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Renesas Electronics Corporation |
| Part No. |
HN58W241000FPIE
|
| Description |
EEPROM, SOP(8), /
|
| Tech specs |
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|
Official Product Page
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| |
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|
Renesas Electronics Corporation |
| Part No. |
DA7280-00FV2
|
| Description |
Low Power High-Definition Haptic Driver for Next Generation Human Machine Interfaces
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| Tech specs |
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|
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Official Product Page
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|
|
Renesas Electronics Corporation |
| Part No. |
M61000FP
|
| Description |
ICs for Camera
|
| Tech specs |
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|
|
Official Product Page
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| |
|
|
Renesas Electronics Corporation |
| Part No. |
DA14531-00000FX2
|
| Description |
SmartBond™ Ultra-Low Power Bluetooth® 5.1 System-on-Chip
|
| Tech specs |
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|
|
Official Product Page
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| |
|
|
Mitsubishi Electric Corporation
POWEREX[Powerex Power Semiconductors]
|
| Part No. |
FG2000FX-50DA
|
| Description |
MITSUBISHI GATE TURN-OFF THYRISTORS HIGH POWER INVERTER USE PRESS PACK TYPE
|
| File Size |
73.48K /
4 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
DA7280-00FVC
|
| Description |
Low Power High-Definition Haptic Driver for Next Generation Human Machine Interfaces
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Mitsubishi Electric, Corp.
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| Part No. |
FG2000FX-50DA
|
| Description |
HIGH POWER INVERTER USE PRESS PACK TYPE 大功率逆变器使用的新闻包装
|
| File Size |
68.29K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Renesas Electronics Corporation |
| Part No. |
RYZ014A000FZ00#HD0
|
| Description |
LTE Cat-M1 Cellular IoT Module
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
DA14530-00FXDB-P
|
| Description |
SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
DA16200-00000F22
|
| Description |
Ultra-Low Power Wi-Fi SoC for Battery-Powered IoT Devices
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
DA14530-00FXDEVKT-P
|
| Description |
SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
|
|
JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 000-6181-37R |
| Maker: N/A |
| Pack: N/A |
| Stock: 300057 |
| Unit price
for : |
|
50: $2.07 |
|
100: $1.96 |
| 1000:
$1.86 |
|
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