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MACOM[Tyco Electronics]
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| Part No. |
MAATGM0001-DIE
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| OCR Text |
DIE
RO-P-DS-3043 B Preliminary Information
6 Bit Attenuator Range 35dB Coverage, LSB = 0.56dB TTL Control Inputs MSAGTM MESFET Process...80/20) 1-2 mil. preform solder. Limit time @ 300 C to less than 5 minutes. Wirebonding: Bond @ 160 C... |
| Description |
DC-6.0 GHz Attenuator
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| File Size |
330.01K /
7 Page |
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it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MAPCGM0002-DIE
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| OCR Text |
DIE
RO-P-DS-3050 A Preliminary Information
Features
6 Bit Phase Shifter 360 Coverage, LSB = 5.6 TTL Control Inputs MSAGTM Proc...80
Relative Phase Shift ()
-120 -160 -200 -240 -280 -320 -360 -400 3.5 4.0 4.5 5.0 5.5 6.0
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| Description |
3.5-6.0 GHz Phase Shifter
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| File Size |
297.78K /
7 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MASWGM0002-DIE
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| OCR Text |
DIE
903230 -- Preliminary Information
2.0-20.0 GHz Operation 3 dB Insertion Loss TTL Control Excellent Match on Off Port MSAGTM Proces...80/20) 1 mil preform solder. Limit time @ 300 C to less than 5 minutes. Wirebonding: Bond @ 160 C us... |
| Description |
Switch, Single-Pole, Double-Throw 2.0-20.0 GHz
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| File Size |
124.72K /
5 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAMGM0003-DIE
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| OCR Text |
DIE
Features
1.0 - 15.0 GHz GaAs MMIC Amplifier
1.0 to 15.0 GHz Operation 0.4 Watt Saturated Output Power Level Variable Gai...80/20) 1-2 mil. preform solder. Limit time @ 300 C to less than 5 minutes. Wirebonding: Bond @ 160 C... |
| Description |
0.4W Variable Distributed Amplifier 1.0 - 15.0 GHz
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| File Size |
265.55K /
7 Page |
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it Online |
Download Datasheet |
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Price and Availability
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