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Amphenol Communications Solutions |
| Part No. |
68692-210HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68692-214H
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68692-212HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68692-214HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
MSP430FR69221IPMR
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| Description |
MSP430FR69221 16 MHz Ultra-Low-Power MCU featuring 64 KB FRAM, 2 KB SRAM, 52 IO, ADC12, LCD, AES 64-LQFP -40 to 85
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
MSP430FR69221IRGCT
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| Description |
MSP430FR69221 16 MHz Ultra-Low-Power MCU featuring 64 KB FRAM, 2 KB SRAM, 52 IO, ADC12, LCD, AES 64-VQFN -40 to 85
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| Tech specs |
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Official Product Page
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Price and Availability
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