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PCD6003 15ETL06S 501MF KP375 DG333ADW 895025 15ETL06S FF100
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  1 l ow capacitance e s d protection device t0534 v l c h i p i n t e g r a t i o n t e c h n o l o g y c o r p o r a t i o n features t ransient protect ion for high-speed data lines i e c 61000-4- 2 ( e s d ) 2 5 kv (air) 17kv ( contact) i e c 61000-4- 4 ( e f t ) 40a ( 5/50 ns) cable dischar ge event ( c d e ) s m all package (2.9 m m x 2.8mm x 1.4mm ) protects f our data lines low capacitance: 0. 6 pf t ypical (i/o- g n d ) low leakage c urrent: 0.1 ua @ v (t ypical) r w m low clam ping voltage each i/o pin can withstand over 1000 e s d strikes for 8kv contact dischar ge description t05 3 4 v l is an ultra-low capacitance t ransient v oltage suppressor ( t v s ) designed to provide electrostatic dischar ge ( e s d ) protection for high- speed data interfaces. w i th typical capacitance of 0. 5 pf only , t0534 v l is designed to protect parasitic - sensitive system against over -voltage and over -current transient events. it complies with i e c 61000-4-2( e s d ) ,level x (25kv air ,17kv contact dischar ge), i e c 61000-4- 4 ( electrical fast transient - e f t ) (40a,5/50ns) , very fast char ged divice model ( c d m ) e s d and cable dischar ge event ( e ),etc. lines. the com bi ned features o f low capacitance, sm all size a nd high e s d robustness m ake ideal for high-spee d data ports an d high-frequency line s (e.g., h d m i & d v i ) applica tions. the low clam ping voltage of the t0534 v l guarantees a minimum stress on the protected i c . applications serial a t a p c i express desktops, servers and notebooks mddi p or ts u s b 2.0/3.0 power and data line protection display ports mechanical characteristics s o t 23-6l package fla m m ability rating: u l 94v -0 marking : part number circuit diagram i/o_1 i/o_3 i/o_2 i/o_4 g n d v c c pin con?guration 1 2 3 4 5 6 s o t 23 -6l (t op v iew) t05 3 4 v l user s o t 23-6l package. each t05 3 4 v l device can protect four high-speed data t05 3 4 v l green part packaging: t ape and reel i/o_3 i/o_2 g n d v c c i/o_ 1 i/o_ 4 high de?nition multi-media int er face (hdmi) d igital visual int er faces (dvi) d o c u m e n t i d : d s - 2 2 v 2 1 r e v i s e d d a t e : 2 0 1 7 / 0 7 / 2 0 r e v i s i o n : c
2 c h i p i n t e g r a t i o n t e c h n o l o g y c o r p o r a t i o n l ow capacitance e s d protection device absolute maximum rating symbol parameter value units v esd esd per iec 61000-4-2 (air) esd per iec 61000-4-2 (contact) 25 17 kv t opt operating temperature - 55/+125 o c t stg storage temperature - 55/+15 0 c electrical characteristics (t = 25 c) symbol parameter v rwm nominal reverse working voltage i r reverse leakage current @v rwm v br reverse breakdown voltage @i t i t test current for reverse breakdown v c clamping voltage @ i pp i pp maximum peak pulse current c esd parasitic capacitance v r reverse voltage f small signal frequency i f forward current v f forward voltage @i f symbol test condition minimum typical maximum units v rwm 5.0 v i r v = 5v,t = 25 rwm c between i/o and gnd 0.1 1.0 a v br i t = 1 ma between i/o and gnd 6 .0 8 .0 1 0.0 v v c i pp = 1a, t p = 8/20s between i/o and gnd 12 v c esd v r = 0v, f = 1mhz between i/o and gnd pf c esd v r = 0v, f = 1mhz between i/o and i/o pf 0. 