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For x-gold Found Datasheets File :: 15087 Search Time::4.828ms
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				Hittite Microwave Corporation
Part No.	HMC33909
OCR Text	...olation: > 37 db die size: 1.32 x 0.81 x 0.1 mm electrical specifi cations, t a = +25 c, as a function of vdd typical applications the hm...gold 7. bond pad metallization: gold die packaging information [1] standard alternate gp-2 (gel p...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 33 - 42 GHz
File Size	308.29K / 8 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XS1000
OCR Text	...n: Gold All Bond Pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.88 mg. Bond Pad #1 (RF In) Bond Pad #2 (Inp...
Description	7.0-13.0 GHz GaAs MMIC 6-Bit Phase Shifter
File Size	498.75K / 6 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	M570
OCR Text	...: 40-60 grams for 0.010 x 0.010 inch chip 150-250 grams for 0.020 x 0.020 inch chip 350-500 grams for 0.030 x 0.030 ...gold 0.0007 to 0.001 inch diameter wedge bonded gold wire. the inductance of a 1 mil diameter wir...
Description	Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMIC’s
File Size	167.30K / 4 Page	View it Online	Download Datasheet

				ST Microelectronics
Part No.	1N6640U01D 1N6640U02D 1N6640UD1
OCR Text	...he following equation: p = 0.74 x if(av) + 1.00 x i f 2 (rms ) table 2. absolute ratings (limiting values) symbol parameter value unit...gold 6640 - 0.12 g waffle pack 1n6640u01d 5101/027/07 gold 510102707 target 1n6640u02d 5101/027/08 s...
Description	Aerospace 0.3 A 75 V switching diode
File Size	183.53K / 9 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XX1002
OCR Text	...n: Gold All Bond Pads are 0.200 x 0.100 (0.008 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.566 mg. Bond Pad #1 (RF In) Bond Pad #2 (Vc...
Description	2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler
File Size	370.74K / 5 Page	View it Online	Download Datasheet

				ST Microelectronics
Part No.	1N5819U01B
OCR Text	...e following equation: p = 0.285 x if(av) + 0.165 x i f 2 (rms ) table 4. static electrical characteristics symbol parameter t...gold 5819 - 0.18 g waffle pack 1n5819u01b 5106/021/02 gold 510602102 y 1n5819u02b 5101/021/03 solder...
Description	Aerospace 45 V power Schottky rectifier
File Size	204.40K / 10 Page	View it Online	Download Datasheet

				ST Microelectronics
Part No.	1N5811U01B 1N5811U02B 1N5811UB1
OCR Text	...he following equation: p = 0.68 x if(av) + 0.03 x i f 2 (rms ) table 2. absolute ratings (limiting values) symbol parameter value unit...gold 5811 - 0.18 g waffle pack 1n5811u01b 5101/013/11 gold 510101311 y 1n5811u02b 5101/013/12 solder...
Description	Aerospace 6 A fast recovery rectifier
File Size	184.80K / 9 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	CMPA801B025D
OCR Text	...erature operation ? size 0.142 x 0.188 x 0.004 inches applications ? point to point radio ? communications ? test instrumentation ? emc...gold plating is 5 microns thick minimum. ? thermosonic ball or wedge bonding are the preferred conn...
Description	25 W, 8.0 - 11.0 GHz, GaN MMIC, Power Amplifier
File Size	295.14K / 7 Page	View it Online	Download Datasheet

				Quanzhou Jinmei Electro... NXP Semiconductors N.V.
Part No.	BGD712C BGD712C-2015 BGD712C-15
OCR Text	...e; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads Version SOT115J Type number 4. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System ...
Description	750 MHz, 18.5 dB gain power doubler amplifier
File Size	39.58K / 7 Page	View it Online	Download Datasheet

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