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  71764-0112 Datasheet PDF File

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    0717640112 71764-0112

Molex Electronics Ltd.
Part No. 0717640112 71764-0112
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 10112684-T01-12ULF
Description Unshrouded Right Angle Headers - Surface Mount - Single row - 12 Positions - 2.00mm (0.079in)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0114

Molex Electronics Ltd.
Part No. 71764-0114
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. G832MC011201122HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 3.7 mm, 120 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    71764-0026

Molex Electronics Ltd.
Part No. 71764-0026
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 10112690-T01-12ULF
Description Header, Surface Mount, Double row, 24, 2mm (0.079in), Right Angle
Tech specs    

Official Product Page

    71764-0226

Molex Electronics Ltd.
Part No. 71764-0226
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 10112684-G01-12ULF
Description Unshrouded Right Angle Headers - Surface Mount - Single row - 12 Positions - 2.00mm (0.079in)
Tech specs    

Official Product Page

    71764-0024

Molex Electronics Ltd.
Part No. 71764-0024
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10112690-G01-12ULF
Description Header, Surface Mount, Double row, 24, 2mm (0.079in), Right Angle
Tech specs    

Official Product Page

    71764-0022

Molex Electronics Ltd.
Part No. 71764-0022
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10112684-F01-12ULF
Description Unshrouded Right Angle Headers - Surface Mount - Single row - 12 Positions - 2.00mm (0.079in)
Tech specs    

Official Product Page

    71764-0104

Molex Electronics Ltd.
Part No. 71764-0104
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.22K  /  5 Page

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Amphenol Communications Solutions

Part No. 10112690-F01-12ULF
Description Minitek® 2.00mm, Board to Board, Unshrouded Right Angle Header, Surface Mount, Double Row, 24 Position, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    71764-0106

Molex Electronics Ltd.
Part No. 71764-0106
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. 10112684-G03-09ULF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Surface Mount - Single row - 9 Positions - 2mm (0.079inch) - Horizontal
Tech specs    

Official Product Page

    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 10112690-T03-19ULF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Surface Mount - Double row - 38 Positions - 2mm (0.079inch) - Horizontal
Tech specs    

Official Product Page

    71764-0020

Molex Electronics Ltd.
Part No. 71764-0020
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating

File Size 121.14K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-801-12LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

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