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  9.40mm Datasheet PDF File

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    MACOM[Tyco Electronics]
Part No. MAAPGM0042-DIE
OCR Text ... 1.736mm. VDD 0.0940mm 0.940mm. OUT IN 0.239mm. 0 VGG 2.846mm. 0 Chip edge to bond pad dimensions are shown to the center of the bond pad. Figure 5. Die Layout 1.480mm. Bond Pad Dimensions Pad RF In an...
Description 1.2W X/Ku-Band Power Amplifier 11.5-16.0 GHz
File Size 420.43K  /  6 Page

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