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  90143-0016 Datasheet PDF File

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    90143-0016 90143-0018

Molex Electronics Ltd.
Part No. 90143-0016 90143-0018
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 16 Circuits
2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 18 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
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HUA FENG CIRCUIT





    90143-0014

Molex Electronics Ltd.
Part No. 90143-0014
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 14 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs 　 　

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    ACTR0016 ACTR0016_916.5_QCC8C ACTR0016/916.5/QCC8C

Advanced Crystal Technology
Part No. ACTR0016 ACTR0016_916.5_QCC8C ACTR0016/916.5/QCC8C
Description true one-port, surface-acoustic-wave (SAW) resonator
File Size 59.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

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    ACTF0016 ACTF0016_916.5_QCC8C ACTF0016/916.5/QCC8C

Advanced Crystal Technology
Part No. ACTF0016 ACTF0016_916.5_QCC8C ACTF0016/916.5/QCC8C
Description low-loss, compact, and economical surface-acoustic-wave (SAW)
File Size 77.62K  /  3 Page

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Amphenol Communications Solutions
Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0050

Molex Electronics Ltd.
Part No. 90143-0050
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 50 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0010

Molex Electronics Ltd.
Part No. 90143-0010
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 10 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs 　 　

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    90143-0008

Molex Electronics Ltd.
Part No. 90143-0008
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 8 Circuits
File Size 250.10K  /  2 Page

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Renesas Electronics Corporation
Part No. R7S910016CBG#AC0
Description Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip
Tech specs 　 　

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    90143-0012

Molex Electronics Ltd.
Part No. 90143-0012
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 12 Circuits
File Size 250.10K  /  2 Page

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Renesas Electronics Corporation
Part No. 8001601CA
Description 3.2 Microsecond Sample and Hold Amplifiers
Tech specs 　 　

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    90143-0020

Molex Electronics Ltd.
Part No. 90143-0020
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 20 Circuits
File Size 250.10K  /  2 Page

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Renesas Electronics Corporation
Part No. HSP50016JC-52
Description Digital Down Converter
Tech specs 　 　

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    90143-0022

Molex Electronics Ltd.
Part No. 90143-0022
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 22 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 20021444-00016T4LF
Description Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 16 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs 　 　

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