8 0. 08 0. 0 5 0. 6 o o i f v f i r i t i pp v f v br v rwm current uni - directional tvs i p p peak pulse current ( tp = 8 / 20us )( i / o pins ) 4 .5 a t0534 v l t ls t lead soldering temperature 260 c o d o c u m e n t i d : d s - 2 2 v 2 1 r e v i s e d d a t e : 2 0 1 7 / 0 7 / 2 0 r e v i s i o n : c
3 v olt age sweeping of i/o to g n d - 0.12 - 0.10 - 0.08 - 0.06 - 0.04 - 0.02 0.00 0.02 0.04 0.06 0.08 0.10 0.12 - 2 - 1 0 1 2 3 4 5 6 7 8 9 v o l t a g e ( v ) c u r r e n t ( a ) insertion loss s21 of i/o to g n d - 30.0 - 25.0 - 20.0 - 15.0 - 10.0 - 5.0 0.0 5.0 1.0e +06 1.0e +07 1.0e +08 1.0e +09 1.0e +10 f re q u e n c y (hz ) in s e rti o n l o s s (d b) cap acit ance vs. v olt age of i/o to g n d (f = 1 m h z) cap acit anc e vs. reverse v olt a ge 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 1 2 3 4 5 r e v e r s e v o l t a g e ( v ) c a p a c i t a n c e ( p f ) e s d clamping of i/o to g n d (+8kv cont act per i e c 61000-4-2) - 20.0 - 10.0 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 - 50 0 50 100 150 200 t i m e ( n s ) c l a mp i n g v o l t a g e ( v ) . normalized cap acit ance vs. re verse v olt a ge 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 0 1 2 3 4 5 r e v e r s e v o l t a g e ( v ) n o r m a l i z e d c a p a c i t a n c e e s d clamping of i/o to g n d (-8kv cont act per i e c 61000-4- 2) - 70.0 - 60.0 - 50.0 - 40.0 - 30.0 - 20.0 - 10.0 0.0 10.0 20.0 - 50 0 50 100 150 200 t i m e ( n s ) c l a mp i n g v o l t a g e ( v ) . c h i p i n t e g r a t i o n t e c h n o l o g y c o r p o r a t i o n l ow capacitance e s d protection device t0534 v l d o c u m e n t i d : d s - 2 2 v 2 1 r e v i s e d d a t e : 2 0 1 7 / 0 7 / 2 0 r e v i s i o n : c
4 application information pin connection in p c b t 0534 v l is capable to provide e s d protection for four data lines si m ultaneously . the pin connection is shown in figure 1. four parallel data lines, fro m inner i c to i/o port connector , could connect to four i/o pins directly . p i n 2 of is the negative reference pin, which should connect to the g n d of p c b . the connection w ires should be as short as possible in order to m ini m ize the par asitic inductance. i/o1 i/o2 g n d t o inner i c v c c 1 2 3 4 5 6 t o connector i/o3 i/o4 t o inner i c t o connector figure 1 t05 3 4 v l p in conn ection in p c b p c b lay o ut guidelines for optim u m e s d protection and the whole circuit perfor m ance, the following p c b layo ut guidelines are recom m ended: g n d pin to the p c b g n d rail path should be as s hort as possible. it could reduce the e s d transient return path to g n d . the vias c onnecting v c c & g n d pins