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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 130 Search Time::0.875ms
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				List of Unclassifed Manufacturers ETC[ETC]
Part No.	MAX3873AEGP
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 80 x 80 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Au None Metal1: 1.2; Metal2: 1.2; Metal3: 1.2; Metal4: 5.6 microns (as drawn) ...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	80.74K / 7 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX4007EUT MAX4004EUT
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 60 X 41 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 3 microns (as drawn) 3 microns (as drawn) 5 mil. Sq...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	87.71K / 8 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC]
Part No.	MAX4172EXA
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 84 x 58 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 3 microns (as drawn) 3 microns (as drawn) 5 mil. Sq...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	115.26K / 9 Page	View it Online	Download Datasheet

				MAXIM[Maxim Integrated Products]
Part No.	MAX4599EXT
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 32 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 mil...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	183.57K / 9 Page	View it Online	Download Datasheet

				MAXIM[Maxim Integrated Products]
Part No.	MAX4626EUK
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 57 x 35 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Al/Si/Cu (Aluminum/ Silicon/ Copper) None Metal 1: 0.9 microns; Metal 2: 0.9 m...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	56.33K / 7 Page	View it Online	Download Datasheet

				MAXIM INTEGRATED PRODUCTS INC MAXIM[Maxim Integrated Products] MAXIM - Dallas Semiconductor
Part No.	MAX4627EUK
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 57 x 35 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Al/Si/Cu (Aluminum/ Silicon/ Copper) None Metal 1: 0.9 microns; Metal 2: 0.9 m...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	56.45K / 7 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX4714EXT
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 30 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Al/Cu/Si/Ti None 0.35 microns (as drawn) 0.35 microns (as drawn) 5 mil. Sq. Si...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	76.94K / 7 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX6713ZEXS
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 30 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Silicon None .8 microns (as drawn) .8 microns (as drawn) 5 mil...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	54.74K / 8 Page	View it Online	Download Datasheet

				MAXIM[Maxim Integrated Products]
Part No.	MAX6902EKA
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 70 x 45 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Al/Si/Cu (Aluminum/ Silicon/ Copper) None Metal 1: 0.5 microns; Metal 2: 0.7 m...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	132.44K / 8 Page	View it Online	Download Datasheet

				Maxim Integrated Products, Inc. MAXIM[Maxim Integrated Products] MAXIM - Dallas Semiconductor
Part No.	MAX803TEXR
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 30 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) TiW/AlCu/TiWN None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq. SiO2...
Description	PLASTIC ENCAPSULATED DEVICES 塑封器件
File Size	58.25K / 8 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 130 Search Time::0.875ms
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