| |
|
 |
Toshiba Electronic Devices & Storage Corporation |
| Part No. |
2SA1162
|
| Description |
PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
79821-162HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
http://
Molex Electronics Ltd.
|
| Part No. |
90571-1162 0905711162
|
| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.76 μm Gold (Au)
|
| File Size |
282.78K /
4 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-5116-21D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-4116-21H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77311-162-36LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
50332-1162HLF
|
| Description |
High Pin Count, Backplane Connectors, Receptacle, Vertical, Through Hole, 3 Row, 162 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68021-162HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10106116-2002401LF
|
| Description |
PwrBlade+® , Power Connectors, 2ACP+8S STB, Right Angle, Header.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54122-811162000LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-4116-21D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
|
|
JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 11627-31 |
| Maker: CONEXANT |
| Pack: QFP |
| Stock: 57 |
| Unit price
for : |
|
50: $16.62 |
|
100: $15.78 |
| 1000:
$14.95 |
|
Email: oulindz@gmail.com |
|
Contact us |
|
|
