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  87914-4201 Datasheet PDF File

For 87914-4201 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0879142016

Molex Electronics Ltd.
Part No. 0879142016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 20 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87914-4201 0879144201

Molex Electronics Ltd.
Part No. 87914-4201 0879144201
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free

File Size 759.73K  /  11 Page

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Amphenol Communications Solutions

Part No. 54201-G0807ALF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-0806

Molex Electronics Ltd.
Part No. 87914-0806
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.80K  /  11 Page

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Amphenol Communications Solutions

Part No. 63784-2015LF
Description Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 8 Row, Press-Fit, 96 Position, Select Load, Extended
Tech specs    

Official Product Page

    87914-1016

Molex Electronics Ltd.
Part No. 87914-1016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Amphenol Communications Solutions

Part No. 54201-S0807LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-4616

Molex Electronics Ltd.
Part No. 87914-4616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 46 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.74K  /  48 Page

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Amphenol Communications Solutions

Part No. 54201-G0810LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-1616

Molex Electronics Ltd.
Part No. 87914-1616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 55444-201LF
Description 5 Row, 120 Posn Signal Header, Straight, Solder-to-Board
Tech specs    

Official Product Page

    87914-4016

Molex Electronics Ltd.
Part No. 87914-4016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 54201-T3017LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-1816

Molex Electronics Ltd.
Part No. 87914-1816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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Amphenol Communications Solutions

Part No. 10123420-101LF
Description AirMax VS2®, Backplane Connectors, 3-Pair, 54 -position, 2mm pitch, 6 column, 4 Walls, Right Angle Receptacle, small press-fit.
Tech specs    

Official Product Page

    87914-4216

Molex Electronics Ltd.
Part No. 87914-4216
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 54201-T0808LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-1416

Molex Electronics Ltd.
Part No. 87914-1416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Amphenol Communications Solutions

Part No. 10093084-2010LF
Description QSFP+ Cable Assembly, 30 AWG, 1.0ms, passive, non-halogen free
Tech specs    

Official Product Page

For 87914-4201 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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