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1ch small package high side switch ics 0.75a current limit latch off high side switch ics bd2220g bd2221g general description bd2220g and bd2221g are low on - resistance n- channel mosfet high - side power switches, optimized for universal serial bus (usb) applications. bd2220g and bd2221g are equipped with the function of over - current detection, thermal shutdown, under - voltage lockout and soft - start. features low o n- resistance (typ 160m ) n -c hannel mosfet built - in over - current detection (output off - latch operation ) thermal shutdown open - drain fault flag output flag output delay under - voltage lockout soft - start circuit control i nput logic ? active - high : bd2220g ? active - low : bd2221g revers e current p rotection w hen p ower s witch o ff applications usb hub in consumer appliances, pc, pc p eripheral equipment, and so forth key specifications ? i nput v oltage r ange: 2.7v to 5.5v ? on -r esistance: 16 0m (typ) ? over - current t hreshold: 0.5 a (m in ) , 1.0 a (max) ? s tandby current: 0.01 a ( typ ) ? operating temperature range : -40 c to +85 c package w(typ) d (typ) h (max) typical application circuit lineup over - current t hreshold control input logic package orderable part numb er min typ max 0.5a - 1.0a high ssop5 reel of 3000 bd2220g - tr 0.5a - 1.0a low ssop5 reel of 3000 bd2221g - tr ssop5 2.90mm x 2.80mm x 1.25mm 10k ~ 100k c l c in v in gnd en vout /oc 5v (typ.) + - 3.3v 5v(typ) 10k to 100k in out product structur e silicon monolithic integrated circuit this product has not designed protection against radioactive rays 1/ 22 www.rohm.com ? 2013 rohm co., lt d. all rights reserved. tsz22111 ? 14 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 datashee t downloaded from: http:///
bd2220g bd2221g data s heet block diagram pin configuration s in gnd en 1 2 3 4 5 /oc out in gnd /en 1 2 3 4 5 /oc out pin description p in no. symbol i/o function 1 in - switch input and the supply voltage for the ic. 2 gnd - ground 3 en, /en i enable input. en: high level input turns on the switch. (bd2220g) /en: low level input turns on the switch. (bd2221g) 4 /oc o over - current noti fication terminal. low level output during over - current or over - temperature condition. open - drain fault flag output. 5 out o switch output bd222 0g top view bd222 1g top view under - voltage lockout charge pump en(/en) delay counter over - current detection thermal shutdown in /oc gnd out s q r 2/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet absolute maximum ratings ( ta = 25 c) parameter symbol rating unit in s upply v oltage v in - 0.3 to + 6.0 v en(/en) in put v oltage v en , v /en - 0.3 to + 6.0 v /oc v oltage v /oc - 0.3 to + 6.0 v /oc s ink c urrent i /oc 5 ma out v oltage v out - 0.3 to + 6.0 v storage t emperature t stg - 55 to + 150 c power d issipation pd 0.67 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 5.4mw per 1 o c above 25 o c. caution: operating the ic over the absolute maximum ratings may damage the i c. the damage can either be a short circuit between pins or an open cir cuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit min typ max in o perating v oltage v in 2.7 5.0 5.5 v operating t emperature t opr - 40 - + 85 c electrical characteristics bd2220g (v in = 5v, ta= 25 c, unless otherwise specified.) dc characteristics parameter symbol limit unit condition s min typ max operating current i dd - 110 160 a v en = 5v v out = o pen standby current i stb - 0.01 5 a v en = 0v v out = o pen en i nput v oltage v enh 2.0 - - v high i nput v enl - - 0.8 v low i nput en i nput l eakage i en - 1.0 +0.01 +1.0 a v en = 0v or 5v on-r esistance r on - 160 210 m i out = 50ma switch leak current i lsw - - 1.0 a v en = 0v, v out = 0v reverse leak current i rev - - 1.0 a v out = 5.5v, v in = 0v over - current t hreshold i th 0.5 - 1.0 a short c ircuit o utput c urrent i sc 0.35 - - a v out = 0v, rms /oc o utput l ow v oltage v /oc - - 0.4 v i /oc = 0.5ma uvlo t hreshold v tuvh 2.1 2.3 2.5 v v in i ncreasing v tuvl 2.0 2.2 2.4 v v in d ecreasing ac characteristics parameter symbol limit unit conditions min typ max output rise time t on1 - 1 6 ms r l = 20 output t urn on time t on2 - 1.5 10 ms r l = 20 output f all time t off1 - 1 20 s r l = 20 output t urn off time t off2 - 3 40 s r l = 20 /oc d elay t ime t /oc 10 15 20 ms 3/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet electrical c haracteristics C continued bd2221g (v in = 5v, ta= 25 c, unless otherwise specified.) dc characteristics parameter symbol li mit unit condition s min typ max operating current i dd - 110 160 a v /en = 0v v out = o pen standby current i stb - 0.01 5 a v /en = 5v v out = o pen /en i nput v oltage v /enh 2.0 - - v high i nput v /enl - - 0.8 v low i nput /en i nput l eakage i /en - 1.0 +0.01 +1.0 a v /en = 0v or 5v on-r esistance r on - 160 210 m i out = 50ma switch leak current i lsw - - 1.0 a v /en = 0v, v out = 0v reverse leak current i rev - - 1.0 a v out = 5.5v, v in = 0v over - current t hreshold i th 0.5 - 1.0 a short c ircuit o utput c urrent i sc 0.35 - - a v out = 0v, rms /oc o utput l ow v oltage v /oc - - 0.4 v i /oc = 0.5ma uvlo t hreshold v tuvh 2.1 2.3 2.5 v v in i ncreasing v tuvl 2.0 2.2 2.4 v