to the p c b v c c & g n d should be wide. place as close to the connector port as possible. it could reduce the parasitic inductance and restrict e s d coupling into adjacen t traces. a void running critical signals near board edges. figure 2 t05 3 4 v l layout guideline universal serial bus e s d protection u s b controller v b u s v b u s d+ d- g n d v b u s d+ d- g n d u s b port1 u s b port2 r t r t r t r t c t c t c t c t g n d 1 2 3 4 5 6 t05 3 4 v l t05 3 4 v l t05 3 4 v l t05 3 4 v l t05 3 4 v l t05 3 4 v l c h i p i n t e g r a t i o n t e c h n o l o g y c o r p o r a t i o n l ow capacitance e s d protection device t0534 v l d o c u m e n t i d : d s - 2 2 v 2 1 r e v i s e d d a t e : 2 0 1 7 / 0 7 / 2 0 r e v i s i o n : c
5 c h i p i n t e g r a t i o n t e c h n o l o g y c o r p o r a t i o n l ow capacitance e s d protection device application information tmds_d 2+ tmds_d2- tmds_d1+ tmds_d1- tmds_d0+ tmds_d0- tmds_clk+ tmds_clk- cec cec nc ddc_clk ddc_dat gnd +5v hotplug_det tmds_d2+ tmds_d2- tmds_d1+ tmds_d1- tmds_d0+ tmds_d0- tmds_clk+ tmds_clk- hdmi receiver hdmi connector 1 2 3 5 4 6 1 2 3 5 4 6 layout top v ie w for hd mi in terface with T0534VL t0534 v l t0534 v l t0534 v l d o c u m e n t i d : d s - 2 2 v 2 1 r e v i s e d d a t e : 2 0 1 7 / 0 7 / 2 0 r e v i s i o n : c
6 package outline s o t 23 - 6l package d e1 e e1 e ddd m c a -b a a2 a1 ccc c s e e v i e w a-a a4 a3 l l1 l2 v i e w a-a g a u g e p l a n e aaa c a-b 1 b b s e c t i o n b-b b1 b c1 c n x b d bbb c a b d s e a t i n g p l a n e c b a s e m e t a l package dim ensions (controlling dim ensions are in m illi m eters) s y mbol dimensions (mm) dimensions (inches) minimum t ypical maximum minimum t ypical maximum a 1.450 --- --- 0.057 a1 0.000 --- 0.150 0.000 --- 0.006 a2 0.900 1.200 1.300 0.035 0.047 0.012 a3 0.637 0.787 0.837 0.025 0.031 0.033 a4 0.263 0.413 0.463 0.010 0.016 0.018 b 0.300 --- 0.500 0.012 --- 0.020 b1 0.300 0.400 0.450 0.012 0.016 0.018 c 0.080 --- 0.220 0.003 --- 0.009 c1 0.080 0.130 0.200 0.003 0.005 0.008 d 2.90 b s c 0.1 14 b s c e 0.95 b s c 0.037 b s c e1 1.90 b s c 0.075 b s c e 2.80 b s c 0.1 10 b s c e1 1.60 b s c 0.063 b s c l 0.300 0.450 0.600 0.012 0.018 0.024 l1 0.600 r e f 0.024 r e f l2 0.250 b s c 0.010 b s c 0 4 8 0 4 8 1 5 10 15 5 10 15 aaa 0.150 0.006 bbb 0.200 0.008 ccc 0.100 0.004 ddd 0.100 0.004 o o o o o o o o o o o o c h i p i n t e g r a t i o n t e c h n o l o g y c o r p o r a t i o n l ow capacitance e s d protection device t0534 v l d o c u m e n t i d : d s - 2 2 v 2 1 r e v i s e d d a t e : 2 0 1 7 / 0 7 / 2 0 r e v i s i o n : c
7 t ape and reel s peci?catio n w p p0 p2 2: 1.500.1 e f a0 b0 k0 t t op cover t ape 5 max pin1 location device orientation in t ape : 1.00.1 s y mbol w a 0 b0 k0 e f p p 0 p2 t dimensions (mm) 8.00+0.3 -0.1 3.230.05 3.17 0.05 1.370.05 1.750.1 3.50.05 4.00.1 4.00.1 2 .00.05 0 .250.02 r w1 w m n s h k s y mbol reel size m n w w 1 h s k r dimensions (mm) 178 178.01.0 60.01.0 1 1.50.5 9.00.5 13.00.5 2.00.1 1 1.00.2 1.00.05 c h i p i n t e g r a t i o n t e c h n o l o g y c o r p o r a t i o n l ow capacitance e s d protection device t0534 v l d o c u m e n t i d : d s - 2 2 v 2 1 r e v i s e d d a t e : 2 0 1 7 / 0 7 / 2 0 r e v i s i o n : c
