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  87914-3435 Datasheet PDF File

For 87914-3435 Found Datasheets File :: 100+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |   

    0879143435 87914-3435

Molex Electronics Ltd.
Part No. 0879143435 87914-3435
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 3,776.94K  /  48 Page

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Amphenol Communications Solutions

Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87914-1416

Molex Electronics Ltd.
Part No. 87914-1416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Amphenol Communications Solutions

Part No. 68653-435HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

    87914-0807

Molex Electronics Ltd.
Part No. 87914-0807
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging

File Size 3,776.34K  /  48 Page

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Amphenol Communications Solutions

Part No. 68023-435HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, RightAngle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail.
Tech specs    

Official Product Page

    87914-4616

Molex Electronics Ltd.
Part No. 87914-4616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 46 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.74K  /  48 Page

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Amphenol Communications Solutions

Part No. 89883-435LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Top Entry, Double row , 70 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87914-1816

Molex Electronics Ltd.
Part No. 87914-1816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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Amphenol Communications Solutions

Part No. 94063-435HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 35 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-0806

Molex Electronics Ltd.
Part No. 87914-0806
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.80K  /  11 Page

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Amphenol Communications Solutions

Part No. 69173-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
Tech specs    

Official Product Page

    87914-4216

Molex Electronics Ltd.
Part No. 87914-4216
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 68033-435HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    87914-4016

Molex Electronics Ltd.
Part No. 87914-4016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 68683-435LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 70 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87914-1616

Molex Electronics Ltd.
Part No. 87914-1616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Texas Instruments

Part No. DLPC3435CZEZ
Description DLP&#174; Display Controller for DLP2010 (0.2 WVGA) DMD 201-NFBGA -30 to 85
Tech specs    

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Official Product Page

    87914-1016

Molex Electronics Ltd.
Part No. 87914-1016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Texas Instruments

Part No. LM3435SQ/NOPB
Description Compact Sequential Mode RGB LED Driver with IC Control Interface 40-WQFN -40 to 125
Tech specs    

Get Free Sample

Official Product Page

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