v in d ecreasing ac characteristics parameter symbol limit unit conditions min typ max o utput rise time t on1 - 1 6 ms r l = 20 output t urn on time t on2 - 1.5 10 ms r l = 20 output fall time t off1 - 1 20 s r l = 20 output t urn off time t off2 - 3 40 s r l = 20 /oc d elay t ime t /oc 10 15 20 ms 4/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet measurement circuit vin gnd en(/en) vout /oc v in v en(/en) a 1f vin gnd en(/en) vout /oc v in v en(/en) a 1f r l a. operating current b. en,/en i nput voltage, o utput rise / fall time vin gnd en(/en) vout /oc v in v en(/en) a 1f i out 10k vin gnd en(/en) vout /oc v in v en(/en) a 1f i oc c. on - resistance, o ver - current detection d. /oc output l ow v oltage figure 1. measurement circuit timing d iagram t on1 t off1 90% 10% 10% t on2 t off2 v enh v enl 90% v en v out t on1 t off1 90% 10% 10% t on2 t off2 v /enl v /enh 90% v /en v out figure 2. o utput r i se / fall time (bd2220g) figure 3. o utput rise / fall time (bd2221g) in out in out in out in out t on2 t off2 v en t on1 t off1 5/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical performance curves operating current : i dd [ a] operating current : i dd [ a] supply voltage ; v in [v] ambient temperature ; ta[c] standby current : i stb [ a] standby current : i stb [ a] supply voltage ; v in [v] ambient temperature ; ta[c] 0 20 40 60 80 100 120 140 2 3 4 5 6 ta=25 c figure 4. operating current vs supply voltage ( en, /en e nable ) 0 20 40 60 80 100 120 140 -50 0 50 100 v in =5.0v figure 5. operating current vs ambient temperature ( en, /en e nable ) 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 ta=25 c figure 6. standby current vs supply voltage ( en, /en d isable ) figure 7. standby current vs ambient temperature ( en, /en d isable ) 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 v in =5.0v 6/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical performance curves - continued 0 50 100 150 200 250 2 3 4 5 6 ta=25 c figure 10. o n-r esistance vs supply voltage on- resistance : r on [ m? ] supply voltage ; v in [v] 0 50 100 150 200 250 -50 0 50 100 v in =5.0v figure 11. o n-r esistance vs ambient te mperature on- resistance : r on [ m? ] ambient temperature ; ta[c] supply voltage ; v in [v] figure 8. en, /en i nput v oltage vs supply voltage 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 ta=25 c low to high high to low enable input voltage : v en , v /en [ v ] enable input voltage : v en , v /en [ v ] ambient temperature ; ta[c] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 v in =5.0v low to high high to low figure 9. en, /en i nput v oltage vs ambient temperature 7/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical performance curves - continued figure 12. over -current t hreshold vs supply voltage over - current threshold : i th [ a ] supply voltage ; v in [v] 0.5 0.6 0.7 0.8 0.9 1.0 2 3 4 5 6 ta=25 c over - current threshold : i th [ a ] ambient temperature ; ta[c] 0.5 0.6 0.7 0.8 0.9 1.0 -50 0 50 100 v in =5.0v figure 13. over -current t hreshold vs ambient temperature 0 20 40 60 80 100 -50 0 50 100 ta=25 c figure 14. /oc o utput l ow v oltage vs supply voltage supply voltage ; v in [v] /oc output low voltage : v /oc [ mv ] 0 20 40 60 80 100 -50 0 50 100 v in =5.0v figure 15. /oc o utput l ow v oltage vs ambient temperature ambient temperature ; ta[c] /oc output low voltage : v /oc [ mv ] 8/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical performance curves - continued output rise time : t on [ ms ] ambient temperature ; ta[c] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 19. output r ise t ime vs ambient temperature uvlo hysteresis voltage : v hys [v] ambient temperature ; ta[c] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 figure 17. uvlo hysteresis voltage vs ambient temperature output rise time : t on [ ms ] supply voltage ; v in [v] figure 18. outp ut r ise t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25 c figure 16. uvlo t hreshold voltage vs ambient temperature 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 v tuvh v tuvl uvlo threshold : v tuvh, v tuvl [ v ] ambient temperature ; ta[c] 9/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical performance curves - continued output turn on time : t on2 [ ms ] supply voltage ; v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25 c figure 2 0. output turn on t ime vs supply voltage output fall time : t off [ s ] supply voltage ; v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25 c figure 22. output f all t ime vs supply voltage output fall time : t off [ s ] ambient temperature ; ta[c] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 23. output f all t ime vs ambient temperature output turn on time : t on2 [ ms ] ambient temperature ; ta[c] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 21. output turn on t ime vs ambient temperature 10 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 supply voltage : v in [v] turn off time : t off2 [s] ta=25 c output turn off time : t off2 [ s ] supply voltage ; v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 ambient temperature : ta[ ] turn off time : t off2 [s] v in =5.0v output turn off time : t off2 [ s ] ambient temperature ; ta[c] figure 24. output turn off t