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copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 1 anpec reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. 3.5a-capable, slew-rate-controlled load switch with true reverse current blocking apl3222 the apl3222 advanced load management switch tar- gets applications requiring a highly integrated solution. it disconnects loads powered from the dc power rail (<6v) with stringent off-state current targets and high load ca- pacitances (up to 100 m f). the apl3222 consists of slew- rate controlled low-impedance mosfet switch (23m w typical) and integrated analog features. the slew-rate controlled turn-on characteristic prevents inrush current and the resulting excessive voltage droop on power rails. the apl3222 has a true reverse current blocking (trcb) function that obstructs unwanted reverse current from vout to vin during both on and off states. the exceptionally low off-state current drain (<1 m a maximum) facilitates compliance with standby power requirements. the input voltage range operates from 1.5v to 5.5v dc to support a wide range of applications in consumer, optical, medical, storage, portable, and industrial device power management. switch control is managed by a logic input (active high) capable of inter- facing directly with low-voltage control signal / general- purpose input / output (gpio) without an external pull- down resistor. the device is packaged in advanced, fully green compliant, 1.2mm x 0.8mm, wafer-level chip-scale pack- age (wlcsp) with backside lamination. features general description applications smart phones tablets pcs portable devices input voltage operating range:1.5v to 5.5v typical r ds(on) C 21m w at v in =5.5v C 23m w at v in =4.5v C 41m w at v in =1.8v C 90m w at v in =1.5v slew rate/inrush control with t r = 1.8ms(typ) 3.5a maximum continuous current capability low off switch current <1 m a true reverse current blocking(trcb) logic cmos io meets jesd76 standard for gpio interface and related power supply require- ments esd protected C human body model >8kv C charged device model >1.5kv C iec 61000-4-2 air discharge >15kv C iec 61000-4-2 contact discharge >8kv tiny small wlcsp1.2x0.8-6 and vtdfn1.6x1.2-4 package lead free and green devices available (rohs compliant) pin configuration wlcsp1.2x0.8-6 v out (a1) gnd (c1) on (c2) v out (b1) v in (b2) v in (a2) top view vtdfn-1.6x1.2 (top view) vin gnd vout on 1 4 3 2
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 2 apl3222 absolute maximum ratings (note 1) symbol parameter rating unit v in vin to gnd voltage -2 ~ 7 v v out vout to gnd voltage -2 ~ 7 v v on on to gnd voltage -2 ~ 7 v i sw maximum continuous switch current 0 ~ 3.5 a t j maximum junction temperature -40 ~ 150 o c t stg storage temperature -65 ~ 150 o c t sdr maximum lead soldering temperature (10 seconds) 260 o c ordering and marking information note : anpec lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with rohs. anpec lead-free products meet or exceed the lead-free requirements of ipc/jedec j-std-020d for msl classification at lead-free peak reflow temperature. anpec defines green to mean lead-free (rohs compliant) and halogen free (br or cl does not exceed 900ppm by weight in homogeneous material and total of br and cl does not exceed 1500ppm by weight). note1: stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. simplified application circuit v in 1 m f~22 m f 0.1 m f~100 m f c out c in 1.5~5.5v vin vout apl3222 on gnd on off v out package code operating junction temperature handling code assembly material g : halogen and lead free device temperature range package code apl3222 handling code assembly material tr : tape & reel ha : wlcsp1.2x0.8-6 apl3222 ha: x - date code i :- 40 to 85 c 2x apl3222 qf: x - date code l2 x qf : vtdfn1.6x1.2-4
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 3 apl3222 thermal characteristics note 2 : q ja is measured with the component mounted on a high effective thermal conductivity test board in free air. recommended operating conditions (note3) symbol parameter range unit v in vin input voltage 1.5 ~ 5.5 v i sw continuous switch current 0 ~ 3.5 a t a ambient temperature -40 ~ 85 o c t j junction temperature -40 ~ 125 o c note 3 : refer to the typical application circuit symbol parameter typical value unit q ja junction-to-ambient thermal resistance in free air (note 2) wlcsp1.2x0.8-6 vtdfn1.6x1.2-4 tbd 100 o c/w q jc junction-to-case thermal resistance in free air (note 2) wlcsp1.2x0.8-6 vtdfn1.6x1.2-4 tbd tbd o c/w electrical characteristics apl3222 symbol parameter test conditions min typ max unit basic operation v in input voltage 1.5 - 5.5 v i q(off) off supply current v on =gnd, v out =open - - 1 m a i sd shutdown current v on =gnd, v out =gnd,t a =-40 to +85 o c - 0.2 3.6 m a i q quiescent current i out =0ma - - 20 m a v in =5.5v, i out =3a - 22 - v in =5.5v, i out =2a - 21.5 - v in =5.5v, i out =1a, t a =25 o c - 21.0 28.0 v in =4.5v, i out =3a - 24.0 - v in =4.5v, i out =2a - 23.5 - v in =4.5v, i out =1a, t a =25 o c - 23.0 30.0 v in =3.3v, i out =500ma, t a =25 o c - 26.0 - v in =2.5v, i out =500ma, t a =25 o c - 30.0 - v in =1.8v, i out =250ma, t a =25 o c - 41.0 - r on on resistance v in =1.5v, i out =250ma, t a =25 o c - 90.0 110.0 m w v ih on input logic high voltage v in =1.5v to 5.5v 0.9 - - v v in =1.8v to 5.5v - - 0.55 v il on input logic low voltage v in =1.5v to 1.8v - - 0.26 v i on on input leakage v on = v in or gnd - - 4.3 m a r on_pd pull-down resistance at on pin v in = v on = 1.5v to 5.5v, t a =-40 to +85 o c 1.29 1.3 1.61 m w unless otherwise specified, these specifications apply over v in = 1.5~5.5v,t a = -40~85 o c. typical values are at t a =25 o c.
