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caution although this device is designed to be as robust as possible, esd (electrostatic discharge) can damage this device. this device must be protected at all times from esd. static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. industry-standard esd precautions must be employed at all times. rf front - end ic for bluetooth tm class 1 gaas hj - fet integrated circuit ? pg2253t6s document no. pg10761ej01v0ds (1st edition) date published april 2009 ns description the ? pg 2253 t6 s is a rf front-end integrated circuit for bluetooth class 1 and includes tx/bypass switch and a power amplifier with low-pass filter. and this device has no rf matching parts. this device realizes high efficiency and low harmonics by 3.0 v operation. this device is housed in a 16- pin plastic qfn (q uad f lat n on-l eaded) (t6s) package. and this package is able to high-density surface mounting by small external parts. features ? operati ng frequency : fopt = 2 40 0 to 2 50 0 mhz (2 45 0 mhz typ.) ? supply voltage : v dd 1, 2 , 3 = 3. 0 v typ. ? control voltage : v en = 3.0 v typ. ? circuit current : idd = 95 ma typ. @ pin = 0 dbm ? output power : p out = 19 dbm typ. @ pin = 0 dbm ? high efficiency : pae = 28 % typ. @ pin = 0 dbm ? high-density surface mounting : 16-pin plastic qf n package (t6s ) (3.0 ? 3.0 ? 0.75 mm) application ? front-end ic for bluetooth class 1, zigb ee tm etc. ordering information part number order number package marking supplying form ? pg 225 3 t6 s - e 2 ? pg 225 3 t6 s - e2 - a 1 6 - pin plastic qfn (t6 s ) (pb - free) g5 y ? embossed tape 8 mm wide ? pin 1 0 , 11, 12 face the perforation side of the tape ? qty 3 kpcs/reel remark to order evaluation samples, please contact your nearby sales office. part number for sample order: ? pg 2253 t6 s-a not recommended for new design
data sheet pg10761ej01v0ds 2 ? pin connections and internal block diagram pin no. pin name 1 gnd 2 n.c. 3 v en 4 n.c. 5 n.c. 6 rfin 7 n.c. 8 gnd 9 v d 1 10 v d 2 11 v d 3 (1) 12 v d 3 (2) 13 gnd 14 ant 15 v sw 1 16 v sw 2 remark exposed pad : gnd truth table v sw 1 v sw 2 tx path 3.0 v 0 v on off 0 v 3.0 v off on absolute maximum ratings (t a = +25 ? parameter symbol ratings unit supply voltage v dd 1, 2 , 3 5. 0 v control voltage v en 4.0 v switching voltage v sw 1, 2 5 .0 v input power p in + 5 dbm power dissipation p d 4 00 note mw operating ambient temperature t a ? 4 5 to +85 ? c storage temperature t stg ? 55 to +150 ? c note mounted on double-sided copper-clad 50 ? 50 ? 1.6 mm epoxy glass pwb, t a = +85 ? c. not recommended for new design
data sheet pg10761ej01v0ds 3 ? recommended operating range (t a = +25 ? parameter symbol min. typ. max. unit operating frequency f opt 2 40 0 2 45 0 2 50 0 mhz supply voltage v dd 1, 2 , 3 2.7 3. 0 3. 6 v switch control voltage (h) v sw 1, 2 1.8 3.0 3.6 v switch control voltage (l) v sw 1, 2 ? 0.2 0.0 0.2 v control voltage (h) v en 1.5 3.0 3.6 v control voltage (l) v en ? 0 0.2 v electrical characteristics (t a = +25 ? parameter symbol test conditions min. typ. max. uni t circuit current i dd p in = 0 dbm , v en = 3.0 v, v sw 1/ v sw 2 = 3.0 /0 v ? 95 12 0 ma sw current i sw rf off, v sw 1/ v sw 2 = 3.0/0 v ? 10 40 ? a shut down current i shut down p in = ? 30 dbm , v en = 0 v, v sw 1/ v sw 2 = 3.0/0 v ? 4 1 5 ? a output power p out p in = 0 dbm , v en = 3.0 v, v sw 1/ v sw 2 = 3.0/0 v 17.5 19 ? dbm power efficiency pae p in = 0 dbm , v en = 3.0 v, v sw 1/ v sw 2 = 3.0/0 v ? 28 ? % input return loss rl in p in = ? 30 dbm , v en = 3.0 v, v sw 1/ v sw 2 = 3.0/0 v ? ? 10 ? db output return loss rl out p in = ? 30 dbm , v en = 3.0 v, v sw 1/ v sw 2 = 3.0/0 v ? ? 8 ? db 2nd harmonics 2f 0 p in = 0 dbm , v en = 3.0 v, v sw 1/ v sw 2 = 3.0/0 v ? ? 25 ? db m 3rd harmonics 3f 0 p in = 0 dbm , v en = 3.0 v, v sw 1/ v sw 2 = 3.0/0 v ? ? 40 ? dbm insertion loss l ins p in = ? 30 dbm , v en = 0 v, v sw 1/ v sw 2 = 0/3.0 v ? 1.5 2.0 db not recommended for new design
data sheet pg10761ej01v0ds 4 ? evaluation circuit the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. not recommended for new design
data sheet pg10761ej01v0ds 5 ? typical characteristics (t a = +25 ? remark the graphs indicate nominal characteristics. not recommended for new design
data sheet pg10761ej01v0ds 6 ? tx mode s-parameters condition : t a = +25 ? c , v dd 1, 2 , 3 = 3.0 v , v en = 3.0 v , v sw 1/v sw 2 = 3.0 v/0 v , p in = ? 30 dbm remarks 1. the graphs indicate nominal characteristics. 2. marker1 : 2. 40 ghz marker2 : 2. 45 ghz marker3 : 2. 50 ghz marker4 : 4.90 ghz marker5 : 7.35 ghz not recommended for new design
data sheet pg10761ej01v0ds 7 ? path mode s-parameter condition : t a = +25 ? c , v dd 1, 2, 3 = 3.0 v, v en = 3.0 v, v sw 1/v sw 2 = 0 v/ 3. 0 v, p in = ? 30 dbm remarks 1. the graph indicates nominal characteristics. 2. marker1 : 2.40 ghz marker2 : 2.45 ghz marker3 : 2.50 ghz marker4 : 4.90 ghz marker5 : 7.35 ghz not recommended for new design
data sheet pg10761ej01v0ds 8 ? mounting pad layout dimensions 16-pin plastic qfn (unit: mm) remark the mounting pad layouts in this document are for reference only. when designing pcb, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. not recommended for new design
data sheet pg10761ej01v0ds 9 ? package dimensions 16-pin plastic qf n (t6s) (unit: mm) not recommended for new design
data sheet pg10761ej01v0ds 10 ? recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 ? c or below time at peak temperature : 10 seconds or less time at temperature of 220 ? c or higher : 60 seco nds or less preheating time at 120 to 180 ? c : 120 ? 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below ir260 partial heating peak temperature ( terminal temperature) : 350 ? c or below s oldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering methods together (except for partial heating). not recommended for new design
data sheet pg10761ej01v0ds 11 ? caution gaas products this produc t uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinances when disposing of the product. if there are no applicable laws and/or o rdinances, dispose of the product as recommended below. 1. commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from gen eral industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. ? do not burn, destroy, cut, crush, or chemically dissolve the product. ? do not lick the produ ct or in any way allow it to enter the mouth. not recommended for new design

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