

Molex Electronics Ltd.
Part No. A-70475-0253
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 9 Circuits

File Size 143.83K  /  2 Page

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Amphenol Communications Solutions

Part No. 61124-251CACLF
Description Assembly, Top Mount, D/D(136Pins), VTB, Type 123, 5mm s/o, 9.5mm Eject Travel
Tech specs    

Official Product Page

    70475-0254 A-70475-0254

Molex Electronics Ltd.
Part No. 70475-0254 A-70475-0254
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 10 Circuits

File Size 152.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-408081150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70475-0262

Molex Electronics Ltd.
Part No. A-70475-0262
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 18 Circuits

File Size 143.83K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-112401850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70475-0261

Molex Electronics Ltd.
Part No. A-70475-0261
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly

File Size 143.83K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-112402500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70475-0257

Molex Electronics Ltd.
Part No. A-70475-0257
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 13 Circuits

File Size 152.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-411401200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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