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				Winbond Electronics
Part No.	W536Q020
OCR Text	...timers, one 14 bits divider, 12 pads for input or output, 7 interrupt sources and 8-level nesting for subroutine/interrupt applications. speech unit, integrated as a single chip with maximum 32 seconds (based on 6.4k sample rate with 5 b...
Description	MDPCM Voice/Melody w/40x16 ~ 16x8 LCD, 160x4x1 LCD RAM, 1/16 & 1/8 Duty, 1/4& 1/5 Bias, 16Kx20 ROM,
File Size	122.95K / 15 Page	View it Online	Download Datasheet

				COMCHIP[Comchip Technology]
Part No.	TV30C161J TV30C161JB TV30C161K TV30C161KB TV30C180J TV30C180JB TV30C510K TV30C510KB TV30C110K TV30C7V0KB TV30C780KB TV30C100KB TV30C360K TV30C260JB TV30C240J TV30C240JB TV30C240K TV30C100J TV30C430J TV30C430JB TV30C430K TV30C430KB TV30C7V5K TV30C7V5J TV30C7V0J TV30C200JB TV30C540K TV30C540KB TV30C9V0KB TV30C100JB TV30C100K TV30C101J TV30C101JB TV30C101K TV30C101KB TV30C110J TV30C110JB TV30C110KB TV30C111J TV30C111JB TV30C111K TV30C111KB TV30C120J TV30C120JB TV30C120K TV30C120KB TV30C121J TV30C121JB TV30C121K TV30C121KB TV30C130J TV30C130JB TV30C130K TV30C130KB TV30C131J TV30C131JB TV30C131K TV30C131KB TV30C140J TV30C140JB TV30C140K TV30C140KB TV30C150J TV30C150JB TV30C150K TV30C150KB TV30C151J TV30C151JB TV30C151K TV30C151KB TV30C160J TV30C160JB TV30C160K TV30C160KB TV30C170J TV30C170JB TV30C170K TV30C170KB TV30C171J TV30C171JB TV30C171K TV30C171KB TV30C180K TV30C180KB TV30C200J TV30C200K TV30C200KB TV30C220J TV30C220JB TV30C220K TV30C220KB TV30C240KB TV30C260J TV30C260K TV30C260KB TV30C280J TV30C280JB TV30C280K TV30C280KB TV30C300J TV30C300JB TV30C300K TV30C300KB TV30C330J TV30C330JB TV30C330K TV30C330KB TV30C360J TV30C360JB TV30C360KB TV30C400J TV30C400JB TV30C400K TV30C400KB TV3
OCR Text	... Mounted on 8.0x8.0 mm . Copper pads to Each Terminal. 3. Measured on 8.3 mS Single Half Sine-Wave or Equivalent Square Wave, Duty Cycle=4 Pulse per Minute Maximum. 4. VF=3.5V on TV30C5V0 thru TV30C900 Devices and VF=5.0V on TV30C101 thru T...
Description	SMD Transient Voltage Suppressor
File Size	71.58K / 4 Page	View it Online	Download Datasheet

				NXP
Part No.	TZA3026
OCR Text	...ground ground; connect together pads 9, 10, 11 and pad 12 as many as possible gnd 10 486.4 - 278.6 ground ground; connect together pads 9, 10, 11 and pad 12 as many as possible 9397 750 14763 ? koninklijke philips electronics n.v. 2005....
Description	SDH/SONET STM4/OC12 transimpedance amplifer
File Size	99.63K / 15 Page	View it Online	Download Datasheet

				Analog Devices, Inc. AD[Analog Devices]
Part No.	AD586 AD586A AD586AR AD586B AD586BR AD586J AD586JCCHIPS AD586JCHIPS AD586JN AD586JQ AD586JR AD586K AD586KN AD586KQ AD586KR AD586L AD586LQ AD586LR AD586M AD586MN AD586S AD586SQ AD586T AD586TQ AD586LN
OCR Text	... 400 3 60 NOTES 1 Both V OUT pads should be connected to the output. Die Thickness: The standard thickness of Analog Devices Bipolar dice is 24 mils 2 mils. Die Dimensions: The dimensions given have a tolerance of 2 mils. Backing: The ...
Description	High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDIP8 High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, CDIP8 High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDSO8 High Precision 5 V Reference 高精 V参
File Size	196.90K / 8 Page	View it Online	Download Datasheet

				ANALOG DEVICES INC Analog Devices, Inc.
Part No.	AD587 AD587JCHIPS AD587JN AD587JQ AD587JR AD587KN AD587KQ AD587KR AD587LN AD587LQ AD587SQ AD587TQ AD587UQ
OCR Text	....060 Inches NOTES 1 Both V OUT pads should be connected to the output. 2 Sense and force grounds must be tied together. Die Thickness: The standard thickness of Analog Devices Bipolar dice is 24 mils 2 mils. Die Dimensions: The dimensions...
Description	High Precision 10 V Reference
File Size	115.88K / 8 Page	View it Online	Download Datasheet


Part No.	KMMR18R8GAC1-SK8
OCR Text	...am storage 184 edge connector pads with 1mm pad spacing maximum module pcb size : 133.5mm x 31.75mm x 1.37mm (5.21 ? x 1.25 ? x 0.0 5 ? ) each rdram has 32 banks, for a total of 512, 384, 256, 192, or 128 banks on each 256/288...
Description	128M X 18 RAMBUS MODULE, DMA184
File Size	207.67K / 10 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers
Part No.	32900
OCR Text	...conversion (21) surface-mount pads (rev a only) (22) xbee, microsd a ux access ( rev a onl y) (23) rubber foot outline (24) product resource page (a) labeled power pads (b) soic ic land pattern (c) outer pads alternate between i...
Description	Propeller Board of Education
File Size	353.21K / 9 Page	View it Online	Download Datasheet

				LAPIS Semiconductor Co., Ltd.
Part No.	ML610401
OCR Text	... note: the assignment of the pads p30 to p35 are not in order. chip size: 1.82 mm 1.75 mm pad count: 63 pins minimum pad pitch: 80 m pad aperture: 70 m70 m chip thickness: 350 m voltage of the rear side of chip: v ss leve...
Description	8-bit Microcontroller with a Built-in LCD driver
File Size	278.75K / 27 Page	View it Online	Download Datasheet

				Maxim Integrated Products, Inc.
Part No.	MAX98502EVKIT
OCR Text	...ce between the in+ and in- pcb pads or j1 on the ev kit. 7) connect the speaker across the out+ and out- test points. 8) enable the power-supply output. 9) enable the audio source. 10) verify that the speaker is playing the audio sour...
Description	Evaluation Kit for the MAX98502
File Size	515.23K / 7 Page	View it Online	Download Datasheet

For pads Found Datasheets File :: 15061 Search Time::3.765ms
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