View 74LVC1G17GS_9095666.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1. general description the 74lvc1g17 provides a buffer function with schmitt trigger input. it is capable of transforming slowly changing input signals into sharply defined outputs. the input can be driven from either 3.3 v or 5 v devices. this feature allows the use of this device in a mixed 3.3 v and 5 v environment. this device is fully specified for pa rtial power-down ap plications using i off . the i off circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. features and benefits ? wide supply voltage range from 1.65 v to 5.5 v ? high noise immunity ? complies with jedec standard ? jesd8-7 (1.65 v to 1.95 v) ? jesd8-5 (2.3 v to 2.7 v) ? jesd8b/jesd36 (2.7 v to 3.6 v) ? esd protection: ? hbm jesd22-a114f exceeds 2000 v ? mm jesd22-a115-a exceeds 200 v ? ? 24 ma output drive (v cc =3.0v) ? cmos low power consumption ? latch-up performance exceeds 250 ma ? direct interface with ttl levels ? unlimited rise and fall times ? inputs accept voltages up to 5 v ? multiple package options ? specified from ? 40 ? c to +85 ? c and from ? 40 ? c to +125 ? c 74lvc1g17 single schmitt trigger buffer rev. 10 ? 29 june 2012 product data sheet
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 2 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 3. ordering information 4. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. functional diagram table 1. ordering information type number package temperature range name description version 74lvc1g17gw ? 40 ? c to +125 ? c tssop5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 74lvc1g17gv ? 40 ? c to +125 ? c sc-74a plastic surface-mounted package; 5 leads sot753 74lvc1g17gm ? 40 ? c to +125 ? c xson6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 ? 1.45 ? 0.5 mm sot886 74lvc1g17gf ? 40 ? c to +125 ? c xson6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 ? 1 ? 0.5 mm sot891 74lvc1g17gn ? 40 ? c to +125 ? c xson6 extremely thin small outline package; no leads; 6 terminals; body 0.9 ? 1.0 ? 0.35 mm sot1115 74LVC1G17GS ? 40 ? c to +125 ? c xson6 extremely thin small outline package; no leads; 6 terminals; body 1.0 ? 1.0 ? 0.35 mm sot1202 74lvc1g17gx ? 40 ? c to +125 ? c x2son5 x2son5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 ? 0.8 ? 0.35 mm sot1226 table 2. marking codes type number marking [1] 74lvc1g17gw vj 74lvc1g17gv v17 74lvc1g17gm vj 74lvc1g17gf vj 74lvc1g17gn vj 74LVC1G17GS vj 74lvc1g17gx vj fig 1. logic symbol fig 2. iec logic symbol mnb150 ay 2 4 24 mnb151
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 3 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 6. pinning information 6.1 pinning 6.2 pin description fig 3. logic diagram mnb152 a y fig 4. pin configuration sot353-1 and sot753 fig 5. pin configuration sot886 74lvc1g17 n.c. v cc a gnd y 001aaf190 1 2 3 5 4 74lvc1g17 a 001aaf191 n.c. gnd n.c. v cc y transparent top view 2 3 1 5 4 6 fig 6. pin configuration sot891, sot1115 and sot1202 fig 7. pin configuration sot1226 (x2son5) 74lvc1g17 a 001aaf402 n.c. gnd n.c. v cc y transparent top view 2 3 1 5 4 6 n.c. v cc gnd 1 3 2 5 4 a y aaa-003025 transparent top view 74lvc1g17 table 3. pin description symbol pin description tssop5 and x2son5 xson6 n.c. 1 1, 5 not connected a 2 2 data input gnd 3 3 ground (0 v) y 4 4 data output v cc 5 6 supply voltage
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 4 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 7. functional description [1] h = high voltage level; l = low voltage level 8. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] when v cc = 0 v (power-down mode), the output voltage can be 5.5 v in normal operation. [3] for tssop5 and sc-74a packages: above 87.5 ? c the value of p tot derates linearly with 4.0 mw/k. for xson6 and x2son5 package: above 118 ? c the value of p tot derates linearly with 7.8 mw/k. 9. recommended operating conditions table 4. function table [1] input output a y ll hh table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +6.5 v i ik input clamping current v i < 0 v ? 50 - ma v i input voltage [1] ? 0.5 +6.5 v i ok output clamping current v o > v cc or v o < 0 v - ? 50 ma v o output voltage active mode [1] [2] ? 0.5 v cc + 0.5 v power-down mode [1] [2] ? 0.5 +6.5 v i o output current v o = 0 v to v cc - ? 50 ma i cc supply current - 100 ma i gnd ground current ? 100 - ma p tot total power dissipation t amb = ? 40 ? c to +125 ?c [3] - 250 mw t stg storage temperature ? 65 +150 ?c table 6. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 1.65 - 5.5 v v i input voltage 0 - 5.5 v v o output voltage active mode 0 - v cc v v cc = 0 v; power-down mode 0 - 5.5 v t amb ambient temperature ? 40 - +125 ?c
