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OKI SEMICONDUCTOR CO., LTD.
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| Part No. |
MS52C1162A
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| Description |
65,536-Word × 16-Bit or 131,072-Word × 8-Bit STATIC RAM 1,048,576-Word × 16-Bit or 2,097,152-Word × 8-Bit One Time PROM(64k字6位或128k字位静态RAM 1M字6位或2M字OTPROM)
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| File Size |
143.30K /
19 Page |
 View
it Online |
Download Datasheet
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
2SA1162
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| Description |
PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79821-162HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-5116-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4116-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-162-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
50332-1162HLF
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| Description |
High Pin Count, Backplane Connectors, Receptacle, Vertical, Through Hole, 3 Row, 162 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68021-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10106116-2002401LF
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| Description |
PwrBlade+® , Power Connectors, 2ACP+8S STB, Right Angle, Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-811162000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4116-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 11627-31 |
| Maker: CONEXANT |
| Pack: QFP |
| Stock: 57 |
| Unit price
for : |
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50: $16.62 |
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100: $15.78 |
| 1000:
$14.95 |
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Email: oulindz@gmail.com |
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Contact us |
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