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? semiconductor components industries, llc, 2012 november, 2018 ? rev. 13 1 publication order number: mc74vhc1g50/d mc74vhc1g50, mc74vhc1gt50 buffer the mc74vhc1g50 / mc74vhc1gt50 is an advanced high speed cmos buffer in tiny footprint packages. the mc74vhc1g50 has cmos level input thresholds while the mc74vhc1gt50 has ttl level input thresholds. the input structures provide protection when voltages up to 5.5 v are applied, regardless of the supply voltage. this allows the device to be used to interface 5 v circuits to 3 v circuits. the output structures also provide protection when v cc = 0 v and when the output voltage exceeds v cc . these input and output structures help prevent device destruction caused by supply voltage ? input/output voltage mismatch, battery backup, hot insertion, etc. features ? designed for 2.0 v to 5.5 v v cc operation ? 3.5 ns t pd at 5 v (typ) ? inputs/outputs over ? voltage tolerant up to 5.5 v ? i off supports partial power down protection ? source/sink 8 ma at 3.0 v ? available in sc ? 88a, sc ? 74a, tsop ? 5, sot ? 553, sot ? 953 and udfn6 packages ? chip complexity < 100 fets ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable ? these devices are pb ? free, halogen free/bfr free and are rohs compliant figure 1. logic symbol in a out y 1 see detailed ordering, marking and shipping information in the package dimensions section on page 7 of this data sheet. ordering information www. onsemi.com sc ? 88a df suffix case 419a sot ? 553 xv5 suffix case 463b xx m xx = specific device code m = date code* = pb ? free package xx m 1 5 xx m tsop ? 5 dt suffix case 483 1 5 (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location. udfn6 1.0 x 1.0 case 517bx x m 1 sot ? 953 p5 suffix case 527ae x m 1 xxx m sc ? 74a dbv suffix case 318bq xm udfn6 1.45 x 1.0 case 517aq 1 marking diagrams
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 2 figure 2. pinout (top view) v cc nc a y gnd 1 2 3 4 5 (sc ? 88a/sot ? 553/ tsop ? 5/ sc ? 74a) v cc nc a y gnd 1 2 3 5 4 sot ? 953 v cc nc a y gnd 1 2 3 5 4 6 nc udfn6 pin assignment (sc ? 88a/sot ? 553/ tsop ? 5/sc ? 74a) pin 1 2 3 4 5 function nc a gnd y v cc a input function table l h y output l h pin assignment (sot ? 953) pin 1 2 3 4 5 function a gnd nc y v cc pin assignment (udfn) pin 1 2 3 4 5 function nc a gnd y nc 6v cc
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 3 maximum ratings symbol characteristics value unit v cc dc supply voltage tsop ? 5, sc ? 88a (nlv) sc ? 74a, sc ? 88a, udfn6, sot ? 553, sot ? 953 ? 0.5 to +7.0 ? 0.5 to +6.5 v v in dc input voltage tsop ? 5, sc ? 88a (nlv) sc ? 74a, sc ? 88a, udfn6, sot ? 553, sot ? 953 ? 0.5 to +7.0 ? 0.5 to +6.5 v v out dc output voltage active ? mode (high or low state) tsop ? 5, sc ? 88a (nlv) tri ? state mode (note 1) power ? down mode (v cc = 0 v) ? 0.5 to v cc + 0.5 ? 0.5 to +7.0 ? 0.5 to +7.0 v dc output voltage active ? mode (high or low state) sc ? 74a, sc ? 88a, udfn6, sot ? 553, sot ? 953 tri ? state mode (note 1) power ? down mode (v cc = 0 v) ? 0.5 to v cc + 0.5 ? 0.5 to +6.5 ? 0.5 to +6.5 v i ik dc input diode current v in < gnd ? 20 ma i ok dc output diode current v out < gnd 20 ma i out dc output source/sink current 12.5 ma i cc or i gnd dc supply current per supply pin or ground pin 25 ma t stg storage temperature range ? 65 to +150 c t l lead temperature, 1 mm from case for 10 secs 260 c t j junction temperature under bias +150 c ja thermal resistance (note 2) sc ? 88a sc ? 74a tsop ? 5 sot ? 553 sot ? 953 udfn6 659 555 555 562 560 382 c/w p d power dissipation in still air sc ? 88a sc ? 74a tsop ? 5 sot ? 553 sot ? 953 udfn6 190 225 225 222 223 327 mw msl moisture sensitivity level 1 ? f r flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in ? v esd esd withstand voltage (note 3) human body model charged device model 2000 1000 v i latchup latchup performance (note 4) 100 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. applicable to devices with outputs that may be tri ? stated. 2. measured with minimum pad spacing on an fr4 board, using 10mm ? by ? 1inch, 2 ounce copper trace no air flow. 3. hbm tested to ansi/esda/jedec js ? 001 ? 2017. cdm tested to eia/jesd22 ? c101 ? f. jedec recommends that esd qualification to eia/jesd22 ? a115 ? a (machine model) be discontinued per jedec/jep172a. 4. tested to eia/jesd78 class ii.