ime vs supply voltage figure 25. output turn off t ime vs ambient temperature /oc delay time : t /oc [m s ] supply voltage ; v in [v] 10 12 14 16 18 20 2 3 4 5 6 ta=25 c figure 26. /oc d elay t ime vs supply voltage /oc delay time : t /oc [m s ] ambient temperature ; ta[c] 10 12 14 16 18 20 -50 0 50 100 v in =5.0v figure 27. /oc d elay t ime vs ambient temperature 11 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical wave f orms t ime (1ms/div.) fig ure 28. output rise characteristic v en (5v/div.) v /oc (5v/div.) v ou t (5v/div.) i out (0.5a/div.) v in =5v r l =20 v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v r l =20 t ime (2 s/div.) figure 29. output fall characteristic time ( 1ms/div.) figure 30. inrush current r esponse c l =47 f c l =100 f c l =220 f (5v/div.) v en i out (0.2 a/div.) v /oc (5v/div.) v in =5v r l =20 time ( 2ms/div.) figure 3 1. over -c urrent r esponse ramp ed l oad v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v 1a/10ms 12 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical wave f orms - continued time ( 10ms/div.) figure 32. over -c urrent r esponse ramp ed l oad v /oc (5v/ div.) v out (5v/div.) i out (0.5a/div.) v in =5v 1a/50ms time ( 5ms/div.) figure 33. over -c urrent r esponse enable to short -c ircuit v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v time ( 5ms/div.) figure 34. over -current r esponse 1 l oad c onnected at en v /oc (5v/div.) v out (5v/div.) i out (1a/div.) v in =5v r l =1 time ( 10ms/div.) figure 35. uvlo r esponse i ncreasing v in v out (5v/div.) i out (0.2a/div.) v in (5v/div.) r l =20 13 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical wave forms - continued v in (5v/div.) v out (5v/div.) i out (0.2a/ div.) r l =20 time ( 10ms/div.) figure 36. uvlo r esponse d ecreasing v in 14 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet typical application circuit controller 10k ~ 100k c l c in v in gnd en(/en) vout /oc 5v (typ.) ferrite beads + - application information when excessive current flows due to output short circuit or so, ringi ng occurs because of inductance between power source line and ic. this may cause bad effects on ic operations. in order to avoid this case, connect a bypass capacitor across in terminal and gnd terminal of ic. 1f or higher is recommended. pull up /oc output by a resistance value of 10k to 1 00k. set up value which satisfies the application of either c l . this application circuit does not guarantee its operation. when using the circuit with changes to the external circuit constants, m ake sure to leave an adequate margin for external components including ac/dc characteristics as well as dispersion of the ic . functional description 1. switch operation in terminal and out terminal are connected to the drain and the source of swit ch mosfet respectively. the in terminal is also used as power source input to internal control circuit. when the switch is turned on from en, /en control input, the switch is bidirectional. in terminal and out terminal are connected by a 160m ( typ) switch. therefore, when the potential of out terminal is higher than that of in terminal, current flows from out terminal to in terminal. on the other hand, when the switch is turned off, it is poss ible to prevent current from flowing reversely from out to in since a parasitic di ode between the drain and the source of switch mosfet is not present, 2. thermal s hutdown c ircuit ( tsd) if over - current would continue, the temperature of the ic would increase drastically. if the junction tempera ture were beyond 1 70 c (t yp) during the condition of over - current detection, thermal shutdown circuit operates and turns power switch off and outputs a fault flag (/oc). then, when the junction temperature decreases lower than 1 50c (t yp), power switch is turned on and fault flag (/oc) is cancelled. unless the increase of the chips temperature is removed or the output of power switch is turned off, this operation repeats. note: the thermal shutdown circuit operates when the switch is on ( en, /en signal is active). 3. over -c urrent d etection ( ocd) the o ver -c urrent d etection circuit limits current (i sc ) and outputs a fault flag (/oc) when current flowing in each mosfet exceeds a specified value. there are three types of response against over -current. the over - current detection circuit works when the switch is on ( en, /en signal is active). (1) when the switch is turned on while the output is in short circuit status when the switch is turned on while the output is in short circuit status , the switch goes into curr ent limit status immediately. (2) when the output short circuits while the switch is on when the output short circuits or high - current load is connected while the switch is on, very large current fl ows until the over - current limit circuit reacts. when the curr ent detection and limit circuit works, current limitation is carried out. (3) when the output current increases gradually when the output current increases gradually, current limitation does no t work until the output current exceeds the over - current detection value. when it exceeds the detection value, current li mitation is carried out. 4. under v oltage l ockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v (typ). if v in drops below 2.2v(typ) while the switch is still on, the n uvlo will shut off the power switch. uvlo has a hysteresis of 100mv(typ) . note: under voltage lockout circuit works when the switch is on ( en, /en signal is active). 