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  1162 Datasheet PDF File

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Part No. 1162
Description From old datasheet system

File Size 41.13K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. 1162
Description Optoelectronic

File Size 63.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    CEP-1162

CUI INC,
Part No. CEP-1162
Description piezo audio transducer

File Size 231.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    015-91-1162

Molex Electronics Ltd.
Part No. 015-91-1162
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    22-03-1162 3022-16B

Molex Electronics Ltd.
Part No. 22-03-1162 3022-16B
Description 2.5mm B-To-B Hdr SR VerB 16Ckt

File Size 101.45K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

   
Part No. 11621.123.011
Description BRASS, TIN FINISH, WIRE TERMINAL

File Size 29.56K  /  1 Page

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Amphenol Communications Solutions

Part No. 50332-1162HLF
Description High Pin Count, Backplane Connectors, Receptacle, Vertical, Through Hole, 3 Row, 162 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

   
Part No. 11625.123.011
Description BRASS, TIN FINISH, PCB TERMINAL

File Size 34.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 68021-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    45985-1162

Molex Electronics Ltd.
Part No. 45985-1162
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Header, Right Angle,10 Power Contacts, 32 Signal Contacts, Select Gold (Au) Plating, for 2.36mm (.093) Thick PC Board

File Size 480.58K  /  7 Page

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Amphenol Communications Solutions

Part No. 10106116-2002401LF
Description PwrBlade+® , Power Connectors, 2ACP+8S STB, Right Angle, Header.
Tech specs    

Official Product Page

    45984-1162

Molex Electronics Ltd.
Part No. 45984-1162
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 10 Power

File Size 451.77K  /  7 Page

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Amphenol Communications Solutions

Part No. 54122-811162000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    90572-1162

Molex Electronics Ltd.
Part No. 90572-1162
Description 2.54mm (.100) Pitch QF-50 Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.76 μm Gold (Au)

File Size 208.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4116-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

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Part: 11627-31
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