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 4 recommended operating conditions symbol characteristics min max unit v cc positive dc supply voltage 2.0 5.5 v v in dc input voltage 0 5.5 v v out dc output voltage tsop ? 5, sc ? 88a (nlv) 0 v cc v dc output voltage sc ? 74a, sc ? 88a, udfn6, sot ? 553, sot ? 953 active ? mode (high or low state) tri ? state mode (note 1) power ? down mode (v cc = 0 v) 0 0 0 v cc 5.5 5.5 t a operating temperature range ? 55 +125 c t r , t f input rise and fall time tsop ? 5, sc ? 88a (nlv) v cc = 3.0 v to 3.6 v v cc = 4.5 v to 5.5 v 0 0 100 20 ns/v input rise and fall time sc ? 74a, sc ? 88a, udfn6, sot ? 553, sot ? 953 v cc = 1.65 v to 1.95 v v cc = 2.3 v to 2.7 v v cc = 3.0 v to 3.6 v v cc = 4.5 v to 5.5 v 0 0 0 0 20 20 10 5 functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. dc electrical characteristics (mc74vhc1g50) symbol parameter test conditions v cc (v) t a = 25 c ? 40 c t a 85 c ? 55 c t a 125 c unit min typ max min max min max v ih high ? level input voltage 2.0 1.5 ? ? 1.5 ? 1.5 ? v 3.0 2.1 ? ? 2.1 ? 2.1 ? 4.5 3.15 ? ? 3.15 ? 3.15 ? 5.5 3.85 ? ? 3.85 ? 3.85 ? v il low ? level input voltage 2.0 ? ? 0.5 ? 0.5 ? 0.5 v 3.0 ? ? 0.9 ? 0.9 ? 0.9 4.5 ? ? 1.35 ? 1.35 ? 1.35 5.5 ? ? 1.65 ? 1.65 ? 1.65 v oh high ? level output voltage v in = v ih or v il i oh = ? 50 a i oh = ? 50 a i oh = ? 50 a i oh = ? 4 ma i oh = ? 8 ma 2.0 3.0 4.5 3.0 4.5 1.9 2.9 4.4 2.58 3.94 2.0 3.0 4.5 ? ? ? ? ? ? ? 1.9 2.9 4.4 2.48 3.80 ? ? ? ? ? 1.9 2.9 4.4 2.34 3.66 ? ? ? ? ? v v ol low ? level output voltage v in = v ih or v il i ol = 50 a i ol = 50 a i ol = 50 a i ol = 4 ma i ol = 8 ma 2.0 3.0 4.5 3.0 4.5 ? ? ? ? ? 0.0 0.0 0.0 ? ? 0.1 0.1 0.1 0.36 0.36 ? ? ? ? ? 0.1 0.1 0.1 0.44 0.44 ? ? ? ? ? 0.1 0.1 0.1 0.52 0.52 v i in input leakage current v in = 5.5 v or gnd 1.65 to 5.5 ? ? 0.1* ? 1.0 ? 1.0 a i off power off leakage current v in = 5.5 v or v out = 5.5 v 0 ? ? 1.0 ? 10 ? 10 a i cc quiescent supply current v in = v cc or gnd 5.5 ? ? 1.0 ? 20 ? 40 a *guaranteed by design.
