87914-3435 pdf Datasheet P6 Part Num --- IC-ON-LINE


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87914-3435 Datasheet PDF File

For 87914-3435 Found Datasheets File :: 100+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 |

					Molex Electronics Ltd.
Part No.	87914-2815 0879142815
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
File Size	3,777.37K / 48 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-879-14LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	87914-2216 0879142216
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size	3,779.50K / 48 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68653-435HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0879143016 87914-3016
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size	3,779.50K / 48 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68023-435HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, RightAngle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0879143203 87914-3203
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
File Size	759.86K / 11 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	89883-435LF
Description	Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Top Entry, Double row , 70 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0879143205
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 0.76渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
File Size	4,416.73K / 57 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	94063-435HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 35 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0879143216 87914-3216
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size	3,779.50K / 48 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	69173-435HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0879143416 87914-3416
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size	3,779.41K / 48 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68033-435HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0879144816
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size	3,779.74K / 48 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68683-435LF
Description	Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 70 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87914-2816 0879142816
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size	3,779.54K / 48 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	DLPC3435CZEZ
Description	DLP® Display Controller for DLP2010 (0.2 WVGA) DMD 201-NFBGA -30 to 85
Tech specs			Get Free Sample	Official Product Page

					Molex Electronics Ltd.
Part No.	0879145016 87914-5016
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size	3,779.55K / 48 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	LM3435SQ/NOPB
Description	Compact Sequential Mode RGB LED Driver with IC Control Interface 40-WQFN -40 to 125
Tech specs			Get Free Sample	Official Product Page

For 87914-3435 Found Datasheets File :: 100+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 |

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