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Molex Electronics Ltd.
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| Part No. |
87911-1811 0879111811
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 18 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.87K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-8118-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-5211
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 52 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-8118-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137926-1811LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 18 Positions, GW Compatible LCP, Tape and Reel with cap.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-6211
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 62 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10132450-1811GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68418-114HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-811262300LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 26 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-811-36LF
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| Description |
BERGSTIK
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137925-1811LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 18 Positions, GW Compatible LCP, Tape and Reel. .
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137924-1811LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and Hold Down Header, Tin plating, Black Color, 18 Positions, GW Compatible LCP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131318-1811100LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, Non GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Price and Availability
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