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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 130 Search Time::1.313ms
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				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PRF957 PRF957_3
OCR Text	... are shown. 2. Cbpb, Cbpe: base-bondpad and emitter-bondpad capacitance to collector. C cb L2 C C be Cce MBC964 Fig.14 Package equivalent circuit SOT323. UNIT fF fF fF nH nH nH nH nH 1999 Jul 23 9 Philips Semic...
Description	UHF wideband transistor From old datasheet system
File Size	111.45K / 16 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PRF947
OCR Text	... are shown. 2. Cbpb, Cbpe: base-bondpad and emitter-bondpad capacitance to collector. handbook, halfpage C cb L1 B LB B' E' LE C' L2 C C be Cce MBC964 L3 E QLB = 50; QLE = 50; QLB(f) = QLB(f/fc); QLE(f) = QL...
Description	UHF wideband transistor
File Size	111.59K / 16 Page	View it Online	Download Datasheet

				Philips
Part No.	PBR941
OCR Text	... are shown. 2. Cbpb, Cbpe; base-bondpad and emitter-bondpad capacitance to collector. C cb L2 C Cce MBC964 Fig.12 Package equivalent circuit SOT23. UNIT fF fF fF nH nH nH nH nH 1998 Aug 10 8 Philips Semiconductors...
Description	UHF wideband transistor
File Size	110.54K / 16 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D
OCR Text	......... 3 5 chip orientation and bondpad locations ................................ ........................... 4 6 electrical specifications ................................ ................................ ....................... 5 6.1 abs...
Description	Standard Card IC Specification B>bumped sawn wafer on UV-tape
File Size	33.19K / 7 Page	View it Online	Download Datasheet

				Philips
Part No.	PBR951
OCR Text	... are shown. 2. Cbpb, Cbpe; base-bondpad and emitter-bondpad capacitance to collector. C cb L2 C C be Cce MBC964 QLB = 50; QLE = 50; QLB,E(f) = QLB,E(f/fc); fc = scaling frequency = 1 GHz. Fig.12 Package equivalent circu...
Description	UHF wideband transistor
File Size	110.32K / 16 Page	View it Online	Download Datasheet

				Philips Semiconductors NXP Semiconductors
Part No.	PBR941 934043060215
OCR Text	... are shown. 2. Cbpb, Cbpe; base-bondpad and emitter-bondpad capacitance to collector. C cb L2 C Cce MBC964 Fig.12 Package equivalent circuit SOT23. UNIT fF fF fF nH nH nH nH nH 1998 Aug 10 8 Philips Semiconductors...
Description	UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR UHF wideband transistor
File Size	144.24K / 16 Page	View it Online	Download Datasheet

				MAXIM[Maxim Integrated Products]
Part No.	MAX3873EGP
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 80 x 80 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Au None Metal1: 1.2; Metal2: 1.2; Metal3: 1.2; Metal4: 5.6 microns (as drawn) ...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	80.94K / 7 Page	View it Online	Download Datasheet

				Maxim Integrated Products, Inc. MAXIM[Maxim Integrated Products] MAXIM - Dallas Semiconductor
Part No.	MAX6900ETTNBSP MAX6900ETT
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 70 x 44 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Al/Si/Cu (Aluminum/ Silicon/ Copper) None Metal 1: 0.9 microns; Metal 2: 0.9 m...
Description	Hex Bus Drivers With 3-State Outputs 16-CFP -55 to 125 塑封器件 PLASTIC ENCAPSULATED DEVICES
File Size	42.28K / 8 Page	View it Online	Download Datasheet

				Plato HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
Part No.	MSA-1100 MSA-1100-GP4
OCR Text	...1) Input 1 495 m 19.5 mil bondpad for Feedback Capacitor (5) Unless otherwise specified, tolerances are 13 m / 0.5 mils. Chip thickness is 114 m / 4.5 mil. Bond Pads are 41 m / 1.6 mil typical on each side. * Output contact is made...
Description	Cascadable Silicon Bipolar MMIC Amplifier 级联硅双极MMIC放大
File Size	52.25K / 4 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC]
Part No.	MAX1820ZEUB
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 81 X 81 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) TiW/ AlCu/ TiWN None .8 microns (as drawn) .8 microns (as drawn) 2.7 mil. Sq. ...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	136.36K / 8 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 130 Search Time::1.313ms
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