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MACOM[Tyco Electronics]
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| Part No. |
MA4E2544L-1282W MA4E2544 MA4E2544L-1282 MA4E2544L-1282T
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| OCR Text |
... beam lead Schottky diodes. The multi-layer metalization employed in the fabrication of the Surmount Schottky junctions includes a platinum ...die has a protective polyimide coating to minimize damage. The rugged construction of these SurMount... |
| Description |
SURMOUNTTM Low Barrier Silicon Schottky Cross-Over Quad Series
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| File Size |
105.04K /
4 Page |
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it Online |
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FILTRONIC[Filtronic Compound Semiconductors]
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| Part No. |
FMS2018
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| OCR Text |
Multi-Band GSM - UMTS Antenna Switch
Features:
Available in die form Suitable for multi-band GSM/DCS/PCS/ EDGE and UMTS applications Excellent low control voltage performance Excellent harmonic performance under GSM/DCS/PCS power ... |
| Description |
SP7T GaAs Multi-Band GSM UMTS Antenna Switch
SP7T GaAs Multi-Band GSM - UMTS Antenna Switch
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| File Size |
328.37K /
5 Page |
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it Online |
Download Datasheet |
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FILTRONIC[Filtronic Compound Semiconductors]
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| Part No. |
FMS2016
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| OCR Text |
Multi-Band GSM Antenna Switch
Features:
Available in die form Suitable for multi-band GSM/DCS/PCS/EDGE applications Excellent low control voltage performance Excellent harmonic performance under GSM power levels Very high isolation... |
| Description |
SP4T GaAs Multi-Band GSM Antenna Switch
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| File Size |
143.76K /
4 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MADS-002545-1307MT MADS-002545-1307M MADS-002545-1307MG MADS-002545-1307MR
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| OCR Text |
... beam lead Schottky diodes. The multi-layer metalization employed in the fabrication of the Surmount Schottky junctions includes a platinum ...die has a protective polyimide coating to minimize damage. The rugged construction of these SurMount... |
| Description |
SURMOUNTTM Medium Barrier Silicon Schottky Diodes: Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip
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| File Size |
192.39K /
3 Page |
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it Online |
Download Datasheet |
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INFINEON[Infineon Technologies AG]
http://
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| Part No. |
SLE55R16LM SLE55R16 SLE55R16C INFINEONTECHNOLOGIESAG-SLE55R16LM
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| OCR Text |
...low hierarchical key management Multi-level security structure possible Individual access rights for each key within a sector for each page ...Die MCC2-2-1 2048 bytes 2048 bytes Memory Admin. 512 bytes 512 bytes 256 256 on request on request P... |
| Description |
Security & Chip Card ICs 安全
Security & Chip Card ICs
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| File Size |
493.96K /
8 Page |
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it Online |
Download Datasheet |
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INFINEON[Infineon Technologies AG]
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| Part No. |
SLE66C24PEM5 SLE66C24PE SLE66C24PEC
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| OCR Text |
...ion from XRAM possible Enhanced multi-application support by 16 descriptors for system / application mode.
* * * * * * * * * * * * * * * ...die size, orientation,...) Module specification package, etc. containing description of
Memory Se... |
| Description |
Security & Chip Card ICs
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| File Size |
59.62K /
8 Page |
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it Online |
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SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
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| Part No. |
K4M563233D
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| OCR Text |
...ny DRAM products configured in "multi-die Plastic" format for use as components in general and scientific computers, such as mainframes, servers, work stations or desk top personal computers (hereinafter "Prohibited Computer Use"). Applicat... |
| Description |
8Mx32 Mobile SDRAM 90FBGA
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| File Size |
63.67K /
8 Page |
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it Online |
Download Datasheet |
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Price and Availability
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