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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 130 Search Time::1.313ms
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				MACOM[Tyco Electronics]
Part No.	MASW2000
OCR Text	...be used but is not required. bondpad Dimensions Inches (mm) RF:0.004 x 0.004 (0.100 x 0.100) RF1, RF2:0.009 x 0.009 (0.225 x 0.225) A1, A2, B1, B2:0.004 x 0.004 (0.100 x 0.100) GND1, GND2:0.009 x 0.004 (0.225 x 0.105) RL1, RL2:0.004 x 0....
Description	GaAs SPDT Switch DC - 3 GHz
File Size	108.98K / 2 Page	View it Online	Download Datasheet

				MA-Com MACOM[Tyco Electronics]
Part No.	MASW20000
OCR Text	...035 x 0.004 (2.10 x 0.89x 0.10) bondpad Dimensions Inches (mm) RF, RF1, RF2: 0.004 x 0.004 (0.100 x 0.100) 0.004 x 0.004 (0.100 x 0.100) A1, A2, B1, B2: Wire Bonding A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Gold ri...
Description	DC-20 GHz GaAs SPDT switch GaAs SPDT Switch DC - 20 GHz
File Size	86.61K / 2 Page	View it Online	Download Datasheet

				Microchip Technology, Inc. Amphenol, Corp. MicrochipTechnology Microchip Technology Inc. MICROCHIP[Microchip Technology]
Part No.	24C02SC 24C02SC-S 24C02SC-S08 24C02SC-W 24C02SC-W08 24C02SC-WF 24C02SC-WF08 24C01SC 24C01SC-S 24C01SC-S08 24C01SC-W 24C02 24C01SC-W08 24C01SC-WF 24C01SC-WF08 21C02SC 21C01SC
OCR Text	...lectrically Erasable PROMs with bondpad positions optimized for smart card applications. The devices are organized as a single block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. The 24C01SC and 24C02SC also have pa...
Description	24C01C-P 24C01C-IP 24C01C-EP 24C01C-SN 24C01C-ISN 24C01C-ESN 24C01C-ST 24C01C-IST 24C01C-EST 24C01C24C01C的IP 24C01C -内啡24C01C24C01C，无法真正传24C01C - ESN24C01C ST24C01C -北京时间24C01C -学报 24C01C-P 24C01C-IP 24C01C-EP 24C01C-SN 24C01C-ISN 24C01C-ESN 24C01C-ST 24C01C-IST 24C01C-EST 24C01C4C01C的IP 24C01C -内啡4C01C4C01C，无法真正传4C01C - ESN4C01C ST4C01C -北京时间24C01C -学报 1K 5.0V IIC serial EEPROMs for smart card(1K5.0V,ISO7816标准,EEPROM) 2K 5.0V IIC serial EEPROMs for smart card(2K5.0V,ISO7816标准,EEPROM) 1K/2K 5.0V I2C Serial EEPROMs for Smart Cards 24C01C-P24C01C-IP24C01C-EP24C01C-SN24C01C-ISN24C01C-ESN24C01C-ST24C01C-IST24C01C-EST
File Size	78.52K / 12 Page	View it Online	Download Datasheet

				Microchip
Part No.	24C02SC-WF08 24C01SC-WF08
OCR Text	...lectrically Erasable PROMs with bondpad positions optimized for smart card applications. The devices are organized as a single block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. The 24C01SC and 24C02SC also have pa...
Description	24C01C-P24C01C-IP24C01C-EP24C01C-SN24C01C-ISN24C01C-ESN24C01C-ST24C01C-IST24C01C-EST
File Size	83.65K / 13 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC152
OCR Text	...SPACED AT 0.150 (0.006) CENTERS bondpad METALLIZATION: GOLD BACKSIDE METALLIZATION: GOLD A5 A4 A3 A2 A1 (0.0050) (0.0050) 0.127 0.127 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-33...
Description	PHASE COMPENSATED VARIABLE GAIN AMPLIFIER 2.5 - 5.0 GHz
File Size	133.71K / 4 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX1887EEE
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 86 x 91 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 mil. Sq. SiO2 Wa...
Description	120 SAN GABRIEL DR. SUNNYVALE, CA 94086
File Size	46.28K / 8 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX3971AUGP
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 43 x 52 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Au None Metal1: 1.2; Metal2: 1.2; Metal3: 1.2; Metal4: 5.6 microns (as drawn) ...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	57.25K / 7 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX1644EAE
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 121 x 132 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 m...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	134.25K / 8 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX6605MXK
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 31 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Si None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq....
Description	RELIABILITY REPORT FOR PLASTIC ENCAPSULATED DEVICES
File Size	86.09K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	HT1MOA3S30 HT1MOA3S30_E_1 HT1MOA3S30_E_3
OCR Text	...verall Thickness Film Thickness bondpad Size for Transponder Coil / Module Interconnection 0.45 mm 0.03 mm 0.16 mm 0.005 mm 1.9 x 3.5 mm Suitable for Welding/Soldering/ Conductive Gluing see also drawing in chapter 3 2.2 Materials Tap...
Description	HITAGTM1 Chip Module
File Size	148.86K / 24 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 130 Search Time::1.313ms
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