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For punch Found Datasheets File :: 2160 Search Time::2.656ms
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				Amkor Technology
Part No.	SON MICROLEADFRAME DFN
OCR Text	... non-exposed pad ? ppf (nipd) punch & saw mlf ? small mlf (less than 2 x 2 body size) ? stacked die ? thin micro leadframe ? ? top exposed pad (tep) ? inframe cavity mlf ? flipchip mlf dual row mlf package an mlf package with ...
Description	Saw MLF PEL (Plated End Lead) Package
File Size	739.59K / 3 Page	View it Online	Download Datasheet

				PANDUIT CORP.
Part No.	P110PC3-XY P110BW100-X P110BW300-X
OCR Text	...ical infrastructure systems pan-punch ? 110 category 5e bases ? exclusive deeper channel to facilitate tia/eia-568-c.2 category 5e cabling installations ? ideal for use in cross-connects and consolidation point applications ? available wit...
Description	Pan-punch 110 Patch Connectors
File Size	84.00K / 1 Page	View it Online	Download Datasheet

				DYNEX[Dynex Semiconductor]
Part No.	GP800DDS18
OCR Text	...1 FEATURES s s s s s Non punch Through Silicon Isolated Copper Baseplate With Al2O3 Substrate Low Inductance Internal Construction Full 1800V Rating 800A Per Arm KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3....
Description	Dual Switch IGBT Module
File Size	134.63K / 10 Page	View it Online	Download Datasheet

				Dynex Semiconductor Ltd. DYNEX[Dynex Semiconductor]
Part No.	GP800DDM18
OCR Text	... Capability 800A Per Module Non punch Through Silicon Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3.5V 800A 1600A APPLICATIONS s s s s High Reliability Inverters Motor Co...
Description	Hi-Reliability Dual Switch IGBT Module Advance Information
File Size	143.87K / 10 Page	View it Online	Download Datasheet

				Dynex Semiconductor, Ltd. Dynex Semiconductor Ltd. DYNEX[Dynex Semiconductor]
Part No.	GP800DDM12
OCR Text	... Capability 800A Per Switch Non punch Through Silicon Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1200V 2.7V 800A 1600A APPLICATIONS s s s s High Reliability Inverters Motor Co...
Description	Hi-Reliability Dual Switch IGBT Module Advance Information 800 A, 1200 V, N-CHANNEL IGBT
File Size	113.25K / 11 Page	View it Online	Download Datasheet

				DYNEX[Dynex Semiconductor]
Part No.	GP800DCS18
OCR Text	...1 FEATURES s s s s s Non punch Through Silicon Isolated Copper Baseplate With Al2O3 Substrate Low Inductance Internal Construction Full 1800V Rating 800A Per Module KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V...
Description	Chopper Switch IGBT Module
File Size	169.02K / 10 Page	View it Online	Download Datasheet

				DYNEX[Dynex Semiconductor]
Part No.	GP800DCM18
OCR Text	... Capability 800A Per Module Non punch Through Silicon Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3.5V 800A 1600A APPLICATIONS s s s s High Reliability Inverters Motor Co...
Description	Hi-Reliability Chopper Switch IGBT Module
File Size	157.98K / 10 Page	View it Online	Download Datasheet

				Dynex Semiconductor Ltd. DYNEX[Dynex Semiconductor]
Part No.	GP400LSS18
OCR Text	punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 400A Per Module KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3.5V 400A 800A APPLICATIONS s s s s High Power Inverters Motor ...
Description	Aluminum Electrolytic Radial Leaded Low Profile Wide Temp Capacitor; Capacitance: 47uF; Voltage: 160V; Case Size: 16x15 mm; Packaging: Bulk Single Switch IGBT Module
File Size	139.76K / 11 Page	View it Online	Download Datasheet

				Dynex Semiconductor, Ltd. DYNEX[Dynex Semiconductor]
Part No.	GP400LSS12
OCR Text	...0 FEATURES s s s s s Non punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 1200V Rating 400A Per Module KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1200V 2.7V 400A 800A APPLICA...
Description	Aluminum Electrolytic Radial Leaded Low Profile Wide Temp Capacitor; Capacitance: 10uF; Voltage: 160V; Case Size: 18x20 mm; Packaging: Bulk 400 A, 1200 V, N-CHANNEL IGBT Single Switch IGBT Module
File Size	131.54K / 10 Page	View it Online	Download Datasheet

				DYNEX[Dynex Semiconductor]
Part No.	GP400DDS18
OCR Text	punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3.5V 400A 1600A APPLICATIONS s s s s High Power Inverters Motor Controllers Ind...
Description	Dual Switch IGBT Module Preliminary Information
File Size	154.43K / 11 Page	View it Online	Download Datasheet

For punch Found Datasheets File :: 2160 Search Time::2.656ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |