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  1162 Datasheet PDF File

For 1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    UJA1162TK

NXP Semiconductors
Part No. UJA1162TK
Description Self-supplied high-speed CAN transceiver with Sleep mode

File Size 364.10K  /  28 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    2SA116203 2SA1162

Toshiba Semiconductor
Part No. 2SA116203 2SA1162
Description Transistor Silicon PNP Epitaxial Type (PCT process) Audio Frequency General Purpose Amplifier Applications

File Size 100.80K  /  3 Page

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Amphenol Communications Solutions

Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    2SA116208

Galaxy Semi-Conductor Holdings Limited
Part No. 2SA116208
Description Silicon Epitaxial Planar Transistor

File Size 228.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    LB11620GP

Sanyo Semicon Device
Part No. LB11620GP
Description Monolithic Digital IC Brushless Motor Driver

File Size 197.64K  /  13 Page

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Amphenol Communications Solutions

Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    2SA116207 2SA1162

Toshiba Semiconductor
Part No. 2SA116207 2SA1162
Description Audio Frequency General Purpose Amplifier Applications

File Size 386.13K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    PCP1101 ENA1162

Sanyo Semicon Device
Part No. PCP1101 ENA1162
Description PNP Epitaxial Planar Silicon Transistor High-Voltage Switching Applications

File Size 51.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 50332-1162HLF
Description High Pin Count, Backplane Connectors, Receptacle, Vertical, Through Hole, 3 Row, 162 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    U1600 U1163A U1164A U1162A

Agilent(Hewlett-Packard)
Agilent(Hewlett-Packard...
Part No. U1600 U1163A U1164A U1162A
Description U1600 Series Handheld Digital Oscilloscopes

File Size 1,832.75K  /  11 Page

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Amphenol Communications Solutions

Part No. 68021-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    2SD2127 E001162

TOSHIBA[Toshiba Semiconductor]
Part No. 2SD2127 E001162
Description From old datasheet system
SWITCHING APPLICATIONS LAMP, SOLENOID DRIVE APPLICATIONS
NPN EPITAXIAL TYPE (SWITCHIN, LAMP, SOLENOID DRIVE APPLICATIONS)

File Size 224.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 10106116-2002401LF
Description PwrBlade+® , Power Connectors, 2ACP+8S STB, Right Angle, Header.
Tech specs    

Official Product Page

    2SK1163 2SK1164 2SK1161 2SK1162

HITACHI[Hitachi Semiconductor]
Part No. 2SK1163 2SK1164 2SK1161 2SK1162
Description Silicon N-Channel MOS FET

File Size 33.64K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-811162000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    2SA1162-YTE85LF

Toshiba Semiconductor
Part No. 2SA1162-YTE85LF
Description Audio Frequency General Purpose Amplifier Applications

File Size 167.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-4116-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

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Part: 11627-31
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