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 5 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 10. static characteristics table 7. static characteristics at recommended operating conditions. vo ltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ [1] max unit t amb = ? 40 ? c to +85 ?c v oh high-level output voltage v i = v t+ or v t ? i o = ? 100 ? a; v cc = 1.65 v to 5.5 v v cc ?? 0.1 - - v i o = ? 4 ma; v cc = 1.65 v 1.2 - - v i o = ? 8 ma; v cc = 2.3 v 1.9 - - v i o = ? 12 ma; v cc = 2.7 v 2.2 - - v i o = ? 24 ma; v cc = 3.0 v 2.3 - - v i o = ? 32 ma; v cc = 4.5 v 3.8 - - v v ol low-level output voltage v i = v t+ or v t ? i o = 100 ? a; v cc = 1.65 v to 5.5 v - - 0.1 v i o = 4 ma; v cc =1.65 v - - 0.45 v i o = 8 ma; v cc = 2.3 v - - 0.3 v i o = 12 ma; v cc = 2.7 v - - 0.4 v i o = 24 ma; v cc = 3.0 v - - 0.55 v i o = 32 ma; v cc = 4.5 v - - 0.55 v i i input leakage current v i = 5.5 v or gnd; v cc =0vto5.5v - ? 0.1 ? 5 ? a i off power-off leakage current v i or v o = 5.5 v; v cc =0 v - ? 0.1 ? 10 ? a i cc supply current v i = 5.5 v or gnd; v cc =1.65vto5.5v; i o =0a -0.110 ? a ? i cc additional supply current v i =v cc ? 0.6 v; i o =0a; v cc = 2.3 v to 5.5 v; per pin - 5 500 ? a c i input capacitance - 5 - pf t amb = ? 40 ? c to +125 ?c v oh high-level output voltage v i = v t+ or v t ? i o = ? 100 ? a; v cc = 1.65 v to 5.5 v v cc ?? 0.1 - - v i o = ? 4 ma; v cc = 1.65 v 0.95 - - v i o = ? 8 ma; v cc = 2.3 v 1.7 - - v i o = ? 12 ma; v cc = 2.7 v 1.9 - - v i o = ? 24 ma; v cc = 3.0 v 2.0 - - v i o = ? 32 ma; v cc = 4.5 v 3.4 - - v v ol low-level output voltage v i = v t+ or v t ? i o = 100 ? a; v cc = 1.65 v to 5.5 v - - 0.1 v i o = 4 ma; v cc =1.65 v - - 0.7 v i o = 8 ma; v cc = 2.3 v - - 0.45 v i o = 12 ma; v cc = 2.7 v - - 0.6 v i o = 24 ma; v cc = 3.0 v - - 0.80 v i o = 32 ma; v cc = 4.5 v - - 0.80 v i i input leakage current v i = 5.5 v or gnd; v cc =0vto5.5v - - ? 100 ? a
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 6 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer [1] all typical values are measured at maximum v cc and t amb = 25 ? c. [1] all typical values are measured at t amb = 25 ? c. i off power-off leakage current v i or v o = 5.5 v; v cc =0 v - - ? 200 ? a i cc supply current v i = 5.5 v or gnd; v cc =1.65vto5.5v; i o =0a - - 200 ? a ? i cc additional supply current per pin; v i =v cc ? 0.6 v; i o =0a; v cc = 2.3 v to 5.5 v --5000 ? a table 7. static characteristics ?continued at recommended operating conditions. vo ltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ [1] max unit table 8. transfer characteristics at recommended operating conditions. vo ltages are referenced to gnd (ground = 0 v). symbol parameter conditions ? 40 ? c to +85 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max v t+ positive-going threshold voltage see figure 8 and figure 9 v cc = 1.8 v 0.82 1.0 1.14 0.79 1.14 v v cc = 2.3 v 1.03 1.2 1.40 1.00 1.40 v v cc = 3.0 v 1.29 1.5 1.71 1.26 1.71 v v cc = 4.5 v 1.84 2.1 2.36 1.81 2.36 v v cc = 5.5 v 2.19 2.5 2.79 2.16 2.79 v v t ? negative-going threshold voltage see figure 8 and figure 9 v cc = 1.8 v 0.46 0.6 0.75 0.46 0.78 v v cc = 2.3 v 0.65 0.8 0.96 0.65 0.99 v v cc = 3.0 v 0.88 1.0 1.24 0.88 1.27 v v cc = 4.5 v 1.32 1.5 1.84 1.32 1.87 v v cc = 5.5 v 1.58 1.8 2.24 1.58 2.27 v v h hysteresis voltage see figure 8 , figure 9 and figure 10 v cc = 1.8 v 0.26 0.4 0.51 0.19 0.51 v v cc = 2.3 v 0.28 0.4 0.57 0.22 0.57 v v cc = 3.0 v 0.31 0.5 0.64 0.25 0.64 v v cc = 4.5 v 0.40 0.6 0.77 0.34 0.77 v v cc = 5.5 v 0.47 0.6 0.88 0.41 0.88 v
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 7 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 10.1 transfer characteristic waveforms fig 8. transfer characteristic fig 9. definitions of v t+ , v t ? and v h mnb154 v o v h v i v t+ v t? mnb155 v o v i v h v t+ v t? v cc = 3.0 v fig 10. typical transfer characteristics 03 v i (v) i cc (ma) 10 0 2 mna641 4 6 8 12