8 marking codes y y w w 1 2 3 4 5 6 note: (1) " 54v " is part number , ?xed . (2) " y y w w " is date code . " y " is the assembly year in a year . ordering information part nu m ber w orking quantity per reel reel size 5 v 3,000 7 inch footprint: s o t 23 -6l a b c d e f s y mbol dimensions millimeters inches a 0.60 0.024 b 1.10 0.043 c 0.95 0.037 d 1.40 0.055 e 2.50 0.098 f 3.60 0.141 t05 3 4 v l ( 2015 is " 15 " ); while " w w " is the assembly week c h i p i n t e g r a t i o n t e c h n o l o g y c o r p o r a t i o n v oltage l ow capacitance e s d protection device 1 2 3 4 5 6 note: (1) " 54v " is part number , ?xed . (2) " x x x " is the last 3 characters of the wafer s lot no., " y " is the internal code . or 54v x x x y 54v t0534 v l d o c u m e n t i d : d s - 2 2 v 2 1 r e v i s e d d a t e : 2 0 1 7 / 0 7 / 2 0 r e v i s i o n : c
h t t p : / / w w w. c i t c o r p . c o m . t w / t e l : 8 8 6 - 3 - 5 6 0 0 6 2 8 f a x : 8 8 6 - 3 - 5 6 0 0 6 3 6 a d d : r m . 3 , 2 f . , n o . 3 2 , t a i y u a n s t . , z h u b e i c i t y , h s i n c h u c o u n t y 3 0 2 , t a i w a n ( r . o . c . ) c i t c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o t h i s d o c u m e n t a n d i t s p r o d u c t s a n d s p e c i ? c a t i o n s a t a n y t i m e w i t h o u t n o t i c e . c u s t o m e r s s h o u l d o b t a i n a n d c o n ? r m t h e l a t e s t p r o d u c t i n f o r m a t i o n a n d s p e c i ? c a t i o n s b e f o r e ? n a l d e s i g n , p u r c h a s e o r u s e . c i t c m a k e s n o w a r r a n t y , r e p r e s e n t a t i o n o r g u a r a n t e e r e g a r d i n g t h e s u i t a b i l i t y o f i t s p r o d u c t s f o r a n y p a r t i c u l a r p u r p o s e , n o r d o e s c i t c a s s u m e a n y l i a b i l i t y f o r a p p l i c a t i o n a s s i s t a n c e o r c u s t o m e r p r o d u c t d e s i g n . c i t c d o e s n o t w a r r a n t o r a c c e p t a n y l i a b i l i t y w i t h p r o d u c t s w h i c h a r e p u r c h a s e d o r u s e d f o r a n y u n i n t e n d e d o r u n a u t h o r i z e d a p p l i c a t i o n . n o l i c e n s e i s g r a n t e d b y i m p l i c a t i o n o r o t h e r w i s e u n d e r a n y i n t e l l e c t u a l p r o p e r t y r i g h t s o f c i t c . c i t c p r o d u c t s a r e n o t a u t h o r i z e d f o r u s e a s c r i t i c a l c o m p o n e n t s i n l i f e s u p p o r t d e v i c e s o r s y s t e m s w i t h o u t e x p r e s s w r i t t e n a p p r o v a l o f c i t c . 9 c h i p i n t e g r a t i o n t e c h n o l o g y c o r p o r a t i o n l ow capacitance e s d protection device t0534 v l d o c u m e n t i d : d s - 2 2 v 2 1 r e v i s e d d a t e : 2 0 1 7 / 0 7 / 2 0 r e v i s i o n : c


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