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  26-8000-170 Datasheet PDF File

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    26-8000-100-TE 26-8000-110-TE 26-8000-120-TE 26-8000-130-TE 26-8000-140-TE 26-7702-110-TE 26-7702-150-TE 26-7702-160-TE

JDS Uniphase Corporation
Part No. 26-8000-100-TE 26-8000-110-TE 26-8000-120-TE 26-8000-130-TE 26-8000-140-TE 26-7702-110-TE 26-7702-150-TE 26-7702-160-TE 26-7402-110-TE 26-8000-180-TE 26-8000-150-TE 26-8000-160-TE 26-8000-170-TE
Description Up to 180 mW Fiber Bragg Grating Stabilized 980 nm Pump Modules with Tight Tracking
File Size 261.47K  /  6 Page

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Amphenol Communications Solutions
Part No. CE1408000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 4 power pins, 80 signal pins, Vertical
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    26-8000-100 26-8000-110 26-8000-120 26-8000-130 26-8000-140 26-7702-160 26-7402-110 26-8000-180 26-8000-150 26-8000-160

JDS Uniphase Corporation
Part No. 26-8000-100 26-8000-110 26-8000-120 26-8000-130 26-8000-140 26-7702-160 26-7402-110 26-8000-180 26-8000-150 26-8000-160 26-8000-170
Description Up to 180 mW Fiber Bragg Grating Stabilized 980 nm Pump Modules
File Size 261.74K  /  6 Page

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Amphenol Communications Solutions
Part No. 68000-220HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

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    MITEQ, Inc.
MITEQ INC
Part No. PD4-950/1700-200S PD4-1225/1275-50N PD2-1400/2300-200S PD4-2000/4000-100N PD2-4000/8000-100S
Description 950 MHz - 1700 MHz RF/MICROWAVE SPLITTER, 0.5 dB INSERTION LOSS
12250 MHz - 12750 MHz RF/MICROWAVE SPLITTER, 0.75 dB INSERTION LOSS
1400 MHz - 2300 MHz RF/MICROWAVE SPLITTER, 0.2 dB INSERTION LOSS
2000 MHz - 4000 MHz RF/MICROWAVE SPLITTER, 0.5 dB INSERTION LOSS
4000 MHz - 8000 MHz RF/MICROWAVE SPLITTER, 0.25 dB INSERTION LOSS
File Size 78.39K  /  4 Page

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Amphenol Communications Solutions
Part No. 68000-203HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    MITEQ, Inc.
Part No. PD8-4000/8000-30S
Description 4000 MHz - 8000 MHz RF/MICROWAVE SPLITTER, 0.8 dB INSERTION LOSS
File Size 12.54K  /  1 Page

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Amphenol Communications Solutions
Part No. 51763-10800000CBLF
Description PwrBlade®, Power Connectors, 8P Right Angle Receptacle, Press Fit
Tech specs 　 　

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    SEMIKRON[Semikron International]
Part No. SI-E8000_3600-1.8 SI-E8000-3600-1.8 SI-E8000/3600-1.8
Description High voltage rectifiers
File Size 98.75K  /  2 Page

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Amphenol Communications Solutions
Part No. 68000-122HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

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    SI-E8000 SI-E8000-4 SI-E8000/3600-4

http://
Diotec Semiconductor
Part No. SI-E8000 SI-E8000-4 SI-E8000/3600-4
Description High Voltage Silicon Rectifier Diodes
File Size 185.46K  /  2 Page

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Amphenol Communications Solutions
Part No. 68000-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

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    Rochester Electronics, LLC
Part No. AM27C512-170/BUA AM27C512-170/BXA AM27C512-175JC AM27C512-175LCB AM27C512-170LCB AM27C512-305JC AM27C512-205DC AM27C512-205DCB AM27C512-205PC AM27C512-170PC AM27C512-175DC AM27C512-305LC
Description x8 EPROM x8存储
600mA, 1.2MHz Micropower Synchronous Boost Converters in ThinSOT; Package: SOT; No of Pins: 6; Temperature Range: -40&deg;C to 125&deg;C x8存储
File Size 996.30K  /  17 Page

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Amphenol Communications Solutions
Part No. 65780-007LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Single Row, 7 Position ,2.54mm (0.100in) Pitch.
Tech specs 　 　

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    QMB320-60-24 QMB320-60_24 QMB340-110_50 QMB370-170_77 QMB330-80_38 QMB360-140_70 QMB350-125_57 QMB350-125/57 QMB330-80/3

Productwell Precision Elect.CO.,LTD
http://
Part No. QMB320-60-24 QMB320-60_24 QMB340-110_50 QMB370-170_77 QMB330-80_38 QMB360-140_70 QMB350-125_57 QMB350-125/57 QMB330-80/38 QMB370-170/77 QMB340-110/50 QMB360-140/70 QMB320-60/24
Description MOLDED PARTS
File Size 490.50K  /  1 Page

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Amphenol Communications Solutions
Part No. 68000-411HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

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    ERNI Electronics
Part No. 101703480001
Description    F 2,54 SRC-A, 6-polig
File Size 34.47K  /  1 Page

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Amphenol Communications Solutions
Part No. 68000-126H
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch
Tech specs 　 　

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    ERNI Electronics
Part No. 101702780001
Description    F 2,54 DRC-B, 10-polig
File Size 71.28K  /  1 Page

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Amphenol Communications Solutions
Part No. 47388-000LF
Description 3.18mm (0.125inch) Centerline Crimp-to-Wire Receptacle
Tech specs 　 　

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