| |
|
 |
Amphenol Communications Solutions |
| Part No. |
68464-462HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd. http://
|
| Part No. |
0736446216 73644-6216
|
| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits
|
| File Size |
182.38K /
4 Page |
View
it Online |
Download Datasheet
|
| |
|
 |

Molex Electronics Ltd. http://
|
| Part No. |
0736446217 73644-6217
|
| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position N/A, 144 Circuits 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position N/A, 144 Circuits
|
| File Size |
179.64K /
4 Page |
View
it Online |
Download Datasheet
|
|

Bom2Buy.com

Price and Availability
|