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 8 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 11. dynamic characteristics [1] typical values are measured at t amb =25 ? c and v cc = 1.8 v, 2.5 v, 2.7 v, 3.3 v and 5.0 v respectively. [2] t pd is the same as t plh and t phl . [3] c pd is used to determine the dynamic power dissipation (p d in ? w). p d =c pd ? v cc 2 ? f i ? n+ ? (c l ? v cc 2 ? f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; ? (c l ? v cc 2 ? f o ) = sum of outputs. 12. waveforms table 9. dynamic characteristics voltages are referenced to gnd (ground = 0 v). for test circuit see figure 12 . symbol parameter conditions ? 40 ? c to +85 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max t pd propagation delay a to y; see figure 11 [2] v cc = 1.65 v to 1.95 v 1.0 4.1 11.0 1.0 14.0 ns v cc = 2.3 v to 2.7 v 0.7 2.8 6.5 0.7 8.5 ns v cc = 2.7 v 0.7 3.2 6.5 0.7 8.5 ns v cc = 3.0 v to 3.6 v 0.7 3.0 5.5 0.7 7.0 ns v cc = 4.5 v to 5.5 v 0.7 2.2 5.0 0.7 6.5 ns c pd power dissipation capacitance v i = gnd to v cc ; v cc = 3.3 v [3] -16.6---pf measurement points are given in table 10 . v ol and v oh are typical output voltage levels that occur with the output load. fig 11. the input a to output y propagation delay times mnb153 t phl t plh v m v m a input y output gnd v i v oh v ol table 10. measurement points supply voltage input output v cc v m v m 1.65 v to 1.95 v 0.5 ? v cc 0.5 ? v cc 2.3 v to 2.7 v 0.5 ? v cc 0.5 ? v cc
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 9 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 13. application information 2.7v 1.5v 1.5v 3.0v to 3.6v 1.5v 1.5v 4.5 v to 5.5 v 0.5 ? v cc 0.5 ? v cc table 10. measurement points ?continued supply voltage input output v cc v m v m test data is given in table 11 . definitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 12. test circuit for measuring switching times v ext v cc v i v o mna616 dut c l r t r l r l g table 11. test data supply voltage input load v ext v cc v i t r =t f c l r l t plh , t phl 1.65 v to 1.95 v v cc ? 2.0ns 30pf 1k ? open 2.3 v to 2.7 v v cc ? 2.0ns 30pf 500 ? open 2.7v 2.7v ? 2.5ns 50pf 500 ? open 3.0v to 3.6v 2.7v ? 2.5ns 50pf 500 ? open 4.5 v to 5.5 v v cc ? 2.5ns 50pf 500 ? open
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 10 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer linear change of v i between 0.8 v to 2.0 v. (1) positive-going edge. (2) negative-going edge. fig 13. average supply current as a function of supply voltage 234 6 50 0 40 5 30 20 10 mnb156 i cc (ma) v cc (v) (1) (2)
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 11 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 14. package outline fig 14. package outline sot353-1 (tssop5) unit a 1 a max. a 2 a 3 b p lh e l p wy v ce d (1) e (1) z (1) references outline version european projection issue date iec jedec jeita mm 0.1 0 1.0 0.8 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 e 1 1.3 2.25 2.0 0.60 0.15 7 0 0.1 0.1 0.3 0.425 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.46 0.21 sot353-1 mo-203 sc-88a 00-09-01 03-02-19 w m b p d z e e 1 0.15 13 5 4 a a 2 a 1 l p (a 3 ) detail x l h e e c v m a x a y 1.5 3 mm 0 scale tssop5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 1.1
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 12 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer fig 15. package outline sot753 (sc-74a) references outline version european projection issue date iec jedec jeita sot753 sc-74a wb m b p d e a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 plastic surface-mounted package; 5 leads sot753 unit a 1 b p cd e h e l p qy wv mm 0.100 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 02-04-16 06-03-16
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 13 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer fig 16. package outline sot886 (xson6) references outline version european projection issue date iec jedec jeita sot886 mo-252 sot886_po 04-07-22 12-01-05 unit mm max nom min 0.5 0.04 1.50 1.45 1.40 1.05 1.00 0.95 0.35 0.30 0.27 0.40 0.35 0.32 0.6 a (1) dimensions (mm are the original dimensions) notes 1. including plating thickness. 2. can be visible in some manufacturing processes. xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm sot886 a 1 b 0.25 0.20 0.17 deee 1 0.5 ll 1 terminal 1 index area d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale 1 6 2 5 3 4 6x (2) 4x (2) a
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 14 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer fig 17. package outline sot891 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot891 sot891 05-04-06 07-05-15 xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale dimensions (mm are the original dimensions) unit mm 0.20 0.12 1.05 0.95 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.35 0.55 a max 0.5 0.04 1 6 2 5 3 4 a 6 (1) 4 (1) note 1. can be visible in some manufacturing processes.
