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  11-17-2140 Datasheet PDF File

For 11-17-2140 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    15-91-2140

Molex Electronics Ltd.
Part No. 15-91-2140
Description 2.54mm Pitch C-Grid Header

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-407031500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    11-17-2140

Molex Electronics Ltd.
Part No. 11-17-2140
Description Punch Spacer

File Size 25.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-407061300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Renesas Technology / Hitachi Semiconductor
Part No. HD6432160BVTE H8S/2140BF-ZTAT H8S/2141BF-ZTAT H8S/2145BF-ZTAT H8S/2148BF-ZTAT
Description Hitachi 16-Bit Single-Chip Microcomputer

File Size 4,220.42K  /  829 Page

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Amphenol Communications Solutions

Part No. 54121-403060950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    WAN-2140

Level One
Part No. WAN-2140
Description 14dBi Directional

File Size 764.15K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-403031000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    RFP-2140-39-27N

RFHIC
Part No. RFP-2140-39-27N
Description HPA Module

File Size 528.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 68021-402HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    PRECI-DIP SA
Part No. 2140.937-61.112-050 2140.934-61.112-050
Description MOTOR DC OHNE GETRIEBE 12V
MOTOR DC OHNE GETRIEBE 24V 电机传动装置24V的直流OHNE

File Size 104.73K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-408081800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    19800-2140

Molex Electronics Ltd.
Part No. 19800-2140
Description ATP Crimp Dies for the Tape Crimp Module and ATP-101 & 301 Press

File Size 47.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-121402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
Tech specs    

Official Product Page

    2140R 2140T

RFHIC
Part No. 2140R 2140T
Description LNA Module

File Size 145.81K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-402030800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    CHIP
Part No. CP2140
Description 4-Channel Low-Dropout Constant-Current Parallel LED Driver

File Size 105.71K  /  2 Page

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Amphenol Communications Solutions

Part No. 10147614-121406LF
Description BergStak HS™ 0.80mm,Board-to-Board Connector, Header, 120 Position
Tech specs    

Official Product Page

    882140

Molex Electronics Ltd.
Part No. 882140
Description 5.08mm Pitch, Beau Eurostyle Low Profile

File Size 28.13K  /  1 Page

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Amphenol Communications Solutions

Part No. 79821-404HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 4 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

For 11-17-2140 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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