10k to 100k 5v(typ) in out 15 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet switch s tatus v in t /oc t /oc on off on output c urrent v tuvh v tuvl flag output v en 5. fault flag (/oc) output fault flag output is an nmos open drain output. at detectio n of over - current and/or thermal shutdown, the output level is low. o ver - current detection has delay filter . this delay filter prevents current detection flags from being sent during instantaneous events such as in rush current at switch on or during hot pl ug.. if fault flag output is unused, /oc pin should be connected to open or ground line. t /oc t /oc on off on output c urrent switch s tatus v en flag output figure 37. over -current s hutdown o peration (r eset at t oggle of en (bd2220g) figure 38. over -current s hutdown o peration ( r eset at uvlo operation ) (bd2220g) 16 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet power dissipation (ssop5 package) figure 39. power d issipation c urve (pd- ta c urve) i/o equivalen ce circuit symbol pin no. e quivalen ce c ircuit en (/en) 3 en (/en) out 5 vout /oc 4 /oc 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 a mbient tempera ture : ta [ ] power dissipation : pd [mw] 85 power dissipation : p d [m w ] ambient temperature ; ta[c] 70mm x 70mm x 1.6mm glass epoxy board out 17 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pins . 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and ana log blocks to prevent noise in the ground and supply lines of the digital block from affect ing the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, ev en during transient condition. 4. g round w iring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to av oid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of ex ternal components d o not cause variations on the ground voltage. the ground lines must be as short and thick as possibl e to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may re sult in deterioration of the properties of the chip. the absolute maximum rating of t he pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the bo ard size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guarant eed under the conditions of each parameter . 7. in r ush current when power is first supplied to the ic, it is possible that the inter nal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays , espec ially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the pr esence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely af ter each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic du ring assembly and use similar precautions during transport and storage. 10. inter- pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 18 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet operational notes - continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. t he gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused inpu t pins should be connected to the power supply or ground line. 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with t he n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 40. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine th e dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and oth ers. 14. thermal s hutdown circuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operat ion should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operat ion. note that the tsd circuit operates in a situation that exceeds the absol ute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking into account t he p ower dissipation (pd) in actual states of use. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements 19 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet ordering in formation marking diagram part number part number marking bd2220g dx bd2221g dy b d 2 2 2 0 g - t r part n umber package g: ssop5 packaging and forming specification tr : embossed tape and reel b d 2 2 2 1 g - t r part n umber package g: ssop5 packaging and forming specification tr : embossed tape and reel part number marking ssop5 (top view) lot number 20 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet physical dimension , tape and reel information package name ssop5 21 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2220g bd2221g data s heet revision history date revision changes 11 . mar .201 3 001 new release 25.jun.2013 002 modified y - axis of figure 4. changed character color from red to block of figure 16. 21.aug .201 4 003 applied the rohm standard style and improved understandability . 22 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300190 -1-2 21.aug.2014 rev.003 downloaded from: http:///
datasheet d a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or l iable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and c onfirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cl eaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, exp enses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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