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 15 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer fig 18. package outline sot1115 (xson6) references outline version european projection issue date iec jedec jeita sot1115 sot1115_po 10-04-02 10-04-07 unit mm max nom min 0.35 0.04 0.95 0.90 0.85 1.05 1.00 0.95 0.55 0.3 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. xson6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm sot1115 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area d e (4) (2) e 1 e 1 e l l 1 b 321 6 5 4 (6) (2) a 1 a
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 16 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer fig 19. package outline sot1202 (xson6) references outline version european projection issue date iec jedec jeita sot1202 sot1202_po 10-04-02 10-04-06 unit mm max nom min 0.35 0.04 1.05 1.00 0.95 1.05 1.00 0.95 0.55 0.35 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. xson6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm sot1202 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area d e (4) (2) e 1 e 1 e l b 123 l 1 6 5 4 (6) (2) a a 1
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 17 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer fig 20. package outline sot1226 (x2son5) references outline version european projection issue date iec jedec eiaj sot1226 sot1226_po 12-04-10 12-04-25 unit mm max nom min 0.35 0.85 0.80 0.75 0.04 0.30 0.25 0.20 0.85 0.80 0.75 0.27 0.22 0.17 0.05 a (1) dimensions note 1. dimension a is including plating thickness. 2. plastic or metal protrusions of 0.075 mm maximum per side are not included. sot1226 a 1 a 3 0.128 0.040 dd h ebe 0.48 klv 0.1 wy 0.05 0.05 scale 01 m m x terminal 1 index area d e a b detail x a a 1 a 3 c y c y 1 54 terminal 1 index area d h l b k e ac b v c w 2 1 0.20 0.27 0.22 0.17 y 1 x2son5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.35 mm 3
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 18 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 15. abbreviations 16. revision history table 12. abbreviations acronym description cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 13. revision history document id release date data sheet status change notice supersedes 74lvc1g17 v.10 20120629 product data sheet - 74lvc1g17 v.9 modifications: ? added type number 74lvc1g17gx (sot1226) ? package outline drawing of sot886 ( figure 16 ) modified. 74lvc1g17 v.9 20111206 product data sheet - 74lvc1g17 v.8 modifications: ? legal pages updated. 74lvc1g17 v.8 20110920 product data sheet - 74lvc1g17 v.7 74lvc1g17 v.7 20101110 product data sheet - 74lvc1g17 v.6 74lvc1g17 v.6 20070827 product data sheet - 74lvc1g17 v.5 74lvc1g17 v.5 20061006 product data sheet - 74lvc1g17 v.4 74lvc1g17 v.4 20041130 product specification - 74lvc1g17 v.3 74lvc1g17 v.3 20041018 product specification - 74lvc1g17 v.2 74lvc1g17 v.2 20040407 product specification - 74lvc1g17 v.1 74lvc1g17 v.1 20040324 product specification - -
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 19 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer 17. legal information 17.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 17.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 17.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
74lvc1g17 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 10 ? 29 june 2012 20 of 21 nxp semiconductors 74lvc1g17 single schmitt trigger buffer export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 17.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 18. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74lvc1g17 single schmitt trigger buffer ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 29 june 2012 document identifier: 74lvc1g17 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 19. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10.1 transfer characteristic waveforms . . . . . . . . . . 7 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 application information. . . . . . . . . . . . . . . . . . . 9 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 15 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16 revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 17 legal information. . . . . . . . . . . . . . . . . . . . . . . 19 17.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 17.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 17.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 17.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 18 contact information. . . . . . . . . . . . . . . . . . . . . 20 19 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

▲Up To Search▲

Price & Availability of 74LVC1G17GS

	To Download 74LVC1G17GS Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .