cystech electronics corp. spec. no. : c065sp issued date : 2017.09.28 revised date : 2017.09.29 page no. : 1/7 DIS0365SP preliminary cystek product specification switching control diode DIS0365SP features ? high current capability ? smoothly soft reverse recovery time (trr) ? low profile surface mounted package in order to minimize board space ? pb-free lead plating and halogen-free package mechanical data ? case : to-277 molded plastic ? epoxy : ul94-v0 rated flame retardant ? terminals : plated terminals, solderable per mil-std-202 method 208 ? weight : approx. 0.093 gram symbol outline DIS0365SP 2 3 1 2 3 1 cathode cathode anode cathode cathode anode to-277 ordering information device package shipping DIS0365SP-65-td-g to-277 (pb-free lead plating and halogen-free package) 5000 pcs / tape & reel environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, td : 5000 pcs / tape & reel, 13? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c065sp issued date : 2017.09.28 revised date : 2017.09.29 page no. : 2/7 DIS0365SP preliminary cystek product specification absolute maximum ratings (t a =25 , unless otherwise noted) parameters conditions symbol value units repetitive peak reverse voltage v rrm 650 v rms voltage v rms 455 v continuous reverse voltage v r 650 v forward rectified current single phase half wave, 60hz @t j =25 c i f(av) 3 a repetitive peak forward current single phase half wave, 60hz @tj=25 c i frm 4.7 a forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 52 a maximum reverse recovery time i f =1a, di f /dt=100a/ s trr 1 s storage temperature range tstg -55~+150 c operating junction temperature range tj -55~+150 c thermal data parameter symbol value unit thermal resistance, junction-to-case, max r th,j-c 6.5 thermal resistance, junction-to-ambient, max (note 1 ) 39 thermal resistance, junction-to-ambient, max (note 2 ) 75 thermal resistance, junction-to-ambient, max (note 3) r th,j-a 169 c/w power dissipation @ t c =25 c 19 power dissipation @ t a =25 c (note 1 ) 3.2 power dissipation @ t a =25 c (note 2 ) 1.7 power dissipation @ t a =25 c (note 3 ) p d 0.74 w note: 1. device mounted on fr-4 pcb, single sided 2 oz. copper, pad dimension 50mm 50mm. 2. device mounted on fr-4 pcb, single sided 1 oz. copper, pad dimension 25mm 25mm. 3. device mounted on fr-4 pcb, single sided 1 oz. copper, minimum recommended pad dimension. characteristics (t a =25 c, unless otherwise noted) characteristic symbol condition min. typ max. unit continuous reverse voltage v r i r =100 a 650 - - v v f 1 i f =1a - - 1.1 forward voltage v f 2 i f =3a - - 1.2 v v r =540v - - 100 na reverse leakage current i r v r =540v, t a =125c - - 10 a junction capacitance c j v r =1v, f=1mhz - 53 - pf
cystech electronics corp. spec. no. : c065sp issued date : 2017.09.28 revised date : 2017.09.29 page no. : 3/7 DIS0365SP preliminary cystek product specification typical characteristics power derating curve 0 0.5 1 1.5 2 2.5 3 3.5 0 25 50 75 100 125 150 175 ambient temperature---t a () power dissipation(w) s ee note1 on page 2 s ee note 2 on page 2 s ee note 3 on p a g e 2 power derating curve 0 2 4 6 8 10 12 14 16 18 20 0 25 50 75 100 125 150 175 case temperature---t c ) power dissipation(w) forward current vs forward voltage 1 10 100 1000 10000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300 s, 1% duty cycle 0 150 -40c 25c 12 5 75c reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 1000 10000 0 50 100 150 200 250 300 350 400 450 500 550 600 650 reverse voltage---v r (v) reverse leakage current---i r (na) tj=75 tj=25 tj=150 tj=-40c tj=0c tj=125c junction capacitance vs reverse voltage 1 10 100 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz
cystech electronics corp. spec. no. : c065sp issued date : 2017.09.28 revised date : 2017.09.29 page no. : 4/7 DIS0365SP preliminary cystek product specification recommended soldering footprint
cystech electronics corp. spec. no. : c065sp issued date : 2017.09.28 revised date : 2017.09.29 page no. : 5/7 DIS0365SP preliminary cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c065sp issued date : 2017.09.28 revised date : 2017.09.29 page no. : 6/7 DIS0365SP preliminary cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note :1. all temperatures refer to topside of the package, measured on the package body surface. 2.for devices mounted on fr-4 pcb of 1.6mm or equivalent grade pcb. if other grade pcb is used, care should be taken to match the coeffici ents of thermal expansion between components and pcb. if they are not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the assembly cools.
cystech electronics corp. spec. no. : c065sp issued date : 2017.09.28 revised date : 2017.09.29 page no. : 7/7 DIS0365SP preliminary cystek product specification to-277 dimension marking: cathode dis 0365 date code anode cathode to-277 plastic surface mounted package cystek package code: sp millimeters inches millimeters inches dim min. max. min. max. dim min. max. min. max. a 1.05 1.15 0.041 0.045 d2 2.95 3.15 0.116 0.124 b1 0.80 0.99 0.031 0.039 e 6.40 6.60 0.252 0.260 b2 1.70 1.88 0.067 0.074 e1 5.30 5.45 0.209 0.215 b3 0.15 0.35 0.006 0.014 e2 3.45 3.65 0.136 0.144 c 0.20 0.33 0.008 0.013 e3 4.20 4.60 0.165 0.181 d 4.00 4.30 0.157 0.169 e 1.84 typ 0.072 typ d1 3.90 4.05 0.154 0.159 l 0.75 0.95 0.030 0.037 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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