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 4 apl3222 electrical characteristics apl3222 symbol parameter test conditions min typ max unit true reverse current blocking v t_rcb rcb protection trip point v out - v in - 55 - mv v r_rcb rcb protection release trip point v in - v out - 30 - mv rcb hysteresis - 85 - mv i sd_out v out shutdown current v on = 0v, v out = 5.5v, v in = short to gnd - - 2 m a t rcb_on rcb response time, device on v out - v in =100mv, v on = high - 0.7 - m s t rcb_off rcb response time, device off v out - v in =100mv, v on = low - 0.7 - m s dynamic characteristics t on turn-on time v in =3.3v, r l =5 w , c l =150 m f, t a =25 o c 1 1.8 2.5 t doff turn-off delay - 2.5 - t f v out fall time - 34 - t off turn-off time v in =4.5v, r l =150 w , c l =100 m f, t a =25 o c - 36.5 - ms unless otherwise specified, these specifications apply over v in = 1.5~5.5v,t a = -40~85 o c. typical values are at t a =25 o c.
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 5 apl3222 typical operating characteristics quiescent current s u p p l y c u r r e n t ( m a ) t j ,junction temperature( o c) -40 20 40 0 on=v in 0 20 4 12 -20 v in =4.5v v in =1.5v v in =5.5v 8 16 60 80 quiescent current s u p p l y c u r r e n t ( m a ) supply voltage (v) 1 4 5 3 on=v in -40 o c 0 25 5 15 2 25 o c 85 o c 10 20 shutdown current v i n s h u t d o w n c u r r e n t ( m a ) 0 4 1 3 2 on=0v v in =1.5v v in =5.5v t j ,junction temperature( o c) -40 20 40 0 -20 60 80 -1 -2 shutdown current v i n s h u t d o w n c u r r e n t ( m a ) supply voltage (v) 1.5 4.5 5.5 3.5 2.5 0 4 1 3 2 on=0v -40 o c 25 o c 85 o c o n r e s i s t a n c e ( m w ) on resistance 0 40 60 80 20 on=v in v in =1.5v,i out =250ma v in =3.3v,i out =500ma v in =5.5v,i out =1a v in =1.8v,i out =250ma t j ,junction temperature( o c) -40 20 40 0 -20 60 80 o n r e s i s t a n c e ( m w ) on resistance supply voltage (v) 0 40 60 80 20 1.5 4.5 5.5 3.5 2.5 on=v in i out =250ma@v in =1.5~1.8v i out =500ma@v in =2.5~3.3v i out =1a@v in =4.0~5.5v -40 o c 25 o c 85 o c
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 6 apl3222 pin vtdfn1.6x1.2-4 wlcsp1.2x0.8-6 name function 4 a1,b1 v out switch output. 1 a2,b2 v in supply input: input to the power switch. 2 c1 gnd ground. 3 c2 on on/off control, active high, gpio compatible. pin description block diagram / typical application circuit v in v out on control logic gnd trcb ron esd protection turn-on slew rate controlled driver 1 m f~22 m f 0.1 m f~100 m f c out c in 1.5~5.5v on off
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 7 apl3222 the apl3222 is a low-ron p-channel load switch with controlled turn-on and true reverse current blocking (trcb). the core is a 23m w p-channel mosfet and controller capable of functioning over a wide input oper- ating range of 1.5 to 5.5v. the on pin, an active-high, gpio/cmos-compatible input; controls the state of the switch. trcb functionality blocks unwanted reverse cur- rent during both on and off states when higher vout than vin is applied. input capacitor to limit the voltage drop on the input supply caused by transient inrush current when the switch turns on into a discharged load capacitor; a capacitor must be placed between the vin and gnd pins. at least 1 m f ceramic capacitor, cin, placed close to the pins is usually sufficient. higher-value cin can be used to reduce the voltage drop in higher-current applications. where: cout: output capacitance; tr: slew rate or rise time at vout; vin: input voltage; vinitial: initial voltage at cout, usually gnd; and iload: load current. higher inrush current causes higher input voltage drop, depending on the distributed input resistance and input capacitance. high inrush current can cause problems. apl3222 has a 2.7ms of slew rate capability under 4.5vin at 1000 m f of cout and 5 w of rl so inrush cur- rent can be minimized and no input voltage drop appears. table 1 show the values and actual waveform with cin=10 m f, cout=100 m f, no load current. true reverse current blocking the true reverse current blocking feature protects the in- put source against current flow from output to input re- gardless of whether the load switch is on or off. output capacitor for best performance, all traces should be as short as possible. to be most effective, the input and output ca- pacitors should be placed close to the device to mini- mize the effect that parasitic trace inductance on normal and short-circuit operation. using wide traces or large copper planes for all pins (vin, vout, on, and gnd) minimizes the parasitic electrical effects and the case- to-ambient thermal impedance. application information inrush current inrush current occurs when the device is turned on. in- rush current is dependent on output capacitance and slew rate control capability, as expressed by: load r initial in out inrush i t v v c i + - = ..........(1) inrush current(ma) v in (v) t r (ms) measured calculated with 2.7ms t r 1.5 1.62 76 56 3.3 2.03 140 122 5.0 2.33 196 185 table1. inrush current by input voltage at least 0.1 m f capacitor, cout, should be placed be- tween the vout and gnd pins. this capacitor prevents parasitic board inductance from forcing vout below gnd when the switch is on. board layout
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 8 apl3222 package information wlcsp0.8x1.2-6 pin 1 d e aaa nx seating plane a a2 a1 c b e e 0.033 0.049 0.011 0.010 0.024 max. 0.009 0.29 0.26 0.23 aaa e e d b 0.76 1.16 0.030 0.046 0.08 0.40 bsc 0.84 1.24 0.003 0.0315 0.0472 0.0102 0.016 bsc millimeters s y m b o l a a1 0.15 min. 0.006 min. wlcsp0.8x1.2-6 0.50 0.20 typ 0.60 0.25 max. inches 0.0079 0.0197 typ. 0.40 0.016 1.20 0.80
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 9 apl3222 package information vtdfn1.2x1.6-4 e d pin 1 a b a1 a3 nx aaa c seating plane l pin 1 corner e s y m b o l min. max. 0.60 a a3 d e e millimeters vtdfn1.2x1.6-4a min. max. inches 0.024 0.50 0.020 0.50 bsc 0.020 bsc 1.55 1.65 0.061 0.065 1.15 1.25 0.045 0.049 l 0.25 0.35 0.010 0.014 a1 0.00 0.05 0.000 0.002 0.012 b 0.20 0.30 0.008 0.11 ref 0.004 ref aaa 0.08 0.003
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 10 apl3222 application a h t1 c d d w e1 f 178.0 2.00 50 min. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 min. 20.2 min. 8.0 0.20 1.75 0.10 3.50 0.05 p0 p1 p2 d0 d1 t a0 b0 k0 vtdfn1.6x1.2 4.0 0.10 4.0 0.10 2.0 0.05 1.5+0.10 -0.00 1.5 min. 0.6+0.00 -0.4 1.4 0.20 1.8 0.20 0.75 0.20 application a h t1 c d d w e1 f 178.0 2.00 50 min. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 min. 20.2 min. 8.0 0.30 1.75 0.10 3.5 0.05 p0 p1 p2 d0 d1 t a0 b0 k0 wlcsp1.2x0.8 4.0 0.10 4.0 0.10 2.0 0.05 1.5+0.10 -0.00 1.5 min. 0.6+0.00 -0.40 1.07 0.05 1.42 0.05 0.74 0.05 (mm) carrier tape & reel dimensions h t1 a d a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 devices per unit package type unit quantity vtdfn1.6x1.2 tape & reel 3000 wlcsp1.2x0.8 tape & reel 3000
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 11 apl3222 taping dircetion information wlcsp1.2x0.8-6 vtdfn1.2x1.6-4 user direction of feed user direction of feed
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 12 apl3222 classification profile
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 13 apl3222 profile feature sn-pb eutectic assembly pb-free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) (t s ) 100 c 150 c 60-120 seconds 150 c 200 c 60-120 seconds average ramp-up rate (t smax to t p ) 3 c/second max. 3 c/second max. liquidous temperature (t l ) time at liquidous (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak package body temperature (t p )* see classification temp in table 1 see classification temp in table 2 time (t p )** within 5 c of the specified classification temperature (t c ) 20** seconds 30** seconds average ramp-down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. classification reflow profiles table 1. snpb eutectic process C classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 220 c 3 2.5 mm 220 c 220 c table 2. pb-free process C classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350-2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm C 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c reliability test program test item method description solderability jesd-22, b102 5 sec, 245 c holt jesd-22, a108 1000 hrs, bias @ t j =125 c pct jesd-22, a102 168 hrs, 100 % rh, 2atm, 121 c tct jesd-22, a104 500 cycles, -65 c~150 c hbm mil-std-883-3015.7 vhbm R 2kv mm jesd-22, a115 vmm R 200v latch-up jesd 78 10ms, 1 tr R 100ma
copyright ? anpec electronics corp. rev. a.3 - dec., 2015 www.anpec.com.tw 14 apl3222 customer service anpec electronics corp. head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan tel : 886-3-5642000 fax : 886-3-5642050 taipei branch : 2f, no. 11, lane 218, sec 2 jhongsing rd., sindian city, taipei county 23146, taiwan tel : 886-2-2910-3838 fax : 886-2-2917-3838

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