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 5 dc electrical characteristics (mc74vhc1gt50) symbol parameter test conditions v cc (v) t a = 25 c ? 40 c t a 85 c ? 55 c t a 125 c unit min typ max min max min max v ih high ? level input voltage 2.0 1.0 ? ? 1.0 ? 1.0 ? v 3.0 1.4 ? ? 1.4 ? 1.4 ? 4.5 2.0 ? ? 2.0 ? 2.0 ? 5.5 2.0 ? ? 2.0 ? 2.0 ? v il low ? level input voltage 2.0 ? ? 0.28 ? 0.28 ? 0.28 v 3.0 ? ? 0.45 ? 0.45 ? 0.45 4.5 ? ? 0.8 ? 0.8 ? 0.8 5.5 ? ? 0.8 ? 0.8 ? 0.8 v oh high ? level output voltage v in = v ih or v il i oh = ? 50 a i oh = ? 50 a i oh = ? 50 a i oh = ? 4 ma i oh = ? 8 ma 2.0 3.0 4.5 3.0 4.5 1.9 2.9 4.4 2.58 3.94 2.0 3.0 4.5 ? ? ? ? ? ? ? 1.9 2.9 4.4 2.48 3.80 ? ? ? ? ? 1.9 2.9 4.4 2.34 3.66 ? ? ? ? ? v v ol low ? level output voltage v in = v ih or v il i ol = 50 a i ol = 50 a i ol = 50 a i ol = 4 ma i ol = 8 ma 2.0 3.0 4.5 3.0 4.5 ? ? ? ? ? 0.0 0.0 0.0 ? ? 0.1 0.1 0.1 0.36 0.36 ? ? ? ? ? 0.1 0.1 0.1 0.44 0.44 ? ? ? ? ? 0.1 0.1 0.1 0.52 0.52 v i in input leakage cur- rent v in = 5.5 v or gnd 1.65 to 5.5 ? ? 0.1* ? 1.0 ? 1.0 a i off power off leakage current v in = 5.5 v or v out = 5.5 v 0 ? ? 1.0 ? 10 ? 10 a i cc quiescent supply current v in = v cc or gnd 5.5 ? ? 1.0 ? 20 ? 40 a i cct increase in quies- cent supply current per input pin one input: v in = 3.4 v; other input at v cc or gnd 5.5 ? ? 1.35 ? 1.5 ? 1.65 ma *guaranteed by design. ac electrical characteristics (input t r = t f = 3.0 ns) symbol parameter conditions v cc (v) t a = 25 c ? 40 c t a 85 c ? 55 c t a 125 c unit min typ max min max min max t plh , t phl propagation delay, a to y (figures 3 and 4) c l = 15 pf 3.0 to 3.6 ? 4.5 7.1 ? 8.5 ? 10.0 ns c l = 50 pf ? 6.4 10.6 ? 12.0 ? 14.5 c l = 15 pf 4.5 to 5.5 ? 3.5 5.5 ? 6.5 ? 8.0 c l = 50 pf ? 4.5 7.5 ? 8.5 ? 10.0 c in input capacitance ? 4.0 10 ? 10 ? 10 pf c out output capacitance output in high impedance state ? 6.0 ? ? ? ? ? pf c pd power dissipation capacitance (note 5) typical @ 25 c, v cc = 5.0 v pf 8.0 5. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no ? load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 6 figure 3. test circuit c l includes probe and jig capacitance r t is z out of pulse generator (typically 50 ) f = 1 mhz c l * r l output r t v cc dut gnd open test switch position c l , pf r l , t plh / t phl open see ac characteristics table x t plz / t pzl v cc 1 k t phz / t pzh gnd 1 k x = don?t care t r = 3 ns t pzh t phz t pzl t plz v mo v mo v mi figure 4. switching waveforms 90% 10% 90% 10% input output output ~0 v input output output t f = 3 ns v cc gnd v oh v ol v oh v ol v mo v mo v mi t phl t plh t plh t phl v mo v mo v mi v mi v cc gnd v ol v oh v oh ? v y v ol + v y ~v cc v cc , v v mi , v v mo , v v y , v t plh , t phl t pzl , t plz , t pzh , t phz 3.0 to 3.6 v cc /2 (v oh ? v ol )/2 v cc /2 0.3 4.5 to 5.5 v cc /2 (v oh ? v ol )/2 v cc /2 0.3
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 7 ordering information device packages specific device code pin 1 orientation (see below) shipping ? mc74vhc1g50dft1g sc ? 88a vr q2 3000 / tape & reel mc74vhc1g50dft2g sc ? 88a vr q4 3000 / tape & reel nlvvhc1g50dft2g* sc ? 88a vr q4 3000 / tape & reel m74vhc1gt50dft1g sc ? 88a vl q2 3000 / tape & reel m74vhc1gt50dft2g sc ? 88a vl q4 3000 / tape & reel nl17vhc1gt50df1g sc ? 88a hr q2 3000 / tape & reel nlvvhc1gt50dft2g* sc ? 88a vl q4 3000 / tape & reel nlvvhc1gt50dft1g* sc ? 88a vl q2 3000 / tape & reel mc74vhc1g50dbvt1g (in development) sc ? 74a tbd q4 3000 / tape & reel mc74vhc1gt50dbvt1g (in development) sc ? 74a tbd q4 3000 / tape & reel mc74vhc1g50dtt1g tsop ? 5 vr q4 3000 / tape & reel m74vhc1gt50dtt1g tsop ? 5 vl q4 3000 / tape & reel nlv74vhc1gt50dtt1g* tsop ? 5 vlr q4 3000 / tape & reel mc74vhc1g50xv5t2g (in development) sot ? 553 tbd q4 3000 / tape & reel mc74vhc1gt50xv5t2g (in development) sot ? 553 tbd q4 3000 / tape & reel mc74vhc1g50p5t5g (in development) sot ? 953 tbd q2 4000 / tape & reel mc74vhc1gt50p5t5g (in development) sot ? 953 tbd q2 4000 / tape & reel mc74vhc1g50mu1tcg (in development) udfn6, 1.45 x 1.0, 0.5p tbd q4 3000 / tape & reel MC74VHC1GT50MU1TCG (in development) udfn6, 1.45 x 1.0, 0.5p tbd q4 3000 / tape & reel mc74vhc1g50mu3tcg (in development) udfn6, 1.0 x 1.0, 0.35 tbd q4 3000 / tape & reel mc74vhc1gt50mu3tcg (in development) udfn6, 1.0 x 1.0, 0.35 tbd q4 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable. pin 1 orientation in tape and reel
