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| product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 15 tsz02201-0g1g0an00430-1-2 ? 2014 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 tsz22111 ? 14 ? 001 www.rohm.com voltage tracker bd3925fp-c bd3925hfp-c general description bd3925fp-c and bd3925hfp-c are voltage trackers for automotive use which have high withstand-voltage of up to 50v. they offer an output current loading of up to 500ma while limiting the quiescent current to 45a (typ). bd3925fp-c and bd3925hfp- c are suited for systems that are permanently connected to the car battery and require low -current-consumption. the offset is 10mv (for 5v output, 6v < v cc < 36v, 5ma < l o ut < 200ma). they integrate folded C type over-current protection to minimize heat dissipation when accidentally shorted, thus offering the most robust power-supply design under harsh automotive environment. features low -saturation voltage type p-channel dmos output transistors low offset voltage : 10mv(for 5v output, 6v< v cc <36v, 5ma bd3925fp-c bd3925hfp-c 2/ 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 block diagrams pin configurations pin descriptions to252-5 hrp5 pin no. pin name function pin no. pin name function 1 vcc power s uppl y pin 1 vcc power supply pin 2 sw out on /off function pin 2 sw out on /off function pin 3 n.c. no connection 3 gnd gr ound 4 adj input voltage 4 adj input voltage 5 out output voltage 5 out output voltage f in gnd gr ound f in gnd gr ound figure 1. (fp) figure 2. (hfp) to252-5 (top view) 1 2 4 5 3 hrp5 (top view) 1 2 3 4 5 start up ocp tsd fin vcc sw n.c. adj vo fin out vcc start up ocp tsd fin vcc sw gnd adj vo fin out vcc downloaded from: http:/// bd3925fp-c bd3925hfp-c 3/ 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25 c ) parameter symbol limit unit supply voltage v cc 50 (note 1) v switch supply voltage v sw 50 v vadj terminal supply voltage v adj 28 v out terminal voltage v out 28 v output current i out 500 ma power dissipation pd 1.3 ( to 252 - 5) (note 2) w 1.6 (hrp5) (note 3) operating temperature range topr - 40 to + 125 c storage temperature range tstg - 55 to +1 50 c maximum junction temperature tjmax 150 c (note 1) not to exceed pd. (note 2) to252-5: reduced by 10.4mw/c over 25c, when mount on a gla ss epoxy board: 70 mm x 70 mm x 1.6 mm. (note 3) hrp5: reduced by 12.8mw/c over 25c, when mount on a glass ep oxy board: 70 mm x 70 mm x 1.6 mm. caution: operating the ic over the absolute maximum ratings may dam age the ic. the damage can either be a short circuit between p ins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures such as adding a fuse, in case t he ic is operated over the absolute maximum ratings recommended operating conditions parameter symbol min max unit supply voltage v cc 4.5 (note 4) 36.0 v input voltage (note 5) v adj 2.5 14 v output current i out 500 ma (note 4) please consider that the output voltage would drop (dropout volt age) according to the output current. (note 5) not to exceed v cc - 0.5v. electrical characteristics (unless otherwise specified, ta=- 40 c to +125 c , v cc =13.2 v, v sw =3 v, v adj = 5v ) parameter symbol min typ max unit conditions standby current i stby 10 a sw=gnd circuit current i cc 45 90 a i out =0ma offset voltage ? v out -10 +10 mv 6v bd3925fp-c bd3925hfp-c 5/ 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued unless otherwise specified, v cc =13.2v, v adj =5v, v sw =3v, ta=25c 0 1 2 3 4 5 6 100 120 140 160 180 200 ambient temperat ure: t a [ ] output voltage:vo [ v ] figure 10 . output voltage vs ambient temperature (thermal shutdown circuit) ambient temperature : ta [ c] output voltage : v o ut [v] figure 8. output voltage vs sw input voltage 0 1 2 3 4 5 6 0 1 2 3 supply voltage: v sw [v] output voltage: vo[v] ta= 25 c ta=- 40 c ta= 125 c supply voltage : v sw [v] output voltage : v o ut [v] figure 7. ripple rejection vs frequency 0 10 20 30 40 50 60 70 10 100 1000 10000 100000 1000000 frequency: f [hz] ripple rejection: r.r. [db] ta=125c ta=- 40 c ta=25c ripple rejection : r.r. [db] frequency : f [hz] figure 9. circuit current vs output current (circuit current classified by load) 0 20 40 60 80 100 120 140 0 100 200 300 400 500 out put current : io[ma] bias current: ib [a] ta=- 40 c ta= 25 c ta= 125 c output current : i o ut [ma] circuit current : i cc [ a] downloaded from: http:/// bd3925fp-c bd3925hfp-c 6/ 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued unless otherwise specified, v cc =13.2v, v adj =5v, v sw =3v, ta=25c 0 1 2 3 4 5 6 7 0 2 4 6 8 10 12 14 16 supply voltage: v adj [v] adj bias current:adji[a] ta=- 40 c ta= 25 c ta= 125 c figure 13. adj bias current vs supply voltage supply voltage : v adj [v] adj bias current : i adj [ a] figure 14. circuit current vs temperature ambient temperature : ta [ c] circuit current : i cc [ a] 0 1 2 3 4 5 6 0 500 1000 1500 2000 output current: i o [ma] output voltage: v o [v] ta= 25 c ta= 125 c ta=- 40 c figure 11 . output voltage vs output current output current : i o ut [ma] output voltage : v o ut [v] 0 40 80 120 160 200 0 6 12 18 24 30 36 supply voltage: v sw [v] sw bias current: swi [a] ta=- 40 c ta= 25 c ta= 125 c figure 1 2. sw bias current vs supply voltage supply voltage : v sw [v] sw bias current : i sw [ a] downloaded from: http:/// bd3925fp-c bd3925hfp-c 7/ 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 pin settings / precautions 1. vcc pins insert capacitors with a capacitance of 0.33f to 1000f between the vcc and gnd pins. the capacitance varies with the application. be sure to design th e capacitance with a sufficient margin. 2. output pin it is necessary to place capacitors between each output pi n and gnd to prevent oscillation on the output. usable capacitance values range from 4.7f to 1000f. ceramic capa citors can be used as long as their esr value is low enough to prevent oscillation. abrupt fluctuations in inp ut voltage and load conditions may affect the output vol tage. output capacitance values should be determined only through sufficient testing of the actual application. power dissipation 0 1 2 3 4 5 6 7 8 0 25 50 75 100 125 150 2.30w 5.50w 7.30w 0 1 2 3 4 5 6 7 8 0 25 50 75 100 125 150 1.6w 0 1 2 3 4 5 6 7 8 0 25 50 75 100 125 150 1.85w 3.50w 4.80w 0 1 2 3 4 5 6 7 8 0 25 50 75 100 125 150 1.3w ic mounted on a rohm standard board substrate size: 70mm x 70mm x 1.6mm ja=96.2( c/w) mounted on a rohm standard board board size : 70mm x 70 mm x 1.6 mm copper foil area :7 mm x 7 mm 2-layer board (back surface copper foil area :15 mm x 15 mm ) 2-layer board (back surface copper foil area :70 mm x 70 mm ) 4-layer board (back surface copper foil area :70 mm x 70 mm ) : ja = 67.6 c/w : ja = 35.7 c/w : ja = 26.0 c/w to252-5 to252-5 hrp5 hrp5 figure 15 figure 16 figure 17 figure 18 ic mounted on a rohm standard board substrate size: 70mm x 70mm x 1.6mm ja= 78.1 ( c/w) mounted on a rohm standard board board size : 70 mm x 70 mm x 1.6 mm (board contains a thermal) 2-layer board (back surface copper foil area :15 mm x 15 mm ) 2-layer board (back surface copper foil area :70 mm x 70 mm ) 4-layer board (back surface copper foil area :70 mm x 70 mm ) : j a= 54.3 c/w : ja = 22.7 c/w : ja = 17.1 c/w 0.01 0.1 1 10 100 0 100 200 300 400 500 load current (ma) effective series resistance ( ) stable operating area vcc out gnd 0.33f c out 4.7f i out sw 13.2v adj 5v note: measurement circuit (reference data) effective series resistance vs load current (reference data) v cc =13.2v,v o ut =5v, ta =25c, c in =0.33f, c out =4.7f esr ambient temperature : ta [ c] ambient temperature : ta [ c] ambient temperature : ta [ c] ambient temperature : ta [ c] load current [ma] effective series resistance [?] power dissipation pd(w) power dissipation pd(w) power dissipation pd(w) power dissipation pd(w) downloaded from: http:/// bd3925fp-c bd3925hfp-c 8/ 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 refer to the heat attenuation characteristics illustrated in figure 15 to figure 18 when using the ic in an environment where ta exceeds 25c. the operating temperature of the ic greatly influ ences the characteristics of the ic. if the temperature exceeds the maximum junction temperature tjmax, the elem ents of the ic may be deteriorated or damaged. it is necessary to give sufficient consideration to the heat of the ic in view of two points, i.e., the protection of the ic from insta ntaneous damage and the maintenance of the reliability of the ic in long -time operation. in order to protect the ic from thermal destruction, it is necessa ry to operate the ic below the maximum junction temperature ( tj m ax ) figure 15 and figure 16 illustrate the power dissipation/heat attenuation characteristics for the to252 package. operate the ic within the power dissipation pd. the fol lowing method is used to calculate the power consumption pc (w). power dissipation pd pc where: v cc is the input voltage v o ut is the output voltage i o ut is the load c ur rent i cc is the total supply current the load current i o ut is obtained to operate the ic within the power dissipation. out cc cc cc out v v i v i ? ? ? - pd (please refer to figure 9. and figure 14. for i cc .) the maximum load current i omax for the applied voltage vcc can be calculated during the therm al design process. example : bd3925 fp -c v cc = 12v and v o ut =5v(adj= 5) at ta = 85c i out 356 ma (i cc =100a) make a thermal calculation with the consideration above s o that the whole operating temperature range will be within the power dissipation. the power consumption pc of the ic in the event of shorting (i.e., if the out and gnd pins are shorted) will be obtained from the following equation. ? ? short cc cc i i v pc ? ? ? where: i short is the short current i/o equivalent circuits (all resistance values are typical) figure 16 : ja =26.0c/w to - 38 .4maw/c 25 c=4.80w to 85 c =2.496w (please refer to figure 11 . for i short .) ? ? cc cc out out cc i v i v v pc ? ? ? ? ? sw 210k 200k 1k 2pin[sw] vo 1k 30pf 5pin[vo] 1k 1.4pin[vcc adj] 1k vcc adj out 5pin [out] 2pin [ sw ] 1,4pin [vcc, adj] vcc 5- 12 i 12 - 2.496 i cc out downloaded from: http:/// bd3925fp-c bd3925hfp-c 9/ 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. therma l consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute ma ximum rating of the pd stated in this specification is whe n the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:/// bd3925fp-c bd3925hfp-c 10 / 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 10. unused input pins input pins of an ic are often connected to the gate of a mos trans istor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. 11. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoide d. figure 19. example of monolithic ic structure 12. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however t he rating is exceeded for a continued period, the juncti on temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 13. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circui t that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. 14. applications or inspection processes where the potential s of the vcc pin and other pins may be reversed from their normal states may cause damage to the ic's internal circuitry or ele ments. use an output pin capacitance of 470f or lower in case vcc is shorted with the gnd pin while the e xternal capacitor is charged. it is recommended to insert a diode for preventing back current flow in series with v cc or bypass diodes between vcc and each pin. 15. sw pin, adj pin do not apply the voltage to sw pin and adj pin when the vcc is no t applied. and when the vc c is applied, the voltage of sw pin and adj pin must not ex ceed vcc. tsd on temperature [c] (typ) hysteresis temperature [c] (typ) 175 25 n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements v cc pin bypass diode countercurrent prevention diode downloaded from: http:/// bd3925fp-c bd3925hfp-c 11 / 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 16. about positive surge voltage to protect against a surge voltage that exceeds 50v betwee n vcc and gnd please insert a power zener diode between vcc terminal and gnd. 17. negative voltage surges on vcc pin a schottky barrier diode should be inserted between vcc and g nd for protection against voltages lower than gnd at the vcc pin. 18. for very small fluctuations of output voltage when the application is used where very small fluctuations of output voltage caused by some factors (e.g. disturbance noise, input voltage fluctuations, load fluc tuations, etc.), please take enough measures to avoid som e influence (e.g. insert the filter, etc.). 19. output protection diode output loads with large inductive component may cause rev erse current flow to the output pin during startup or shutdown. in such cases, a protection diode should be inse rted at the output to protect the ic. v cc gnd d 1 v cc gnd d 1 downloaded from: http:/// bd3925fp-c bd3925hfp-c 12 / 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 marking diagrams part number marking package part number bd3925 to252-5 reel of 2000 bd3925fp-ce2 bd3925hfp hrp5 reel of 2000 BD3925HFP-CTR to252-5 (top view) part number marking lot number b d 3 9 2 5 hrp5 (top view) bd3925hfp part number marking lot number 1pin mark downloaded from: http:/// bd3925fp-c bd3925hfp-c 13 / 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimensions, tape and reel information package name to252-5 downloaded from: http:/// bd3925fp-c bd3925hfp-c 14 / 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimensions, tape and reel information - continued package name hrp5 downloaded from: http:/// bd3925fp-c bd3925hfp-c 15 / 15 tsz02201-0g1g0an00430-1-2 ? 20 14 rohm co., ltd. all rights reserved. 20.oct.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 20 .oct.2014 001 new release downloaded from: http:/// notice- ss rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extraordinary environments or conditions, as exemplified bel ow . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our pr oducts under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using wate r or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mo unted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommend ed. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range d escribed in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with t he rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:/// notice- ss rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin co nsidering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensatio n [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is ind icated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. al l information and data including but not limited to applic ation example contained in this document is for reference only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modifie d, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:/// datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:/// |
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