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Cooper Bussmann, Inc.
Data Delay Devices, Inc.
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| Part No. |
TR/3216FF-1.5A TR1/3216FF-1.5A SP/3216FF-1.5A TR/3216FF-4.5A TR1/3216FF-4.5A SP/3216FF-4.5A SP/3216FF-375MA SP/3216FF-500MA SP/3216FF-750MA TR/3216FF-750MA TR/3216FF-1A TR/3216FF-500MA TR/3216FF-250MA SP/3216FF-2A SP/3216FF-4A TR/3216FF-2.5A 3216FF-3A
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| Description |
FAST BLOW ELECTRIC FUSE, 2A, 32VAC, 63VDC, 50A (IR), SURFACE MOUNT
Fuse 保险
FAST BLOW ELECTRIC FUSE, 3A, 32VAC, 63VDC, 50A (IR), SURFACE MOUNT
FAST BLOW ELECTRIC FUSE, 0.75A, 32VAC, 63VDC, 50A (IR), SURFACE MOUNT
FAST BLOW ELECTRIC FUSE, 2.5A, 32VAC, 63VDC, 50A (IR), SURFACE MOUNT
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| File Size |
54.85K /
2 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143216 87914-3216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
75160-132-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,16 position, 2.54mm pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-132-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
85832-160LF
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| Description |
Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body, 2 Mod.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86832-162HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
85832-164LF
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| Description |
5 Row Signal Header, Straight, Press-Fit, Wide body, 2 Mod
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86832-160HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 60 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-1816
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-3216-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69133-216HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-832-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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