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 8 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a ? 01 obsolete. new standard 419a ? 02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ? b ? sc ? 88a (sc ? 70 ? 5/sot ? 353) case 419a ? 02 issue l mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 solder footprint* *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 9 package dimensions sc ? 74a case 318bq issue b *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dim min max millimeters d e1 a 0.90 1.10 b 0.25 0.50 e 0.95 bsc a1 0.01 0.10 c 0.10 0.26 l 0.20 0.60 m 0 10 e 2.50 3.00 123 54 e d e1 b a c 0.20 5x c ab c seating plane l m detail a top view side view a b end view 1.35 1.65 2.85 3.15 2.40 0.70 5x dimensions: millimeters recommended 0.95 pitch 1.00 5x e a1 0.05 detail a
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 10 package dimensions tsop ? 5 case 483 ? 02 issue m 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimension a. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a b c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 m 0 10 s 2.50 3.00 123 54 s a g b d h c j 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 c seating plane 0.05 k m detail z detail z top view side view a b end view 1.35 1.65 2.85 3.15
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 11 package dimensions sot ? 553, 5 lead case 463b issue c 1.35 0.0531 0.5 0.0197 mm inches scale 20:1 0.5 0.0197 1.0 0.0394 0.45 0.0177 0.3 0.0118 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e m 0.08 (0.003) x b 5 pl a c ? x ? ? y ? notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. d e y 12 3 4 5 l h e dim a min nom max min millimeters 0.50 0.55 0.60 0.020 inches b 0.17 0.22 0.27 0.007 c d 1.55 1.60 1.65 0.061 e 1.15 1.20 1.25 0.045 e 0.50 bsc l 0.10 0.20 0.30 0.004 0.022 0.024 0.009 0.011 0.063 0.065 0.047 0.049 0.008 0.012 nom max 1.55 1.60 1.65 0.061 0.063 0.065 h e 0.08 0.13 0.18 0.003 0.005 0.007 0.020 bsc
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 12 package dimensions sot ? 953 case 527ae issue e *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e d c a h e 123 4 5 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of the base material. 4. dimensions d and e do not include mold flash, protrusions, or gate burrs. dim min nom max millimeters a 0.34 0.37 0.40 b 0.10 0.15 0.20 c 0.07 0.12 0.17 d 0.95 1.00 1.05 e 0.75 0.80 0.85 e 0.35 bsc l 0.95 1.00 1.05 h e x y pin one indicator b 5x x 0.08 y l 5x l3 l2 e 5x 5x l2 0.05 0.10 0.15 l3 ??? ??? 0.15 0.175 ref top view side view bottom view 1.20 dimensions: millimeters 0.20 5x 1 package outline 0.35 pitch 0.35 5x
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 13 package dimensions udfn6, 1.45x1.0, 0.5p case 517aq issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 6x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 b 0.20 0.30 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.30 0.40 l1 ??? 0.15 dimensions: millimeters 0.30 6x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint package outline l1 detail a l optional constructions l 0.07 ref 6x a2 detail b detail a
mc74vhc1g50, mc74vhc1gt50 www. onsemi.com 14 package dimensions case 517bx issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.20 mm from terminal tip. 4. package dimensions exclusive of burrs and mold flash. 6x 6x *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dimension: millimeters recommended l1 detail a l alternate terminal construction ?? 0.52 1.20 0.25 0.35 pitch package outline 1 dim min max millimeters a 0.50 0.65 a1 0.00 0.05 a3 0.13 ref b 0.17 0.23 d 1.00 bsc e 1.00 bsc e 0.35 l 0.20 0.40 l1 ??? 0.15 l3 l3 0.26 0.33 a b e d bottom view b e 6x l 6x note 3 0.08 c pin one reference top view 0.08 c a a1 0.05 c 0.05 c c seating plane side view 1 3 4 6 2x 2x a3 detail b a m 0.07 b c m 0.05 c detail a mc74vhc1g50/d on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative ?

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