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Molex Electronics Ltd.
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| Part No. |
87891-0606
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
V62/10606-01XE
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| Description |
Enhanced Product Quad Channel, 3/1, 1Mbps, Digital Isolator 16-SOIC -55 to 125
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| Tech specs |
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Get Free Sample |
Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-0106
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Vertical, 1 Circuit, 2.50 渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Vertical, 1 Circuit, 2.50 μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
LMZ30606RKGR
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| Description |
2.95V to 6V, 6A Step-Down Power Module in 9x11x2.8mm QFN Package 39-B1QFN -40 to 85
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-0306
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
V62/20606-01EX
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| Description |
Enhanced product, low-power, analog temperature sensor
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-0408
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Vertical, 4 Circuit, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Vertical, 4 Circuit, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
287.76K /
5 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
V62/20606-01EX-T
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| Description |
Enhanced product, low-power, analog temperature sensor
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-4006
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
JM38510/50606BRA
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| Description |
Low-Power High-Performance Impact PAL Circuits 20-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-1817
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50渭m (100渭) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50μm (100μ) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
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| File Size |
287.95K /
5 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
M38510/50606BRA
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| Description |
Low-Power High-Performance Impact PAL Circuits 20-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-1818
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38渭m (15渭) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
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| File Size |
287.95K /
5 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
LMZ30606RKGT
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| Description |
2.95V to 6V, 6A Step-Down Power Module in 9x11x2.8mm QFN Package 39-B1QFN -40 to 85
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| Tech specs |
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Get Free Sample |
Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-2817 0878912817
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| Description |
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50渭m (100渭 Tape on Reel Packaging, Lead-free
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50μm (100μ Tape on Reel Packaging, Lead-free
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| File Size |
287.95K /
5 Page |
View
it Online |
Download Datasheet |
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Coilcraft Inc |
| Part No. |
XAL6060-682MEC
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| Description |
General Purpose Inductor, 6.8uH, 20%, 1 Element, Composite-Core, SMD, 2526, CHIP, 2526
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-4003 0878914003
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 0.254渭m (10渭) Gold (Au) Selective Plating, Bag Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 0.254μm (10μ) Gold (Au) Selective Plating, Bag Packaging, Lead-free
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| File Size |
759.02K /
10 Page |
View
it Online |
Download Datasheet |
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Coilcraft Inc |
| Part No. |
XAL6060-682MEB
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| Description |
General Purpose Inductor, 6.8uH, 20%, 1 Element, Composite-Core, SMD, 2526, CHIP, 2526
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-0601 0878910601
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 0.025渭m (1渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 6 Circuits, 0.025μm (1μ) Gold (Au) Plating, Tray Packaging, Lead-free
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| File Size |
759.15K /
10 Page |
View
it Online |
Download Datasheet |
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Coilcraft Inc |
| Part No. |
XEL6060-682MEB
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| Description |
General Purpose Inductor,
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| Tech specs |
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Official Product Page
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